FIRST AMENDMENT TO LOAN AND SECURITY AGREEMENT
EX-10.2 3 mxwl041116ex102ewbamendment.htm EXHIBIT 10.2 Exhibit
Exhibit 10.2
EXECUTION VERSION
FIRST AMENDMENT TO LOAN AND SECURITY AGREEMENT
This First Amendment to Loan and Security Agreement (this “Amendment”) is entered into as of April 12, 2016, by and between EAST WEST BANK (“Bank”) and MAXWELL TECHNOLOGIES, INC. (“Borrower”).
RECITALS
WHEREAS, Borrower and Bank are parties to the Loan and Security Agreement, dated as of July 3, 2015 (as amended from time to time, the “Loan Agreement”);
WHEREAS, Borrower has requested that Bank consent to Borrower’s disposition of the assets relating to its Microelectronics business unit as described in Exhibit A hereto (the “Asset Disposition”) pursuant to the Asset Purchase Agreement, dated as of the date hereof, between Borrower and Data Device Corporation (the “Asset Purchase Agreement”) and that it amend the minimum EBITDA and minimum Consolidated Cash financial covenants in connection with such disposition; and
WHEREAS, Bank is willing to agree to Borrower’s requests, on the terms set forth herein;
NOW, THEREFORE, the parties agree as follows:
1.Amendment to Loan Agreement.
(a) Section 6.2 of the Loan Agreement is amended to read as follows:
6.2 Financial Statements, Reports, Certificates.
(a) Borrower shall deliver to Bank: (i) as soon as available, but in any event within thirty (30) days after the end of each calendar month, a company prepared consolidated and consolidating balance sheet and income statement covering Borrower’s operations during such period, in a form reasonably acceptable to Bank and certified by a Responsible Officer; (ii) as soon as available, but in any event within forty-five (45) days after the end of each Fiscal Quarter, a company prepared consolidated statement of cash flows covering Borrower’s operations during such period, in a form reasonably acceptable to Bank and certified by a Responsible Officer; (iii) as soon as available, but in any event within ninety (90) days after the end of each Fiscal Year, audited consolidated and consolidating financial statements of Borrower prepared in accordance with GAAP, consistently applied, together with an opinion which is unqualified (including no going concern comment or qualification) or otherwise consented to in writing by Bank on such financial statements of an independent certified public accounting firm reasonably acceptable to Bank; (iv) if applicable, copies of all statements, reports and notices sent or made available generally by Borrower to its security holders or to any holders of Subordinated Debt and all reports on Forms 10-K and 10-Q filed with the Securities and Exchange Commission within five (5) days of filing with the Securities and Exchange Commission; (v) promptly upon receipt of notice thereof, any actions, suits, litigation or proceedings, at law or in equity, pending by or against Borrower or any Subsidiary before any court, administrative agency, or arbitrator in which a likely adverse decision could reasonably be expected to have a Material Adverse Effect; (vi) as soon as available, but in any event within thirty (30) days of the start of each Fiscal Year, Borrower’s financial and business projections and budget for such year, with evidence of approval thereof by Borrower’s board of directors; (vii) such budgets, sales projections, operating plans or other financial information generally prepared by Borrower in the ordinary course of business as Bank may reasonably request from time to time; and (viii) within thirty (30) days of the last day of each Fiscal Quarter, a report signed by Borrower, in form reasonably acceptable to Bank, listing any applications or registrations that Borrower has made or filed in respect of any Patents, Copyrights or Trademarks and the status of any outstanding applications or
registrations, as well as any material change in Borrower’s Intellectual Property Collateral, including, but not limited to, any subsequent ownership right of Borrower in or to any Trademark, Patent or Copyright not specified in Exhibits A, B, and C of any Intellectual Property Security Agreement delivered to Bank by Borrower in connection with this Agreement.
(b) Within fifteen (15) days after the last day of each Fiscal Quarter, Borrower shall deliver to Bank a Borrowing Base Certificate signed by a Responsible Officer in substantially the form of Exhibit D hereto; provided, however, that if, and for as long as, the Advances outstanding exceed Eight Million Dollars ($8,000,000), Borrower shall deliver the Borrowing Base Certificate within fifteen (15) days after the last day of each month.
(c) Within fifteen (15) days after the last day of each month, Borrower shall deliver to Bank an aged listings by invoice date of accounts receivable and accounts payable on a non-consolidated basis.
(d) Within thirty (30) days after the last day of each month, Borrower shall deliver to Bank with the monthly financial statements a Compliance Certificate certified as of the last day of the applicable month and signed by a Responsible Officer in substantially the form of Exhibit E hereto.
(e) Immediately upon becoming aware of the occurrence or existence of an Event of Default, a written statement of a Responsible Officer setting forth details of the Event of Default, and the action which Borrower has taken or proposes to take with respect thereto.
(f) Borrower shall give Bank prompt written notice of the termination of service, for any reason, of its Chief Executive Officer or its Chief Financial Officer.
(g) Bank shall have a right from time to time hereafter to audit Borrower’s Accounts and appraise Collateral at Borrower’s expense, provided that such audits will be conducted no more often than every twelve (12) months unless an Event of Default has occurred and is continuing. The cost of such audits shall be Eight Hundred Fifty Dollars ($850) per day plus Bank’s reasonable out-of-pocket expenses.
Borrower may deliver to Bank on an electronic basis any certificates, reports or information required pursuant to this Section 6.2, and Bank shall be entitled to rely on the information contained in the electronic files, provided that Bank in good faith believes that the files were delivered by a Responsible Officer. If Borrower delivers this information electronically, it shall also deliver to Bank by U.S. Mail, reputable overnight courier service, hand delivery, facsimile or .pdf file within five (5) Business Days of submission of the unsigned electronic copy the certification of monthly financial statements, the intellectual property report, the Borrowing Base Certificate and the Compliance Certificate, each bearing the physical signature of the Responsible Officer.
