Indenture Agreements in the Electronic Equipment, Instruments & Components Industry

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Indenture Agreement for 0.25% Convertible Senior Notes due 2030 between Mirion Technologies, Inc. and U.S. Bank Trust Company, N.A.
Indenture Agreements
GS Acquisition Holdings Corp II
Electronic Equipment, Instruments & Components
2025
Fourth Supplemental Indenture for $450,000,000 5.000% Senior Notes due 2035 among Tyco Electronics Group S.A., TE Connectivity PLC, TE Connectivity Switzerland Ltd., and Deutsche...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2025
Third Supplemental Indenture for $450,000,000 4.500% Senior Notes due 2031 among Tyco Electronics Group S.A., TE Connectivity PLC, TE Connectivity Switzerland Ltd., and Deutsche...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2025
Second Supplemental Indenture for €500,000,000 2.500% Senior Notes due 2028 among Tyco Electronics Group S.A., TE Connectivity PLC, TE Connectivity Switzerland Ltd., and...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2025
Second Supplemental Indenture for $750,000,000 5.350% Notes due 2030 between Keysight Technologies, Inc. and U.S. Bank Trust Company, N.A.
Indenture Agreements
Keysight Technologies, Inc
Electronic Equipment, Instruments & Components
NY
2025
Twentieth Supplemental Indenture to CDW LLC Senior Notes Indenture—Addition of Mission Cloud Services, Inc. as Guarantor
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
TX
2025
Seventeenth Supplemental Indenture to 3.569% Senior Notes Due 2031 – SCS Holdings I, LLC, Sirius Computer Solutions Entities, and U.S. Bank National Association
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
IL
2025
Sixteenth Supplemental Indenture to 3.276% Senior Notes Due 2028 Guarantee Agreement among SCS Holdings I, LLC, Sirius Computer Solutions Entities, and U.S. Bank National...
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
IL
2025
Fifteenth Supplemental Indenture to 2.670% Senior Notes Due 2026—Addition of New Guarantors (CDW LLC, SCS Holdings I, LLC, Sirius Entities, U.S. Bank National Association)
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
IL
2025
Fourteenth Supplemental Indenture to 3.250% Senior Notes Due 2029—Addition of New Guarantors (CDW LLC, SCS Holdings I, LLC, Sirius Entities, U.S. Bank as Trustee)
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
IL
2025
Thirteenth Supplemental Indenture to 4.125% Senior Notes Due 2025—Guarantee by New Guarantors (SCS Holdings I, Sirius Entities, U.S. Bank as Trustee)
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
IL
2025
Twelfth Supplemental Indenture to 4.250% Senior Notes Due 2028—Addition of New Guarantors (CDW LLC, SCS Holdings I, LLC, et al.)
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
IL
2025
Eleventh Supplemental Indenture to 5.50% Senior Notes Due 2024—Addition of New Guarantors (SCS Holdings I, LLC, Sirius Entities, U.S. Bank as Trustee)
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
IL
2025
First Supplemental Indenture for €750,000,000 3.250% Senior Notes due 2033 among Tyco Electronics Group S.A., TE Connectivity PLC, TE Connectivity Switzerland Ltd., and Deutsche...
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2025
Amended and Restated Indenture among Tyco Electronics Group S.A., TE Connectivity PLC, TE Connectivity Switzerland Ltd., and Deutsche Bank Trust Company Americas (2025)
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2025
Indenture for 1.00% Convertible Senior Notes due 2030 between PAR Technology Corporation and U.S. Bank Trust Company, N.A.
Indenture Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2025
First Supplemental Indenture to 2.25% Convertible Senior Notes Due 2030 between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A.
Indenture Agreements
Vishay Intertechnology Inc
Electronic Equipment, Instruments & Components
2024
Second Supplemental Indenture to 2.25% Convertible Senior Notes due 2025 between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A.
Indenture Agreements
Vishay Intertechnology Inc
Electronic Equipment, Instruments & Components
2024
Amphenol Corporation Officers’ Certificate for Issuance of Senior Notes under Indenture with U.S. Bank Trust Company
Indenture Agreements
Amphenol Corp
Electronic Equipment, Instruments & Components
2024
First Supplemental Indenture to Indenture for $600,000,000 4.950% Notes due 2034 between Keysight Technologies, Inc. and U.S. Bank Trust Company, N.A.
