Highpower International, Inc. Contracts & Agreements

370 Contracts & Agreements
Browse by Contract Category
Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
First Amendment to Rights Agreement between Highpower International, Inc. and Computershare Trust Company, N.A.
Modification Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
DE
2019
Option Cancellation Agreement between Highpower International, Inc. and Option Holder
Separation Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Comprehensive Credit Agreement between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank Shenzhen Branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Guaranteed Maximum Liability Contract between China Everbright Bank and Icon Energy Systems (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Guaranteed Maximum Liability Agreement between Pan Dangyu and China Everbright Bank Co., Ltd., Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Guaranteed Maximum Liability Contract between China Everbright Bank and Yin Zhoutao as Guarantor for Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Guaranteed Maximum Liability Contract between Huizhou Highpower Technology Co., Ltd. and China Everbright Bank Co., Ltd., Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Guaranteed Maximum Liability Agreement between Springpower Technology (Shenzhen) Co., Ltd. and China Everbright Bank Co., Ltd., Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Working Capital Loan Agreement between Springpower Technology (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Comprehensive Credit Agreement between Springpower Technology (Shenzhen) Co., Ltd. and China Everbright Bank Co., Ltd. Shenzhen Branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Guaranteed Maximum Liability Contract between China Everbright Bank and Icon Energy Systems (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Guaranteed Maximum Liability Contract between China Everbright Bank and Pan Dangyu as Guarantor for Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Guaranteed Maximum Liability Contract (Natural Person Guarantor) between Yin Zhoutao and China Everbright Bank Co., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Guaranteed Maximum Liability Contract between Huizhou Highpower Technology Co., Ltd. and China Everbright Bank Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Guaranteed Maximum Liability Contract between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Working Capital Loan Agreement between Icon Energy System (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Working Capital Loan Agreement between Bank of Jiangsu Co., Ltd. Shenzhen Branch and Icon Energy System (Shenzhen) Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Financing Quota Agreement between Huizhou Highpower Technology Co., Ltd. and Shanghai Pudong Development Bank Co., Ltd. Huizhou Branch
Financing Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Warranty Contract between Shanghai Pudong Development Bank Huizhou Branch and Icon Energy System (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Warranty Contract between Shanghai Pudong Development Bank Huizhou Branch and Pan Dangyu
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Warranty Contract between Shanghai Pudong Development Bank Huizhou Branch and Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Warranty Contract between Shanghai Pudong Development Bank Huizhou Branch and Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Agreement and Plan of Merger among HPJ Parent Limited, HPJ Merger Sub Corp., and Highpower International, Inc. dated June 28, 2019
Merger Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
DE
2019
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Comprehensive Credit Agreement between Springpower Technology (Shenzhen) Company Limited and Bank of Beijing Co., Ltd. Shenzhen Branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Basic Credit Line Agreement between Industrial Bank Co., Ltd., Shenzhen Longgang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Icon Energy System (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Huizhou Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Pan Dangyu for Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Basic Credit Line Agreement between Industrial Bank Co., Ltd., Shenzhen Longgang Branch and Huizhou Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Icon Energy System (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Pan Dangyu for Huizhou Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Working Capital Loan Contract between Springpower Technology (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Comprehensive Credit Line Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Contract between Dangyu Pan and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch (2018)
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Comprehensive Credit Line Contract between Icon Energy System (Shenzhen) Company Limited and Bank of Jiangsu, Shenzhen Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Contract between Shenzhen Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Agreement between Springpower Technology (Shenzhen) Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Agreement between Huizhou Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Comprehensive Credit Line Contract between Springpower Technology (Shenzhen) Co., Ltd and Bank of Jiangsu, Shenzhen Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Agreement between Icon Energy System (Shenzhen) Company Limited and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Guaranty Agreement between Huizhou Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Working Capital Loan Agreement between Icon Energy System (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Collateral Contract Between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Employment Contract between Shenzhen Highpower Technology Co., Ltd. and Sunny Pan (CFO)
