TE Connectivity Ltd. Indenture Agreements

27 Contracts & Agreements
Recent Contracts
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Company
Industry
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Filed
Fourth Supplemental Indenture for $450,000,000 5.000% Senior Notes due 2035 among Tyco Electronics Group S.A., TE Connectivity PLC, TE Connectivity Switzerland Ltd., and Deutsche...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2025
Third Supplemental Indenture for $450,000,000 4.500% Senior Notes due 2031 among Tyco Electronics Group S.A., TE Connectivity PLC, TE Connectivity Switzerland Ltd., and Deutsche...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2025
Second Supplemental Indenture for €500,000,000 2.500% Senior Notes due 2028 among Tyco Electronics Group S.A., TE Connectivity PLC, TE Connectivity Switzerland Ltd., and...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2025
First Supplemental Indenture for €750,000,000 3.250% Senior Notes due 2033 among Tyco Electronics Group S.A., TE Connectivity PLC, TE Connectivity Switzerland Ltd., and Deutsche...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2025
Amended and Restated Indenture among Tyco Electronics Group S.A., TE Connectivity PLC, TE Connectivity Switzerland Ltd., and Deutsche Bank Trust Company Americas (2025)
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2025
Twentieth Supplemental Indenture for $350,000,000 4.625% Senior Notes due 2030 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2024
Nineteenth Supplemental Indenture for $500,000,000 4.500% Senior Notes due 2026 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2023
Eighteenth Supplemental Indenture for $600,000,000 2.500% Senior Notes due 2032 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2022
Seventeenth Supplemental Indenture for €550,000,000 0.000% Senior Notes due 2029 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2021
Sixteenth Supplemental Indenture for €550,000,000 0.000% Senior Notes due 2025 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2020
Fifteenth Supplemental Indenture for $350,000,000 Senior Floating Rate Notes due 2020 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2018
Fourteenth Supplemental Indenture for $400,000,000 3.125% Senior Notes due 2027 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2017
Thirteenth Supplemental Indenture for $350,000,000 3.700% Senior Notes due 2026 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2016
Twelfth Supplemental Indenture for €550,000,000 1.100% Senior Notes due 2023 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2015
Eleventh Supplemental Indenture for $500,000,000 Senior Floating Rate Notes due 2016 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2014
Tenth Supplemental Indenture for $250,000,000 3.450% Senior Notes due 2024 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2014
Ninth Supplemental Indenture for $250,000,000 2.350% Senior Notes due 2019 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2014
Eighth Supplemental Indenture for $325,000,000 2.375% Senior Notes due 2018 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2013
Seventh Supplemental Indenture for $500,000,000 3.500% Senior Notes due 2022 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2012
Sixth Supplemental Indenture for $250,000,000 1.600% Senior Notes due 2015 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2012
Fifth Supplemental Indenture for $250,000,000 4.875% Senior Notes due 2021 among Tyco Electronics Group S.A., Tyco Electronics Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2010
Fourth Supplemental Indenture for $300,000,000 5.950% Senior Notes due 2014 among Tyco Electronics Group S.A., Tyco Electronics Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2008
Third Supplemental Indenture for $500,000,000 7.125% Senior Notes due 2037 among Tyco Electronics Group S.A., Tyco Electronics Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2007
Second Supplemental Indenture for $750,000,000 6.550% Senior Notes due 2017 among Tyco Electronics Group S.A., Tyco Electronics Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2007
First Supplemental Indenture for $800,000,000 6.000% Senior Notes due 2012 among Tyco Electronics Group S.A., Tyco Electronics Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2007
Indenture for Unsubordinated Debt Securities among Tyco Electronics Group S.A., Tyco Electronics Ltd., and Deutsche Bank Trust Company Americas (2007)
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2007
Tyco Electronics Group S.A. Director’s Certificate and Tenth Supplemental Indenture for Issuance of Additional 2024 Senior Notes
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2017