Indenture Agreements
Keysight Technologies, Inc
Electronic Equipment, Instruments & Components
NY
2024
Indenture Agreement between Keysight Technologies, Inc. and U.S. Bank Trust Company, National Association (October 9, 2024)
Indenture Agreements
Keysight Technologies, Inc
Electronic Equipment, Instruments & Components
NY
2024
Nineteenth Supplemental Indenture to Base Indenture for 5.550% Senior Notes Due 2034 among CDW LLC, CDW Finance Corporation, Guarantors, and U.S. Bank Trust Company
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
DE
2024
Eighteenth Supplemental Indenture to Base Indenture for 5.100% Senior Notes Due 2030 among CDW LLC, CDW Finance Corporation, Guarantors, and U.S. Bank Trust Company
Indenture Agreements
CDW
Electronic Equipment, Instruments & Components
DE
2024
Sixth Supplemental Indenture to 5.250% Notes due 2032 between Flex Ltd. and U.S. Bank Trust Company, N.A.
Indenture Agreements
FLEX LTD.
Electronic Equipment, Instruments & Components
NY
2024
Second Supplemental Indenture for Arrow Electronics, Inc. 5.150% Notes Due 2029 with U.S. Bank Trust Company, N.A.
Indenture Agreements
Arrow Electronics
Electronic Equipment, Instruments & Components
NY
2024
Twentieth Supplemental Indenture for $350,000,000 4.625% Senior Notes due 2030 among Tyco Electronics Group S.A., TE Connectivity Ltd., and Deutsche Bank Trust Company Americas
Indenture Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
NY
2024
Indenture for 2.25% Convertible Senior Notes due 2029 between OSI Systems, Inc. and U.S. Bank Trust Company, N.A.
Indenture Agreements
OSI Systems, Inc.
Electronic Equipment, Instruments & Components
DE
2024
Indenture for 1.375% Convertible Senior Notes due 2030 between Itron, Inc. and U.S. Bank Trust Company, N.A.
Indenture Agreements
Itron, Inc.
Electronic Equipment, Instruments & Components
WA
2024
Fifth Supplemental Indenture to Indenture Dated August 9, 2021 Between TD SYNNEX Corporation and Citibank, N.A.
Indenture Agreements
SYNNEX Corporation
Electronic Equipment, Instruments & Components
2024
First Supplemental Indenture to Indenture for Arrow Electronics, Inc. 5.875% Notes due 2034 with U.S. Bank Trust Company, N.A.
Indenture Agreements
Arrow Electronics
Electronic Equipment, Instruments & Components
NY
2024
Amphenol Corporation Officers’ Certificate for Issuance of Senior Notes (2027, 2029, 2034) under Indenture with U.S. Bank Trust Company
Indenture Agreements
Amphenol Corp
Electronic Equipment, Instruments & Components
2024
Indenture for 2.25% Convertible Senior Notes due 2030 between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A.
Indenture Agreements
Vishay Intertechnology Inc
Electronic Equipment, Instruments & Components
NY
2023
Third Supplemental Indenture to 5.000% Senior Notes Due 2029—Coherent Corp., New Guarantors, and U.S. Bank Trust Company
Indenture Agreements
II-VI Incorporated
Electronic Equipment, Instruments & Components
NY
2023
First Supplemental Indenture to 5.000% Senior Notes Due 2029 by II-VI Incorporated, New Guarantors, and U.S. Bank Trust Company
Indenture Agreements
II-VI Incorporated
Electronic Equipment, Instruments & Components
NY
2023
Corning Incorporated Officers’ Certificate Establishing €300,000,000 3.875% Notes Due 2026 and €550,000,000 4.125% Notes Due 2031
Indenture Agreements
Corning Inc.
Electronic Equipment, Instruments & Components
2023
Second Supplemental Indenture to 5.000% Senior Notes Due 2029 by Coherent Corp., New Guarantors, and U.S. Bank Trust Company
Indenture Agreements
II-VI Incorporated
Electronic Equipment, Instruments & Components
NY
2023
Fifth Supplemental Indenture to Arrow Electronics, Inc. Indenture Agreements with U.S. Bank Trust Company, N.A.
Indenture Agreements
Arrow Electronics
Electronic Equipment, Instruments & Components
NY
2023
Amphenol Corporation Officers’ Certificate for 4.750% Senior Notes Due 2026
Indenture Agreements
Amphenol Corp
Electronic Equipment, Instruments & Components
2023
Fourth Supplemental Indenture for $800,000,000 6.100% Senior Notes due 2033 between Trimble Inc. and U.S. Bank Trust Company, N.A.
Indenture Agreements
Trimble Inc
Electronic Equipment, Instruments & Components
NY
2023
Avnet, Inc. Officers’ Certificate Establishing Terms of 6.250% Notes Due 2028
Indenture Agreements
Avnet
Electronic Equipment, Instruments & Components
NY
2023