Employment Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Working Capital Loan Agreement between Icon Energy System (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Working Capital Loan Agreement between Icon Energy System (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Loan Agreement between Ping An Bank Co., Ltd. Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Comprehensive Credit Line Agreement between Icon Energy System (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Amount Guaranty Agreement between Huizhou Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Amount Guaranty Contract between Dangyu Pan and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Amount Guaranty Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Amount Guaranty Agreement between Shenzhen Highpower Technology Co., Ltd and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Comprehensive Credit Line Contract between Springpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Amount Guaranty Agreement between Huizhou Highpower Technology Co., Ltd and Bank of China
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Amount Guaranty Agreement between Dangyu Pan and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Amount Guaranty Agreement between Shenzhen Highpower Technology Co., Ltd and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Comprehensive Credit Line Contract between Guangdong Huaxing Bank Co., Ltd. Huizhou Branch and Huizhou Highpower Technology Co. Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Suretyship Guaranty Contract between Guangdong Huaxing Bank Co., Ltd. Huizhou Branch and Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Suretyship Guaranty Contract between Guangdong Huaxing Bank Co., Ltd. Huizhou Branch and Pan Dangyu
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Pledge Guaranty Contract between Guangdong Huaxing Bank Co., Ltd. Huizhou Branch and Huizhou Highpower Technology Co. Ltd.
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Loan Agreement between Pan Dangyu and Shenzhen Highpower Technology Co., Ltd. dated July 20, 2018
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Comprehensive Credit Line Agreement between Ping An Bank Co., Ltd. Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between Ping An Bank Co., Ltd. Shenzhen Branch and Springpower Technology (Shenzhen) Company Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between Ping An Bank Co., Ltd. Shenzhen Branch and Huizhou Highpower Technology Company Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between Ping An Bank Co., Ltd. Shenzhen Branch and Dangyu Pan for Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Working Capital Loan Agreement between Springpower Technology (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Comprehensive Credit Agreement between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank Shenzhen Branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Guaranteed Maximum Liability Contract between Springpower Technology (Shenzhen) Co., Ltd. and China Everbright Bank
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Guaranteed Maximum Liability Contract between Huizhou Highpower Technology Co., Ltd. and China Everbright Bank Co., Ltd., Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Guaranteed Maximum Liability Agreement between Icon Energy Systems (Shenzhen) Co., Ltd. and China Everbright Bank Co., Ltd., Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Guaranteed Maximum Liability Agreement between China Everbright Bank and Yin Zhoutao as Guarantor for Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Comprehensive Credit Agreement between Springpower Technology (Shenzhen) Co., Ltd. and China Everbright Bank Co., Ltd. Shenzhen Branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Guaranteed Maximum Liability Contract between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Guaranteed Maximum Contract between Huizhou Highpower Technology Co., Ltd. and China Everbright Bank Co., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Guaranteed Maximum Liability Contract between Lcon Energy Systems (Shenzhen) Co., Ltd. and China Everbright Bank Co., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Guaranteed Maximum Liability Agreement between China Everbright Bank and Yin Zhoutao as Guarantor for SPRIINGPOWER TECHNOLOGY (SHENZHEN) CO., LTD.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Basic Credit Line Contract between Industrial Bank Co., Ltd., Shenzhen Longgang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Amount Guaranty Agreement between Industrial Bank Co., Ltd., Shenzhen Longgang Branch and Pan Dangyu for Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Working Capital Loan Agreement between Springpower Technology (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Comprehensive Credit Granting Contract between Shenzhen Highpower Technology Co., Ltd. and China Minsheng Banking Corp., Ltd. Shenzhen Branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Financing Contract between Springpower Technology (Shenzhen) Co., Ltd. and Huaxia Bank Co., Ltd.
Financing Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Comprehensive Credit Line Contract between Guangdong Huaxing Bank Co., Ltd. Huizhou Branch and Huizhou Highpower Technology Co. Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Suretyship Guaranty Contract between Guangdong Huaxing Bank Co., Ltd. Huizhou Branch and Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Pledge Guaranty Contract between Guangdong Huaxing Bank Co., Ltd. Huizhou Branch and Huizhou Highpower Technology Co. Ltd.