(b) Section 6.7 of the Loan Agreement is amended to read as follows:
6.7 Financial Covenants. Borrower shall at all times maintain the following financial ratios and covenants:
(a) Adjusted Quick Ratio. A ratio of (i) Cash plus Accounts to (ii) Current Liabilities plus (to the extent not already included therein) all Indebtedness to Bank less Deferred Revenue of at least 1.20 to 1.00, tested on a quarterly basis as of the last day of each Fiscal Quarter.
(b) Minimum EBITDA. A minimum EBITDA as the last day of each Fiscal Quarter for the four (4) Fiscal Quarters then ended as set forth below:
Fiscal Quarter Ending | Minimum EBITDA | ||
March 30, 2016 | ($2,000,000 | ) | |
June 30, 2016 | $0 | ||
September 30, 2016 | $1,000,000 | ||
December 31, 2016 | $2,000,000 | ||
March 31, 2017 | $3,000,000 | ||
June 30, 2017 | $3,000,000 | ||
September 30, 2017, and each Fiscal Quarter thereafter | $4,000,000 |
(c) Minimum Consolidated Cash. A minimum Consolidated Cash as the last day of the first two (2) months of each Fiscal Quarter of as set forth below:
Fiscal Quarter Ending | Minimum Consolidated Cash | ||
March 30, 2016 | $5,000,000 | ||
June 30, 2016 | $5,000,000 | ||
September 30, 2016, and each Fiscal Quarter thereafter | $10,000,000 |
(c) Exhibit E to the Loan Agreement is amended to read as set forth in Attachment “1” hereto.
2. Consent to Asset Disposition. Bank consents to the Asset Disposition and releases its security interest in the Collateral described in Exhibit A hereto (the “Transferred Collateral”) concurrent with the consummation of the Asset Disposition and the effectiveness of this Amendment, including its security interest in the Transferred Collateral listed in the Intellectual Property Security Agreement, dated as of July 3, 2015, between Bank and Borrower (the “IP Security Agreement”). The foregoing consent shall not, except as expressly provided herein, be deemed to be a consent to changes to any terms or provisions of the Loan Documents, and shall not be deemed to be a waiver or amendment of any provision contained in any of such agreements. Upon consummation of the Asset Disposition and the effectiveness of this Amendment, Bank shall take all actions reasonable and necessary to effect the release of its security interest in the Transferred Collateral and to give notice of such release, including (i) filing a UCC-3 Amendment with the Delaware Secretary of State, (ii) recording Reassignments and Releases of Security Interest with the Patent and Trademark Office, and (iii) executing and delivering a Termination of Agreement and Acknowledgement of Security Interest with respect to Borrower’s lease of 9244 Balboa Avenue, San Diego, California 92123.
3. Course of Dealing. No course of dealing on the part of Bank or its officers, nor any failure or delay in the exercise of any right by Bank, shall operate as a waiver thereof, and any single or partial exercise of any such right shall not preclude any later exercise of any such right. Bank’s failure at any time to require strict performance
by Borrower of any provision of the Loan Documents shall not affect any right of Bank thereafter to demand strict compliance and performance. Any suspension or waiver of a right must be in writing signed by an officer of Bank.
4. Miscellaneous. Unless otherwise defined, all initially capitalized terms in this Amendment shall be as defined in the Loan Agreement. The Loan Agreement, as amended hereby, shall be and remain in full force and effect in accordance with its terms and hereby is ratified and confirmed in all respects. Except as expressly set forth herein, the execution, delivery, and performance of this Amendment shall not operate as a waiver of, or as an amendment of, any right, power, or remedy of Bank under the Loan Agreement, as in effect prior to the date hereof.
5. Representations and Warranties. Borrower represents and warrants that the Representations and Warranties contained in the Loan Agreement are true and correct as of the date of this Amendment, and that no Event of Default has occurred and is continuing.
6. Conditions Precedent. As conditions precedent to the effectiveness of this Amendment:
(a) Bank shall have received, in form and substance satisfactory to Bank, the following:
(i) this Amendment, duly executed by Borrower;
(ii) a Corporate Borrowing Certificate with respect to incumbency and resolutions authorizing the execution and delivery of this Amendment, substantially in the form attached hereto;
(iii) financial statements prepared by Borrower which give effect to the Asset Disposition, on a pro forma basis and which show that, immediately after giving effect to the Asset Disposition, Borrower shall be in compliance with each of the covenants set forth in Section 6.7 of the Loan Agreement, as amended by this Amendment;
(iv) copies of the executed documents giving effect to and relating to the Asset Disposition;
(v) a certificate of a Responsible Officer certifying that all of the conditions precedent set forth in this Section 6 for the Bank’s consent to the Asset Disposition have been satisfied; and
(vi) such other documents, and completion of such other matters, as Bank may reasonably deem necessary or appropriate;
(b) The transactions relating to the Asset Disposition shall be consummated in all material respects in accordance with all applicable laws;
(c) Immediately before and immediately after giving effect to the Asset Disposition and this Amendment, no Event of Default shall have occurred and be continuing and no event shall have occurred or situation exist that with notice or the passage of time or both would constitute an Event of Default;
(d) The Swiss Subsidiary shall have consented to this Amendment and shall have reaffirmed its guaranty of the Obligations pursuant to the Swiss Subsidiary Guaranty Documents by executing this Amendment as set forth below; and
(e) Borrower shall have paid all reasonable Bank Expenses incurred through the date of this Amendment, which may be debited from any of Borrower's accounts.
7. Counterparts. This Amendment may be executed in two or more counterparts, each of which shall be deemed an original, but all of which together shall constitute one instrument.
[Balance of Page Intentionally Left Blank]
IN WITNESS WHEREOF, the undersigned have executed this Amendment as of the first date above written.
