Indenture Agreements in the Electronic Equipment, Instruments & Components Industry

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First Supplemental Indenture, dated as of September 17, 2021, between PAR Technology Corporation and The Bank of New York Mellon Trust Company, N.A., as Trustee
Indenture Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2021
First Supplemental Indenture, dated as of October 29, 2024, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A. as Trustee
Indenture Agreements
Vishay Intertechnology Inc
Electronic Equipment, Instruments & Components
2024
Second Supplemental Indenture, dated as of October 29, 2024, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A., as Trustee
Indenture Agreements
Vishay Intertechnology Inc
Electronic Equipment, Instruments & Components
2024
Officers' Certificate, dated October 31, 2024, establishing the 2035 Notes and the 2054 Notes pursuant to the Indenture
Indenture Agreements
Amphenol Corp
Electronic Equipment, Instruments & Components
2024
First Supplemental Indenture, dated as of October 9, 2024, between Keysight Technologies, Inc. and US. Bank Trust Company, National Association, as trustee
Indenture Agreements
Keysight Technologies, Inc
Electronic Equipment, Instruments & Components
NY
2024
Indenture, dated as of October 9, 2024, between Keysight Technologies, Inc. and U.S. Bank Trust Company, National Association, as trustee
Indenture Agreements
Keysight Technologies, Inc
Electronic Equipment, Instruments & Components
NY
2024
Nineteenth Supplemental Indenture, dated as of August 22, 2024, by and among the Co-Issuers, the Guarantors (including the Company) and the Trustee
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
DE
2024
Eighteenth Supplemental Indenture, dated as of August 22, 2024, by and among the Co-Issuers, the Guarantors (including the Company) and the Trustee
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
DE
2024
Sixth Supplemental Indenture, dated as of August 21, 2024, by and between the Company and U.S. Bank Trust Company, National Association, as trustee
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2024
Second Supplemental Indenture, dated as of August 21, 2024, by and between the Company and U.S. Bank Trust Company, National Association, as trustee
Indenture Agreements
Arrow Electronics
Electronic Equipment, Instruments & Components
NY
2024
Twentieth Supplemental Indenture, dated as of August 2, 2024, among Tyco Electronics Group S.A., as issuer, TE Connectivity Ltd., as guarantor, and Deutsche Bank Trust Company...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2024
Indenture, dated as of July 19, 2024, between OSI Systems, Inc. and U.S. Bank Trust Company, National Association, as trustee
Indenture Agreements
OSI Systems, Inc.
Electronic Equipment, Instruments & Components
DE
2024
Indenture, dated as of June 21, 2024, by and between Itron, Inc. and U.S. Bank Trust Company, National Association, as trustee
Indenture Agreements
Itron, Inc.
Electronic Equipment, Instruments & Components
WA
2024
Fifth Supplemental Indenture, dated as of April 12, 2024, by and between TD SYNNEX Corporation and Citibank, N.A., as trustee
Indenture Agreements
SYNNEX Corporation
Electronic Equipment, Instruments & Components
2024
First Supplemental Indenture, dated as of April 10, 2024, by and between the Company and U.S. Bank Trust Company, National Association, as trustee
Indenture Agreements
Arrow Electronics
Electronic Equipment, Instruments & Components
NY
2024
Officers Certificate, dated April 5, 2024, establishing each series of the Notes pursuant to the Indenture
Indenture Agreements
Amphenol Corp
Electronic Equipment, Instruments & Components
2024
Indenture, dated as of September 12, 2023, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, National Association, as Trustee
Indenture Agreements
Vishay Intertechnology Inc
Electronic Equipment, Instruments & Components
NY
2023
Third Supplemental Indenture, dated as of May 31, 2023, among Coherent Corp., the guarantors party thereto and U.S. Bank National Association, as Trustee
Indenture Agreements
II-VI Incorporated
Electronic Equipment, Instruments & Components
NY
2023
First Supplemental Indenture, dated as of July 1, 2022, among Coherent Corp., the guarantors party thereto and U.S. Bank National Association, as Trustee
Indenture Agreements
II-VI Incorporated
Electronic Equipment, Instruments & Components
NY
2023
Officers Certificate of the Company, dated May 15, 2023, pursuant to Sections 201 and 301 of the Indenture dated as of November 8, 2000, between the Company and The Bank of New...