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Highpower International, Inc. 2017 Omnibus Incentive Plan
Bonus & Incentive Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
DE
2017
Working Capital Loan Agreement between Icon Energy System (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Comprehensive Credit Line Contract between Icon Energy System (Shenzhen) Company Limited and Bank of Jiangsu, Shenzhen Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Personal Joint Responsibility Guarantee between Guarantor and Bank of Jiangsu for Icon Energy System (Shenzhen) Company Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Personal Joint Responsibility Guarantee between Bank of Jiangsu and Guarantor for Icon Energy System (Shenzhen) Company Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Basic Credit Line Contract between Industrial Bank Co., Ltd., Shenzhen Longgang Branch and Huizhou Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Pan Dangyu for Huizhou Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Icon Energy System (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Supplementary Credit Line Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Loan Agreement among Shenzhen Pow-Tech New Power Co., Ltd., Shenzhen Highpower Technology Co., Ltd., and Dangyu Pan dated May 20, 2017
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Comprehensive Credit Line Contract between Springpower Technology (Shenzhen) Co., Ltd and Bank of Jiangsu, Shenzhen Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Equity Transfer and Capital Increase Agreement between Xiamen Jiupai Yuanjiang New Power Equity Investment Funds Partnership and Huizhou Yipeng Energy Technology Co., Ltd.
Equity Distribution Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Comprehensive Credit Line Agreement between Ping An Bank Co., Ltd. Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Basic Credit Line Agreement between Industrial Bank Co., Ltd., Shenzhen Longgang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Guaranty Agreement between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Pan Dangyu for Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Comprehensive Credit Agreement between Springpower Technology (Shenzhen) Co., Ltd. and China Everbright Bank Co., Ltd. Shenzhen Branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Comprehensive Credit Agreement between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank Shenzhen Branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Comprehensive Credit Granting Contract between Shenzhen Highpower Technology Co., Ltd. and China Minsheng Banking Corp., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Guarantee Contract between Huizhou Highpower Technology Co., Ltd. and China Minsheng Banking Corp., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Guarantee Contract between Springpower Technology Co., Ltd. and China Minsheng Banking Corp., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Employment Agreement between Hong Kong Highpower Technology Co., Ltd. and Sunny Pan
Employment Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Working Capital Loan Agreement between Ganzhou Highpower Technology Co. Ltd. and Bank of Ganzhou Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Guarantee Contract between Shenzhen Highpower Technology Co., Ltd. and Bank of Ganzhou Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Comprehensive Credit Line Agreement between Icon Energy System (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Guaranty Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Working Capital Loan Agreement between Icon Energy System (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Comprehensive Credit Line Agreement between Shenzhen Highpower Technology and Bank of China
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Collateral Agreement between Shenzhen Highpower Technology Co., Ltd and Bank of China, Buji Sub-branch
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch (2016)
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Mortgage Contract between Industrial and Commercial Bank of China Shenzhen Henggang Sub-branch and Shenzhen Highpower Technology Co., Ltd.
Mortgage Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Comprehensive Credit Line Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Collateral Pledge Agreement between Ganzhou Highpower Technology Co., Ltd and Bank of China, Buji Sub-branch
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Working Capital Loan Agreement between Springpower Technology (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Working Capital Loan Agreement between Springpower Technology (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Supplementary Agreement to Capital Increase Agreement of Yipeng Energy Technology Co. Ltd. (Highpower International, Inc. and Others)
Contribution Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Supplementary Agreement (II) to Capital Increase Agreement of Yipeng Energy Technology Co. Ltd. among Huizhou Highpower Technology, Founding Team, Investors, and Yipeng Energy...
Contribution Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Supplementary Agreement (III) to Capital Increase Agreement of Yipeng Energy Technology Co. Ltd.
Contribution Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Financing Contract between Springpower Technology (Shenzhen) Co., Ltd. and Huaxia Bank Co., Ltd.