MAXWELL TECHNOLOGIES, INC. | |
By: _ _/s/ David Lyle__________________________ | |
Name:___David Lyle___________________________ | |
Title: ___Chief Financial Officer_________________ | |
EAST WEST BANK | |
By: ___/s/ Alexis Coyle_________________________ | |
Name:__Alexis Coyle__________________________ | |
Title: __Managing Director_____________________ |
[Signature Page to First Amendment to Loan and Security Agreement]
The Swiss Subsidiary consents to the modifications to the Obligations pursuant to this Amendment, hereby ratifies the provisions of the Swiss Subsidiary Guaranty Documents and confirms that all provisions of Swiss Subsidiary Guaranty Documents are in full force and effect.
MAXWELL TECHNOLOGIES SA | |
By: __/s/ Franz Fink________________________ | |
Name:___Franz Fink_________________________ | |
Title: ____President_________________________ | |
[Signature Page to First Amendment to Loan and Security Agreement]
EXHIBIT A
ASSETS SUBJECT TO ASSET DISPOSITION
Equipment:
Object | Object Description |
GK51903 | SENTRY 21 TESTER |
GK51904 | FAIRCHILD SENTRY 20 IC TESTER |
GK51908 | ANALOG DEVICES LTS-2020 |
GK51913 | 7 HP 6033A POWER SUPPLY |
GK51915 | ATS-12200 Burn-in System |
GK51921 | 5 HP 6033A POWER SUPPLY |
GK51922 | BURN-IN SYSTEM PBC2-16 |
GK51927 | Bubble Detector System sr# 60555-326 |
GK51934 | BURN IN BOARD 68 PGA |
GK51935 | OLYMPUS MICROSCOPE |
GK52327 | C/F INSERT - 11 6 SLOT - CENTRIFUGE |
GK52329 | BURN-IN BOARDS 44 QFP 100 PIN EDGE |
GK52421 | IMPACT EXTRUSION TOOLS |
GK52516 | DIGITAL RANDON VIBRATION SYSTEM |
GK52520 | NOISE DETECTION SYSTEM |
GK52521 | TRILLIUM ARRAYMASTER |
GK52525 | TRILLIUM MANIPULATOR ASSEMBLY ###-###-#### |
GK52527 | MICROSCOPE, CAMERA AND ACCESORIES |
GK52531 | T-2500 SN#9608-406 |
GK52536 | AIR COMPRESSOR, DRYER & ETC. |
GK52539 | MICROSCOPE |
GK52540 | PLASMA CLEANING SYSTEM |
GK52554 | SENTRY 20 DUAL/60 SERIAL#2143 |
GK52555 | SENTRY 20 SINGLE 120 SERIAL#2175 |
GK52557 | VIB. & SHOCK CONTROLLER |
GK52564 | SEAM SEALER |
GK52566 | TESTER |
GK52569 | LINEAR & MIXER TESTER |
GK52570 | LOGIC ANALYZER HP1661CS AN#US383401110 |
GK52571 | LEAD MACHINE/HAND PRESS |
GK52573 | WAVEFORM GENERATOR |
GK52576 | GENERATOR |
GK52577 | POWER SUPPLY |
GK52589 | SCANNING ELECTRON MICROSCOPE |
GK52590 | PLATEMARKER & LASER MARKER |
GK52594 | MX-9216 SALT SPRAY CHAMBER |
GK52646 | LT364L |
GK52652 | 8060 GOLD/ALUM BONDER |
GK52660 | HUMIDIFIERS (QTY 5) |
GK52664 | CUSTOM BENCH, EP, SS, HEAVY DUTY, 60"X30"X32" |
GK52670 | ROYCE 550 PULL TESTER |
GK52671 | OLYMPUS BH2 MICROSCOPE/TRI |
GK52675 | TRILLIUM BOARD-SN54V162244 |
GK52681 | HP E3631A DC POWER SUPPLY, TRIPLE OUTPUT |
GK52683 | DC POWER SUPPLY, DUAL OUTPUT, 0-30V, 1.5A |
GK52691 | SPECTRUM ANALYZER |
GK52693 | HP-85047A S-PARAMETET TEST SET |
GK52694 | VACUUM INSULATED LN2 |
GK52951 | ESD GLOVEBOX |
GK52968 | SIGNAL GENERATOR TEST EQUIPMENT |
GK52972 | AUTOMATED WIRE BONDER |
GK52979 | GOLD SURFACE TEXTURING EQUIP - PELCO MODEL 3 SPUTTER COATER 91000 |
GK53022 | CENTERFUGE, TRIO-TECH CENTRISAFE |
GK53023 | DESSICATORS - QTY 7 |
GK53052 | THERMONICS - CONTROLLER & INTERFACE |
GK53089 | CLEAN ROOM BOOTH EXTENSION FOR 8060 WIRE BONDERS |
GK53095 | ADD'L SOCKETS AND EDGE CONNECTORS |
GK53099 | THERMONICS PRECISION TEMPERATURE FORCING SYSTEM |
GK53124 | INCREASED BURN IN CAPACITY (PCBA) FOR A2100 AND SFE |
GK53148 | LTS TESTERS |
GK53164 | PROGRAMMING SOCKETS FOR VARIOUS ACTEL 1152 PIN FPGA CONFIGURATIONS |
GK53164-1 | PROGRAMMING SOCKETS FOR VARIOUS ACTEL 1152 PIN FPGA CONFIGURATIONS |
GK53171 | 28 FLATPACK BURN-IN BOARD |
GK53173 | BOND HEAD - K&S 8060 WIREBONDER |
GK53178 | REFLOW FURNACE FOR ME PACKAGING |
GK53201 | PORTABLE CLEAN ROOM |
GK53203 | WET CLEANING STATION |
GK53204 | PRODUCTION TEST STATION |
GK53205 | DIGITAL MICROSCOPES (SONY) |
GK53206 | X-RAY SYSTEM |
GK53207 | MARKING MACHINE |
GK53225 | RANSCO THERMAL SHOCK CHAMBER |
GK53250 | Laser Marke LMV1000 + LMW2020 |
GK53252 | GAS MIXER FOR FORMING GASES, GMX2000 |
GK53259 | Test Equity 140 Temperature Chamber |
GK53283 | Tech Cut 4 PN 5-5000 |
GK53305 | TestEquity FS Series oven, model FS4, W18.25" x D19" x H16.5" |
GK53309 | Thermal chamber - Test Equity 1007H Temperature Chamber |
GK53318 | security system for the storage room with the Cobalt-60 radiation sources |
GK53347 | Agilent N6702B Modular Power System & DC Power Module |
GK53376 | Power Supply Modules for Production & Flight Production Test for SCS750 |
GK53377 | 5 Chassis class 3 build with custom design-NPOESS & Std Product for SCS750 Testing in Flight |
GK53377-1 | 5 Chassis class 3 build with custom design-NPOESS & Std Product for SCS750 Testing in Flight |
GK53385 | Thermal Stream for Tritemp Testing model T-2500SE |
GK53394 | PWB Aqueous Cleaner(Used) AQ400(1994) |
GK53428 | Varian VS-MD301S Helium Mass Spectrometer Leak Detector |
