FLEX LTD. Indenture Agreements

21 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Sixth Supplemental Indenture to 5.250% Notes due 2032 between Flex Ltd. and U.S. Bank Trust Company, N.A.
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2024
Fifth Supplemental Indenture to Indenture Dated June 6, 2019 for 6.000% Notes due 2028 between Flex Ltd. and U.S. Bank Trust Company, N.A.
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2022
Fourth Supplemental Indenture to Indenture for 3.750% Notes due 2026 and 4.875% Notes due 2030 between Flex Ltd. and U.S. Bank National Association
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2020
Third Supplemental Indenture to Indenture Dated June 6, 2019 between Flex Ltd. and U.S. Bank National Association (3.750% Notes due 2026 and 4.875% Notes due 2030)
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2020
Second Supplemental Indenture to 4.875% Notes due 2029 between Flex Ltd. and U.S. Bank National Association
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2019
First Supplemental Indenture to Indenture for 4.875% Notes due 2029 between Flex Ltd. and U.S. Bank National Association
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2019
Indenture Agreement between Flex Ltd. and U.S. Bank National Association dated June 6, 2019
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2019
Indenture Agreement for 4.750% Notes Due 2025 between Flextronics International Ltd., Guarantors, and U.S. Bank National Association
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2015
Second Supplemental Indenture to Flextronics International Ltd. 2013 Indenture (with U.S. Bank National Association and Flextronics International Tecnologia Ltda.)
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
2014
First Supplemental Indenture to 2013 Indenture for Flextronics International Ltd. 4.625% and 5.000% Notes
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
2013
Indenture Agreement for 4.625% Notes Due 2020 and 5.000% Notes Due 2023 between Flextronics International Ltd., Guarantors, and U.S. Bank National Association
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2013
Supplemental Indenture and Amendment No. 2 to Indenture between Flextronics International Ltd. and U.S. Bank National Association (June 19, 2009)
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2009
Supplemental Indenture and Amendment No. 2 to Indenture between Flextronics International Ltd. and U.S. Bank National Association (June 19, 2009)
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2009
Amendment to Indenture between Flextronics International Ltd. and J.P. Morgan Trust Company (July 14, 2005)
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2005
Amendment to Indenture between Flextronics International Ltd. and J.P. Morgan Trust Company (July 14, 2005)
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2005
First Supplemental Indenture to 9.75% Senior Subordinated Notes Due 2010 between Flextronics International Ltd. and J.P. Morgan Trust Company
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2005
Indenture Agreement for $500,000,000 6.25% Senior Subordinated Notes Due 2014 between Flextronics International Ltd. and J.P. Morgan Trust Company
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2004
Indenture Agreement for 1% Convertible Subordinated Notes Due 2010 between Flextronics International Ltd. and J.P. Morgan Trust Company
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2003
Indenture for $400,000,000 6.5% Senior Subordinated Notes Due 2013 between Flextronics International Ltd. and J.P. Morgan Trust Company
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2003
Euro Indenture for €300,000,000 9.75% Senior Subordinated Notes Due 2010 between Flextronics International Ltd. and Chase Manhattan Bank and Trust Company, N.A.
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2000
Indenture Agreement for Flextronics International Ltd. $1,000,000,000 9 7/8% Senior Subordinated Notes Due 2010 with Chase Manhattan Bank and Trust Company as Trustee
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2000