Financing Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Loan Agreement between Ping An Bank Co., Ltd. Shenzhen Xinzhou Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Comprehensive Credit Line Contract between Springpower Technology (Shenzhen) Co., Ltd and Bank of Jiangsu, Shenzhen Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Comprehensive Credit Line Agreement between Ping An Bank Co., Ltd. Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Working Capital Loan Contract between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Comprehensive Credit Line Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Collateral Pledge Agreement between Ganzhou Highpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Comprehensive Credit Line Agreement between Shenzhen Highpower Technology and Bank of China
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Collateral Pledge Agreement between Shenzhen Highpower Technology and Bank of China (2015)
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Collateral Agreement between Shenzhen Highpower Technology and Bank of China (2015)
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Basic Credit Line Agreement between Industrial Bank Co., Ltd., Shenzhen Longgang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Dangyu Pan for Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Comprehensive Credit Granting Contract between Shenzhen Highpower Technology Co., Ltd. and China Minsheng Banking Corp., Ltd. Shenzhen Branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Guarantee Contract between Shupeng Technology (Shenzhen) Co., Ltd. and China Minsheng Banking Corp., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Guarantee Contract between Huizhou Highpower Technology Co., Ltd. and China Minsheng Banking Corp., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Comprehensive Credit Agreement between Springpower Technology (Shenzhen) Co., Ltd. and China Everbright Bank Shenzhen Branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Comprehensive Credit Agreement between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank Shenzhen Branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Pledge Agreement between Industrial Bank Shenzhen Longgang Branch and Shupeng Technology (Shenzhen) Co., Ltd.
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Dangyu Pan for Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Comprehensive Credit Line Contract between Shenzhen Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Comprehensive Credit Line Contract between Springpower Technology (Shenzhen) Co., Ltd and Bank of Jiangsu, Shenzhen Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Credit Line Agreement between Springpower Technology (Shenzhen) Company Limited and SHEN ZHEN BAO AN GUIYIN COUNTY BANK
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Common Stock Purchase Warrant Agreement between Highpower International, Inc. and Ardour Capital Investments, LLC
Warrant Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Comprehensive Credit Granting Contract between Shenzhen Highpower Technology Co., Ltd. and China Minsheng Banking Corp., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Maximum Guarantee Contract between Springpower Technology (Shenzhen) Co., Ltd. and China Minsheng Banking Corp., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Maximum Guarantee Contract between Huizhou Highpower Technology Co., Ltd. and China Minsheng Banking Corp., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Highpower International, Inc. Warrant Agreement with Jian Ke (Patrick J. Ko) Dated January 17, 2014
Warrant Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
DE
2014
Common Stock Purchase Warrant Agreement between Highpower International, Inc. and Holder (April 2014)
Warrant Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Banking Facility Agreement between The Shanghai Commercial & Savings Bank, Ltd., Hong Kong Branch and Hong Kong Highpower Technology Company Limited
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Additional Term Loan Facility Agreement between Industrial and Commercial Bank of China (Macau) Limited and Hong Kong Highpower Technology Company Limited
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Revolving Short-Term Secured Loan Facility Agreement between The Shanghai Commercial & Savings Bank, Ltd. (Hong Kong Branch) and Hong Kong Highpower Technology Company Limited
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Term Loan Facility Agreement between Industrial and Commercial Bank of China (Macau) Limited and Hong Kong Highpower Technology Company Limited
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Revolving Short-Term Secured Loan Facility Agreement between The Shanghai Commercial & Savings Bank, Ltd. (Hong Kong Branch) and Hong Kong Highpower Technology Company Limited
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Revolving Short-Term Secured Loan Facility Agreement between The Shanghai Commercial & Savings Bank, Ltd., Hong Kong Branch and Hong Kong Highpower Technology Company Limited
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Wing Lung Bank Facility Offer Letter to Hong Kong Highpower Technology Company Limited (April 2012)
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Term Loan Agreement between Wing Lung Bank Limited and Hong Kong Highpower Technology Company Limited (August 29, 2011)
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Banking Facility Agreement between Standard Chartered Bank (China) Limited and Shenzhen Highpower Technology Co., Ltd.