GK53451 | Temparature Chamber 140 fo SBC environment test & bake out |
GK53460 | Electron Dispersive Xray(EDX) System Upgrade |
GK53462 | Trident 1: Automatic De-fluxing & Cleanliness Test System |
GK53463 | FEI-XL30 - FP 6796/05- Window 2000 PC Upgrade for XL-SEM |
GK53488 | YES G1000 Plasma Cleaning System |
GK53510-1 | Laser Etching & Pad Printing Machine |
GK53512 | Burn-in Oven Model BI-16E |
GK53579 | Verigy V6000e Engineering Workstation |
GK53592 | Vacuum Chamber System - complete assembly |
GK53593 | MCT 2010 Test System(refub)-Tester Mainframe/Workstation 2000 CPU controller |
GK53605 | MV Master Station for Trillium Array and Trillium Delta |
GK53621 | Nitrogen Purged Assembly Work-In-Progess & Raw Material Desiccators |
GK53629 | Romulus Universal Tester with Breaking Point Platform |
GK53630 | Royce System 650 Universal Bond Pull Tester |
GK53666 | Sonoscan Lab Demo Gen5 C-Scam Digital Acoustic Micro Imaging System |
GK53727 | Installation of air conditioning control unit-Softwall clean room |
GK53749 | ATS 830-M-4 Thermostream System |
GK53780 | Microelectronics Die Attach Machine-MAT 6400(Automatic High Accuracy Die Attach System) |
GK53893 | One-Shot 3D Measuring Macroscope VR-3000 from Keyance |
GK52970 | AGILENT MODULE |
GK53021 | HARSHAW 3500 MANUAL TLD READER |
GK53036 | SOFT TOOLING FOR PACKAGE PART 102909 |
GK53039 | TOOLING FOR 72-LEAD SDRAM STD FLAT PACKAGE |
GK53050 | TOOLING FOR 20MB EEPROM - SCS750 PROJECT |
GK53221 | 2 GHZ SCOPE: Waverunner 6200A demo unit, with WR6-STD |
GK53356 | Agilent Mainframe(N6700) & Power Module(N6752/N6742) |
GK53404 | Incircuit Emulator(ICE) for programming bootup SW into SCS750 |
GK53705 | SCS750 Single Board Tester |
GK53741 | Thermal Chamber Hood for flash memory test |
GK53761 | Space Wire Test Equipment(SRR-MC402/8-MS-32K/DSI-MC404/8-MS-EI-EW) |
GK53762 | AX/RTAX20000-Design Update to SCS750 single board computer with Space Wire Interface |
GK53915 | In-circuit Emulator (ICE) for debugging and development of embedded processors for SCS750 Prod Test |
GK53829 | NRE-Soft Tooling Charge- PN:129799 - 68 lead flat package |
GK52999 | IP FOR POWER COMPUTING FOR SPACE |
GK53016 | BOARDSIM & LINESIM (NODELOCKED) |
GK53047 | BC RT SUMMIT SOURCE FOR 1553 INTERFACE - VX WORKS S/W DRVRS |
GK53067 | IP MODS FOR SCS750 SYST CONTROLLER |
GK53113 | SCD750 IP MODIFICATION PER DOC 1007889 |
GK53125 | SCS750 IP MODIFICATION |
GK53144 | ADVANCED ANALYSIS /FINITE ELEMENT METHOD ANSYS SOFTWARE PACKAGE |
GK53161 | EMC AND CROSSTALK ADD-ON SOFTWARE |
GK53212 | SCS750 FPGA MODIFICATION |
GK53268 | 3 Slot Logic analysis mainframe with touch display |
GK53442 | Electronic Assembly/Ansys Icepak |
GK53534 | PowerEdge R810 (server for running Ansys Icepak) |
GK53557 | Flash NAND asynch and synch(ONFI) & Flash NOR |
GK53830 | NRE-Tooling - Brazing - PN:129799 |
GK53834 | NRE charge- Softooling for PN:130078 70 lead flat package, include Simulation charge |
GK53835 | NRE charge- Brazing for PN: 130078 |
GK53884 | Datalight FlashFX Tera & Reliance Nitro System |
GK53154 | MODULE ASSY AREA - WALLS/DOOR |
GK53176 | MEZANINE FOR LAB |
GK53276 | Lockers |
GK53287 | ME root-top Air conditioner TRANE model : YCD180B4LA |
GK53320 | Camera Installation for 9244 Balboa - 8 perimeter cameras |
GK53391 | Refurb Cubicles/Installation & relocation of existing cubicles |
GK53391-1 | Refurb Cubicles/Installation & relocation of existing cubicles-Sales/Use Tax |
GK53407 | Installation of 4000sq ft VCT 12x12 commercial flooring walkways/hallways |
GK53426 | Cabling project for new sales area |
GK53464 | New Air Conditioner Balboa Facility(furnish/install) Trane R-22/15Ton cooling capacity |
GK53486 | Balboa facility Leasehold Improvements-expansion project |
GK53486-1 | Balboa Facility - Furniture & Fixture (renovation project) |
GK53486-A | Balboa facility Leasehold Improvements-expansion project |
GK53504 | ELECTRICAL AND UTILITIES INSTALLATION IN NEW MACHINE SHOP |
GK53513 | Air conditioner-Balboa facility / 3 each, 15 ton, high efficiency replacing dead |
GK53542 | Data Cabling for Balboa Facility Construction |
GK53570 | Aircon Unit new roof top R22 15ton nominal cap High Efficiency package-economizer/barometric relief |
GK53580 | Security Systems upgrade-Balboa MicroElec FA Lab-4cameras/16 channel DVR added |
GK53598 | Bristolite skylights installed, 8 each 4' X 4' triple dome |
GK53686 | BSD 50 T 125psi 460V/3ph/60HZ sigma control Air compressor w/ Air Dyer |
GK53706 | Balboa Facility Mantrap |
GK53720 | Balboa Facility Driveway Repair |
GK53823 | Wireless Fire Alarm Materials & Equipment addition |
GK53850 | Aluminum Awnings Installation |
GK53853 | Driveway east side patched/repaired-Balboa Facility |
GK53861 | Installation of Remotely activated gates at North/South end of Balboa Facility |
Inventory:
The Inventory described in the Purchased Assets definition in the Asset Purchase Agreement.