Indenture Agreements
Corning Inc.
Electronic Equipment, Instruments & Components
2023
Second Supplemental Indenture, dated as of May 5, 2023, by and among Coherent Corp., Coherent NA, Inc. and U.S. Bank Trust Company, National Association
Indenture Agreements
II-VI Incorporated
Electronic Equipment, Instruments & Components
NY
2023
Fifth Supplemental Indenture, dated as of March 1, 2023, by and between the Company and U.S. Bank Trust Company, National Association, as Trustee
Indenture Agreements
Arrow Electronics
Electronic Equipment, Instruments & Components
NY
2023
Officers Certificate, dated March 30, 2023, establishing the Notes pursuant to the Indenture
Indenture Agreements
Amphenol Corp
Electronic Equipment, Instruments & Components
2023
Fourth Supplemental Indenture, dated March 9, 2023, between Trimble and U.S. Bank National Association
Indenture Agreements
Trimble Inc
Electronic Equipment, Instruments & Components
NY
2023
Fourth Supplemental Indenture, dated as of March 1, 2023, by and between the Company and U.S. Bank National Association, as trustee
Indenture Agreements
Arrow Electronics
Electronic Equipment, Instruments & Components
NY
2023
Nineteenth Supplemental Indenture, dated as of February 13, 2023, among Tyco Electronics Group S.A., as issuer, TE Connectivity Ltd., as guarantor, and Deutsche Bank Trust Company...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2023
Indenture, dated as of January 24, 2023, between FARO Technologies, Inc. and U.S. Bank Trust Company, National Association, as trustee
Indenture Agreements
FARO Technologies, Inc.
Electronic Equipment, Instruments & Components
FL
2023
Fifth Supplemental Indenture, dated as of December 7, 2022, by and between the Company and U.S. Bank Trust Company, National Association, as trustee
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2022
Indenture, dated as of June 9, 2022, by and among the Company, the Guarantor and The Bank of New York Mellon Trust Company, N.A
Indenture Agreements
Akoustis Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2022
Eighteenth Supplemental Indenture, dated as of February 4, 2022, among Tyco Electronics Group S.A., as issuer, TE Connectivity Ltd., as guarantor, and Deutsche Bank Trust Company...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2022
Third Supplemental Indenture, dated as of December 1, 2021, by and between the Company and U.S. Bank National Association, as trustee
Indenture Agreements
Arrow Electronics
Electronic Equipment, Instruments & Components
NY
2021
Ninth Supplemental Indenture, dated as of December 1, 2021, by and among the Co-Issuers, the Company, the Guarantors and the Trustee
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
DE
2021
Eighth Supplemental Indenture, dated as of December 1, 2021, by and among the Co-Issuers, the Company, the Guarantors and the Trustee
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
DE
2021
Seventh Supplemental Indenture, dated as of December 1, 2021, by and among the Co-Issuers, the Company, the Guarantors and the Trustee
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
DE
2021
Amended and Restated Indenture, dated as of November 19, 2021, among the Company, the guarantors party thereto and Wilmington Trust, National association, as Trustee
Indenture Agreements
Vontier Corp
Electronic Equipment, Instruments & Components
DE
2021
Base Indenture, dated as of September 17, 2021, between PAR Technology Corporation and The Bank of New York Mellon Trust Company, N.A., as Trustee
Indenture Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2021
Officers Certificate, dated September 14, 2021, establishing the Notes pursuant to the Indenture
Indenture Agreements
Amphenol Corp
Electronic Equipment, Instruments & Components
2021
Fourth Supplemental Indenture, dated as of August 9, 2021, between SYNNEX Corporation and Citibank, N.A., as trustee
Indenture Agreements
SYNNEX Corporation
Electronic Equipment, Instruments & Components
2021
Third Supplemental Indenture, dated as of August 9, 2021, between SYNNEX Corporation and Citibank, N.A., as trustee
Indenture Agreements
SYNNEX Corporation
Electronic Equipment, Instruments & Components
2021
Second Supplemental Indenture, dated as of August 9, 2021, between SYNNEX Corporation and Citibank, N.A., as trustee
Indenture Agreements
SYNNEX Corporation
Electronic Equipment, Instruments & Components
2021