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Standard Chartered Bank Facility Letter with Hong Kong Highpower Technology Company Limited (January 21, 2011)
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
USD Term Loan Facility Agreement between Wing Lung Bank Limited and Hong Kong Highpower Technology Company Limited
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Uncommitted Short Term Revolving Facility Agreement between Citibank (China) Co., Ltd. Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd.
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Uncommitted Short Term Revolving Facility Agreement between Citibank (China) Co., Ltd. Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd. and Springpower Technology...
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Employment Agreement between Hong Kong Highpower Technology, Inc. and Henry Ngan (Chief Financial Officer)
Employment Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2009
Guaranty Agreement for RMB 36,360,000 Line of Credit – Shenzhen Buji Subbranch of Bank of China and Guarantor for Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2009
Underwriting Agreement between Hong Kong Highpower Technology, Inc. and WestPark Capital, Inc. (2008)
Underwriting Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2008
Registration Rights Agreement among SRKP 11, Inc., Hong Kong Highpower Technology Co., Ltd., and Certain Shareholders
Registration Rights Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2008
Common Stock Purchase Agreement between SRKP 11, Inc. and Charles Frisco
Purchase Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2007
Indemnification Agreement between Highpower International, Inc. and Director/Officer
Indemnification Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
DE
2019
Maximum Warranty Guarantee Agreement between Icon Energy System (Shenzhen) Company Limited and Bank of Beijing Co., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Warranty Contract between Huizhou Highpower Technology Co., Ltd. and Bank of Beijing Co., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Warranty Contract between Shenzhen Highpower Technology Co., Ltd. and Bank of Beijing Co., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Warranty Contract between PAN Dangyu and Bank of Beijing Co., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Personal Joint Responsibility Guarantee between Bank of Jiangsu and Icon Energy System (Shenzhen) Company Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Amount Personal Joint Responsibility Guarantee between Bank of Jiangsu and Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Guaranteed Maximum Liability Agreement between Pan Dangyu and China Everbright Bank for Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Guaranteed Maximum Liability Agreement between China Everbright Bank and Pan Dangyu as Guarantor for SPRIINGPOWER TECHNOLOGY (SHENZHEN) CO., LTD.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract among Pan Dangyu, China Minsheng Banking Corp., Ltd. Shenzhen Branch, and Others
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between Huizhou Highpower Technology Co., Ltd. and China Minsheng Banking Corp., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between Springpower Technology (Shenzhen) Co., Ltd. and China Minsheng Banking Corp., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Personal Maximum Guarantee Contract between Pan Dangyu and Huaxia Bank Co., Ltd. (2017-2018)
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Personal Maximum Guarantee Contract between Yin Zhoutao and Huaxia Bank Co., Ltd. (2017)
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between Huizhou Highpower Technology Co., Ltd. and Huaxia Bank Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between Icon Energy System (Shenzhen) Co., Ltd. and Huaxia Bank Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between Shenzhen Highpower Technology Co., Ltd. and Huaxia Bank Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Suretyship Guaranty Contract between Guangdong Huaxing Bank Co., Ltd. Huizhou Branch and Pan Dangyu
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Amount Guaranty Contract between Huizhou Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Guaranty Contract between Shenzhen Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Rights Agreement between Highpower International, Inc. and Corporate Stock Transfer, Inc. (2017)
Registration Rights Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
DE
2017
Maximum Amount Personal Joint Responsibility Guarantee between Bank of Jiangsu and Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Guaranty Agreement between Huizhou Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Guaranty Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Guaranty Agreement between Icon Energy System Company Limited and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Guarantee Contract between Ping An Bank Co., Ltd. Shenzhen Branch and Dangyu Pan
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Guarantee Contract between Ping An Bank Co., Ltd. Shenzhen Branch and Huizhou Highpower Technology Company Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Guarantee Contract between Ping An Bank Co., Ltd. Shenzhen Branch and Springpower Technology (Shenzhen) Company Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Guaranty Contract between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Guaranteed Maximum Liability Contract between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Guaranteed Maximum Contract between Huizhou Highpower Technology Co., Ltd. and China Everbright Bank (Shenzhen Branch)