Contracts:
The Business Contracts and other contracts described in the Purchased Assets definition in the Asset
Purchase Agreement.
Accounts Receivable:
The accounts receivable, notes receivable and other receivables described in the Purchased Assets definition in the Asset Purchase Agreement.
Claims:
The causes of action, claims, demands, rights and privileges against third parties described in the Purchased Assets definition in the Asset Purchase Agreement.
Permits:
The permits and pending applications for permits described in the Purchased Assets definition in the Asset Purchase Agreement.
Goodwill:
The goodwill of the microelectronics business described in the Purchased Assets definition in the Asset Purchase Agreement.
Intellectual Property:
• | Trademarks: |
• | Patents: |
Title of Invention: | Keyword: | Country: | Status: | Application No. | Filing Date: | Patent No: | Date Issued: |
RADIATION SHIELDING OF PLASTIC INTEGRATED CIRCUITS | Micro Electronics | US | Abandoned | 08/077731 | 6/18/1993 | ||
RADIATION SHIELDING OF PLASTIC INTEGRATED CIRCUITS | Micro Electronics | US | Expired | 08/372235 | 1/13/1995 | 5825042 | 10/20/1998 |
RADIATION SHIELDING OF PLASTIC INTEGRATED CIRCUITS | Micro Electronics | US | Expired | 08/595266 | 2/1/1996 | 5889316 | 3/30/1999 |
RADIATION SHIELDING OF INTEGRATED CIRCUITS AND MULTI-CHIP MODULES IN CERAMIC AND METAL PACKAGES | Micro Electronics | US | Expired | 08/372289 | 1/13/1995 | 5635754 | 6/3/1997 |
RADIATION SHIELDING OF INTEGRATED CIRCUITS AND MULTI-CHIP MODULES IN CERAMIC AND METAL PACKAGES | Micro Electronics | EP | Expired | 96911182.2 | 1/16/1996 | 803174 | 11/22/2006 |
RADIATION SHIELDING OF INTEGRATED CIRCUITS AND MULTI-CHIP MODULES IN CERAMIC AND METAL PACKAGES | Micro Electronics | JP | Abandoned | 1996-522312 | 1/16/1996 |
Title of Invention: | Keyword: | Country: | Status: | Application No. | Filing Date: | Patent No: | Date Issued: |
RADIATION SHIELDING OF INTEGRATED CIRCUITS AND MULTI-CHIP MODULES IN CERAMIC AND METAL PACKAGES | Micro Electronics | WO | Expired | PCT/US1996/000309 | 1/16/1996 | ||
METHODS AND COMPOSITIONS FOR IONIZING RADIATION SHIELDING | Micro Electronics | US | Abandoned | 08/791256 | 1/30/1997 | ||
METHOD FOR MAKING A SHIELDING COMPOSITION | Micro Electronics | US | Expired | 09/375881 | 8/17/1999 | 6261508 | 7/17/2001 |
METHODS AND COMPOSITIONS FOR IONIZING RADIATION SHIELDING | Micro Electronics | US | Expired | 09/727717 | 11/30/2000 | 6455864 | 9/24/2002 |
METHODS AND COMPOSITIONS FOR IONIZING RADIATION SHIELDING | Micro Electronics | US | Expired | 10/247187 | 9/18/2002 | 6583432 | 6/24/2003 |
METHODS AND COMPOSITIONS FOR IONIZING RADIATION SHIELDING | Micro Electronics | EP | Issued | 98901469.1 | 1/6/1998 | 956749 | 5/27/2015 |
METHODS AND COMPOSITIONS FOR IONIZING RADIATION SHIELDING | Micro Electronics | WO | Expired | PCT/IB1998/000207 | 1/6/1998 | ||
RADIATION SHIELDING OF INTEGRATED CIRCUITS AND MULTI-CHIP MODULES IN CERAMIC AND METAL PACKAGES | Micro Electronics | US | Expired | 09/456631 | 12/8/1999 | 6720493 | 4/13/2004 |
RADIATION SHIELDING OF INTEGRATED CIRCUITS AND MULTI-CHIP MODULES IN CERAMIC AND METAL PACKAGES | Micro Electronics | US | Expired | 10/821409 | 4/9/2004 | 7148084 | 12/12/2006 |
RADIATION SHIELDING OF THREE DIMENSIONAL MULTI-CHIP MODULES | Micro Electronics | US | Issued | 08/788134 | 1/24/1997 | 5880403 | 3/9/1999 |
RADIATION SHIELDING OF THREE DIMENSIONAL MULTI-CHIP MODULES | Micro Electronics | US | Issued | 09/109954 | 7/2/1998 | 6262362 | 7/17/2001 |
RADIATION SHIELDING OF THREE DIMENSIONAL MULTI-CHIP MODULES | Micro Electronics | US | Expired | 09/878683 | 6/9/2001 | 6613978 | 9/2/2003 |
RADIATION SHIELDING OF THREE DIMENSIONAL MULTI-CHIP MODULES | Micro Electronics | US | Expired | 10/643250 | 8/18/2003 | 6858795 | 2/22/2005 |
RADIATION INDUCED SINGLE EVENT LATCHUP PROTECTION AND RECOVERY OF INTEGRATED CIRCUITS | Micro Electronics | US | Issued | 08/763153 | 2/25/1997 | 6064555 | 5/16/2000 |
ELECTRONIC DEVICE PACKAGING | Micro Electronics | US | Issued | 09/520928 | 3/8/2000 | 6368899 | 4/9/2002 |
ELECTRONIC DEVICE PACKAGING | Micro Electronics | AU | Abandoned | 2001242012 | 3/7/2001 | ||
ELECTRONIC DEVICE PACKAGING | Micro Electronics | BR | Abandoned | PI0109077-1 | 3/7/2001 |
Title of Invention: | Keyword: | Country: | Status: | Application No. | Filing Date: | Patent No: | Date Issued: |
ELECTRONIC DEVICE PACKAGING | Micro Electronics | US | Issued | 10/075706 | 2/13/2002 | 6963125 | 11/8/2005 |
ELECTRONIC DEVICE PACKAGING | Micro Electronics | CA | Abandoned | 2401702 | 3/7/2001 | ||
ELECTRONIC DEVICE PACKAGING | Micro Electronics | CN | Abandoned | 20018006244.X | 3/7/2001 | ||
ELECTRONIC DEVICE PACKAGING | Micro Electronics | EP | Abandoned | 1913337 | 3/7/2001 | ||
ELECTRONIC DEVICE PACKAGING | Micro Electronics | IL | Abandoned | 151498 | 3/7/2001 | ||
ELECTRONIC DEVICE PACKAGING | Micro Electronics | JP | Abandoned | 2001-566180 | 3/7/2001 | ||
ELECTRONIC DEVICE PACKAGING | Micro Electronics | JP | Abandoned | 10 ###-###-#### | 3/7/2001 | ||
ELECTRONIC DEVICE PACKAGING | Micro Electronics | SG | Abandoned | 200205320-5 | 3/7/2001 | ||
ELECTRONIC DEVICE PACKAGING | Micro Electronics | WO | Expired | PCT/US2001/007281 | 3/7/2001 | ||
METHOD AND APPARATUS FOR SHIELDING AN INTEGRATED CIRCUIT FROM RADIATION | Micro Electronics | US | Issued | 10/065209 | 9/25/2002 | 7382043 | 6/3/2008 |
METHOD AND APPARATUS FOR SHIELDING AN INTEGRATED CIRCUIT FROM RADIATION | Micro Electronics | EP | Published | 3798732.8 | 9/24/2003 | ||
METHOD AND APPARATUS FOR SHIELDING AN INTEGRATED CIRCUIT FROM RADIATION | Micro Electronics | EP | Published | 10185319 | 9/24/2003 | ||
METHOD AND APPARATUS FOR SHIELDING AN INTEGRATED CIRCUIT FROM RADIATION | Micro Electronics | WO | Expired | PCT/US2003/030245 | 9/24/2003 | ||
SELF-CORRECTING COMPUTER | Micro Electronics | US | Issued | 10/418713 | 4/17/2003 | 7467326 | 12/16/2008 |
SELF-CORRECTING COMPUTER | Micro Electronics | US | Issued | 12/336026 | 12/16/2008 | 7890799 | 2/15/2011 |
SELF-CORRECTING COMPUTER | Micro Electronics | EP | Issued | 4809302.5 | 2/24/2004 | EP1625484 | 9/23/2009 |
SELF-CORRECTING COMPUTER | Micro Electronics | HK | Abandoned | 6106965.2 | 2/24/2004 | HK1084757 | 5/20/2010 |
SELF-CORRECTING COMPUTER | Micro Electronics | JP | Issued | 2006-508822 | 2/24/2004 | 4545146 | 7/9/2010 |
CACHE COHERENCY DURING RESYNCHRONIZATION OF SELF-CORRECTING COMPUTER | Micro Electronics | US | Issued | 11/356945 | 2/16/2006 | 7415630 | 8/19/2008 |
CACHE COHERENCY DURING RESYNCHRONIZATION OF SELF-CORRECTING COMPUTER | Micro Electronics | US | Issued | 12/033408 | 2/19/2008 | 7613948 | 11/3/2009 |
SELF-CORRECTING COMPUTER | Micro Electronics | US | Expired | 60/451041 | 2/28/2003 | ||
SELF-CORRECTING COMPUTER | Micro Electronics | WO | Expired | PCT/US2004/005520 | 2/24/2004 |
Title of Invention: | Keyword: | Country: | Status: | Application No. | Filing Date: | Patent No: | Date Issued: |
ERROR DETECTION AND CORRECTION METHOD AND SYSTEM FOR MEMORY DEVICES | Micro Electronics | US | Issued | 10/861667 | 6/4/2004 | 7475326 | 1/6/2009 |
ERROR DETECTION AND CORRECTION METHOD AND SYSTEM FOR MEMORY DEVICES | Micro Electronics | US | Expired | 60/483210 | 6/27/2003 | ||
METHOD FOR SHIELDING INTEGRATED CIRCUIT DEVICES | Micro Electronics | US | Expired | 10/621844 | 7/16/2003 | 7191516 | 3/20/2007 |
PACKAGING OF SEMICONDUCTOR DEVICES FOR INCREASED RELIABILITY | Micro Electronics | CN | Abandoned | 200480020214.X | 7/12/2004 | ZL200480020214.X | 9/7/2011 |
PACKAGING OF SEMICONDUCTOR DEVICES FOR INCREASED RELIABILITY | Micro Electronics | CN | Abandoned | 200810210299-8 | 7/12/2004 | ZL200810210299.8 | 12/15/2010 |
METHOD FOR SHIELDING INTEGRATED CIRCUIT DEVICES | Micro Electronics | US | Issued | 11/559140 | 11/13/2006 | 7696610 | 4/13/2010 |
APPARATUS FOR SHIELDING INTEGRATED CIRCUIT DEVICES | Micro Electronics | US | Issued | 12/719123 | 3/8/2010 | 8018739 | 9/13/2011 |
PACKAGING OF SEMICONDUCTOR DEVICES FOR INCREASED RELIABILITY | Micro Electronics | EP | Published | 4778051.5 | 7/12/2004 | ||
PACKAGING OF SEMICONDUCTOR DEVICES FOR INCREASED RELIABILITY | Micro Electronics | HK | Abandoned | 9106262.9 | 7/12/2004 | HK1127162 | 5/27/2011 |
A RADIATION SHIELDING INTEGRATED CIRCUIT DEVICE, A METHOD OF SHIELDING AN INTEGRATED CIRCUIT AND A METHOD OF MAKING A HIGHLY RELIABLE PACKAGE | Micro Electronics | JP | Issued | 2006-520255 | 7/12/2004 | 4795948 | 8/5/2011 |
PACKAGING OF SEMICONDUCTOR DEVICES FOR INCREASED RELIABILITY | Micro Electronics | KR | Abandoned | 10 ###-###-#### | 7/12/2004 | 10-1059918 | 8/22/2011 |
PACKAGING OF SEMICONDUCTOR DEVICES FOR INCREASED RELIABILITY | Micro Electronics | WO | Expired | PCT/US2004/022344 | 7/12/2004 | ||
SYSTEM AND METHOD FOR EFFECTIVELY IMPLEMENTING AN IMMUNITY MODE IN AN ELECTRONIC DEVICE | Micro Electronics | US | Issued | 11/058136 | 2/15/2005 | 7437599 | 10/14/2008 |
SYSTEM AND METHOD FOR EFFECTIVELY IMPLEMENTING AN IMMUNITY MODE IN AN ELECTRONIC DEVICE | Micro Electronics | CN | Abandoned | 2.0068E+11 | 2/14/2006 | 101120327 | 4/14/2010 |
Title of Invention: | Keyword: | Country: | Status: | Application No. | Filing Date: | Patent No: | Date Issued: |
SYSTEM AND METHOD FOR EFFECTIVELY IMPLEMENTING AN IMMUNITY MODE IN AN ELECTRONIC DEVICE | Micro Electronics | EP | Published | 6735006.6 | 2/14/2006 | ||
SYSTEM AND METHOD FOR EFFECTIVELY IMPLEMENTING AN IMMUNITY MODE IN AN ELECTRONIC DEVICE | Micro Electronics | JP | Issued | 2007-555335 | 2/14/2006 | 4443611 | 1/22/2010 |
SYSTEM AND METHOD FOR EFFECTIVELY IMPLEMENTING AN IMMUNITY MODE IN AN ELECTRONIC DEVICE | Micro Electronics | WO | Expired | PCT/US2006/005131 | 2/14/2006 | ||
METHODS AND APPARATUS FOR MANAGING AND CONTROLLING POWER CONSUMPTION AND HEAT GENERATION IN COMPUTER SYSTEMS | Micro Electronics | US | Issued | 11/399001 | 4/5/2006 | 8032889 | 10/4/2011 |
METHODS AND APPARATUS FOR MANAGING AND CONTROLLING POWER CONSUMPTION AND HEAT GENERATION IN COMPUTER SYSTEMS | Micro Electronics | US | Published | 14/188583 | 2/24/2014 | ||
METHODS AND APPARATUS FOR MANAGING AND CONTROLLING POWER CONSUMPTION AND HEAT GENERATION IN COMPUTER SYSTEMS | Micro Electronics | US | Issued | 13/150948 | 6/1/2011 | 8661446 | 2/25/2014 |
APPARATUS AND METHOD FOR COLD SPARING IN MULTI-BOARD COMPUTER SYSTEMS | Micro Electronics | US | Issued | 11/449510 | 6/7/2006 | 7673186 | 3/2/2010 |
SYSTEM, METHOD AND APPARATUS FOR ERROR CORRECTION IN MULTI-PROCESSOR SYSTEMS | Micro Electronics | US | Issued | 13/284647 | 10/28/2011 | 8930753 | 1/6/2015 |
SYSTEM, METHOD AND APPARATUS FOR ERROR CORRECTION IN MULTI-PROCESSOR SYSTEMS | Micro Electronics | EP | Published | 11837198.8 | 5/28/2013 | ||
CACHE COHERENCY USING CHECKSUMS | Micro Electronics | US | Expired | 61/407770 | 10/28/2010 | ||
SYSTEM, METHOD AND APPARATUS FOR ERROR CORRECTION IN MULTI-PROCESSOR SYSTEMS | Micro Electronics | RU | Pending | 2013123176 | 5/22/2013 | ||
SYSTEM, METHOD AND APPARATUS FOR ERROR CORRECTION IN MULTI-PROCESSOR SYSTEMS | Micro Electronics | WO | Published | PCT/US2011/058394 | 10/28/2011 |
ATTACHMENT 1
EXHIBIT E
COMPLIANCE CERTIFICATE
Please send all Required Reporting to: | Eric Berlin |
East West Bank
555 Montgomery Street, 9th Floor
San Francisco, CA 94111
***@***
FROM: | MAXWELL TECHNOLOGIES, INC. |
The undersigned authorized Officer of Maxwell Technologies, Inc. (“Borrower”), hereby certifies that in accordance with the terms and conditions of the Loan and Security Agreement between Borrower and Bank (the “Agreement”), (i) Borrower is in complete compliance for the period ending with all required covenants, including without limitation the ongoing registration of intellectual property rights in accordance with Section 6.8, except as noted below and (ii) all representations and warranties of Borrower stated in the Agreement are true and correct in all material respects as of the date hereof. Attached herewith are the required documents supporting the above certification. The Officer further certifies that these are prepared in accordance with Generally Accepted Accounting Principles (GAAP), where applicable, and are consistently applied from one period to the next except as explained in an accompanying letter or footnotes.
Please indicate compliance status by circling Yes/No/N/A under “Complies” column.
REPORTING COVENANTS | REQUIRED | COMPLIES | ||
Company Prepared Monthly F/S Company Prepared Quarterly F/S | Monthly, within 30 days Quarterly, within 45 days | Yes Yes | No No | N/A N/A |
Compliance Certificate | Monthly, within 30 days | Yes | No | N/A |
CPA Audited, Unqualified F/S, as set forth in 10-K | Annually, within 90 days of FYE | Yes | No | N/A |
Borrowing Base Certificate | Monthly, within 15 days, when loan outstanding > $8,000,000; Quarterly, within 15 days, when loan outstanding <= $8,000,000 | Yes | No | N/A |
A/R and A/P Agings | Monthly, within 15 days | Yes | No | N/A |
Annual Business Plan | Annually, within 30 days of start of FY | Yes | No | N/A |
Intellectual Property Report | Quarterly within 30 days | Yes | No | N/A |
10-Q | Quarterly, within 5 days of SEC filing (50 days) | Yes | No | N/A |
10-K | Annually, within 5 days of SEC filing (95 days) | Yes | No | N/A |
FINANCIAL COVENANTS | REQUIRED | ACTUAL | COMPLIES | |||
Minimum Consolidated Cash | $__________ | $__________ | Yes | No | N/A | |
Minimum Adjusted Quick Ratio (tested quarterly) | 1.20:1:00 | _____:1.00 | Yes | No | N/A | |
4 Quarter Minimum EBITDA (tested quarterly) | $___________ | $__________ | Yes | No | N/A | |
Total Leverage Ratio as of _________, 201_: _________: 1.00.
Please Enter Below Comments Regarding Violations:
The Officer further acknowledges that at any time Borrower is not in compliance with all the terms set forth in the Agreement, including, without limitation, the financial covenants, no credit extensions will be made.
Very truly yours,
MAXWELL TECHNOLOGIES, INC.
Authorized Signer
Name: _____________________________
Title: ________________________________
CORPORATE BORROWING CERTIFICATE
BORROWER: Maxwell Technologies, Inc. DATE: April 12, 2016
BANK: East West Bank
I hereby certify as follows, as of the date set forth above:
1. I am the Secretary, Assistant Secretary or other officer of the Borrower. My title is as set forth below.
2. Borrower’s exact legal name is set forth above. Borrower is a corporation existing under the laws of the State of
Delaware.
3. Attached hereto are true, correct and complete copies of Borrower’s Certificate of Incorporation (including amendments), as filed with the Secretary of State of the state in which Borrower is incorporated as set forth in paragraph 2 above. Such Certificate of Incorporation has not been amended, annulled, rescinded, revoked or supplemented, and remain in full force and effect as of the date hereof.
4. The following resolutions were duly and validly adopted by Borrower’s Board of Directors at a duly held meeting of such directors (or pursuant to a unanimous written consent or other authorized corporate action). Such resolutions are in full force and effect as of the date hereof and have not been in any way modified, repealed, rescinded, amended or revoked, and Bank may rely on them until Bank receives written notice of revocation from Borrower.
RESOLVED, that any one of the following officers or employees of Borrower, whose names, titles and signatures are below, may act on behalf of Borrower:
Name | Title | Signature | Authorized to Add or Remove Signatories | ||
Franz Fink | President & CEO | /s/ Franz Fink | x | ||
David Lyle | Sr. Vice President & CFO | /s/ David Lyle | x | ||
□ | |||||
□ |
RESOLVED FURTHER, that any one of the persons designated above with a checked box beside his or her name may, from time to time, add or remove any individuals to and from the above list of persons authorized to act on behalf of Borrower.
RESOLVED FURTHER, that such individuals may, on behalf of Borrower:
Borrow Money. Borrow money from East West Bank (“Bank”).
Execute Loan Documents. Execute any loan documents Bank requires.
Grant Security. Grant Bank a security interest in any of Borrower’s assets.
Negotiate Items. Negotiate or discount all drafts, trade acceptances, promissory notes, or other indebtedness in which Borrower has an interest and receive cash or otherwise use the proceeds.
Letters of Credit. Apply for letters of credit from Bank.
Foreign Exchange Contracts. Execute spot or forward foreign exchange contracts.
Issue Warrants. Issue warrants for Borrower’s capital stock.
Further Acts. Designate other individuals to request advances, pay fees and costs and execute other documents or agreements (including documents or agreement that waive Borrowers right to a jury trial) they believe to be necessary to effectuate such resolutions.
RESOLVED FURTHER, that all acts authorized by the above resolutions and any prior acts relating thereto are ratified.
5. The persons listed above are Borrower’s officers or employees with their titles and signatures shown next to their names.
MAXWELL TECHNOLOGIES, INC.
By: /s/ David Lyle
Name: David Lyle
Title: Sr. Vice President & CFO
*** If the Secretary, Assistant Secretary or other certifying officer executing above is designated by the resolutions set forth in paragraph 4 as one of the authorized signing officers, this Certificate must also be signed by a second authorized officer or director of Borrower.
I, the _Corporate Counsel & CCO____ of Borrower, hereby certify as to paragraphs 1 through 5 above, as [print title]
of the date set forth above.
By: /s/ Emily Lough
Name: Emily Lough
Title: Corporate Counsel & CCO