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Guaranteed Maximum Liability Agreement between Icon Energy Systems Co., Ltd. and China Everbright Bank Co., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Guaranteed Maximum Liability Agreement between China Everbright Bank and Pan Dangyu (as Guarantor) for Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Guaranteed Maximum Contract between China Everbright Bank and Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Guaranteed Maximum Liability Agreement between Huizhou Highpower Technology Co., Ltd. and China Everbright Bank Co., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Guaranteed Maximum Liability Agreement between Icon Energy Systems (Shenzhen) Co., Ltd. and China Everbright Bank
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Guaranteed Maximum Liability Agreement between China Everbright Bank and Pan Dangyu (Guarantor) for Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Guarantee Contract between Pan Dangyu, China Minsheng Banking Corp., Ltd. Shenzhen Branch, and Others
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Invoice Discounting/Factoring Agreement Offer Letter between HSBC and Hong Kong Highpower Technology Company Limited (August 26, 2016)
Financing Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Guarantee Contract between Gui Jinming and Bank of Ganzhou Co., Ltd. Development Zone Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Guarantee Contract between Li Xianbai and Bank of Ganzhou for Loan to Ganzhou Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Guarantee Contract between Ou Hancheng and Bank of Ganzhou Co., Ltd. (Development Zone Sub-branch)
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Guarantee Contract between Zhu Jie and Bank of Ganzhou Co., Ltd. (Development Zone Sub-branch)
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Guaranty Agreement between Dangyu Pan and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Guaranty Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Guaranty Agreement between Huizhou Highpower Technology Co., Ltd. and Bank of China
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Guaranty Contract between Dangyu Pan and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Guaranty Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Guaranty Agreement between Dangyu Pan and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Guaranty Agreement between Shenzhen Highpower Technology Co., Ltd and Bank of China
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Guaranty Agreement between Huizhou Highpower Technology Co., Ltd. and Bank of China
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Equity Transfer and Capital Increase Agreement between Huizhou Highpower Technology Co., Ltd. and Huizhou Yipeng Energy Technology Co., Ltd.
Equity Distribution Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Investment Cooperation Agreement among Shenzhen PowTech Equity Investment LP, Shenzhen Highpower Technology Co., Ltd., and Pan Dangyu
Financing Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Investment Cooperation Agreement among Wei Linwei, Shenzhen Highpower Technology Co., Ltd., and Pan Dangyu
Financing Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Personal Maximum Guarantee Contract between Yin Zhoutao and Huaxia Bank Co., Ltd. (2016)
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Personal Maximum Guarantee Contract between Pan Dangyu and Huaxia Bank Co., Ltd. (2016)
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Guarantee Contract between Icon Energy System (Shenzhen) Co., Ltd. and Huaxia Bank Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Guarantee Contract between Huizhou Highpower Technology Co., Ltd. and Huaxia Bank Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Guarantee Contract between Shenzhen Highpower Technology Co., Ltd. and Huaxia Bank Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Invoice Discounting / Factoring Agreement Offer Letter between HSBC and Hong Kong Highpower Technology Co Limited
Financing Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Limited Amount Guarantee Agreement between The Hongkong and Shanghai Banking Corporation Limited and Guarantor
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Limited Guarantee Agreement between Guarantor and The Hongkong and Shanghai Banking Corporation Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Limited Amount Guarantee Agreement between The Hongkong and Shanghai Banking Corporation Limited and Guarantor(s)
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Limited Amount Guarantee Agreement between The Hongkong and Shanghai Banking Corporation Limited and Guarantor(s)
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Personal Joint Responsibility Guarantee between Bank of Jiangsu and Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Guaranty Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Guaranty Agreement between Icon Energy System Company Limited and Bank of Jiangsu
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Guarantee Contract between Ping An Bank Co., Ltd. Shenzhen Branch and Dangyu Pan for Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Guarantee Contract between Pingan Bank Co., Ltd. Shenzhen Branch and Springpower Technology (Shenzhen) Company Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Guaranty Contract of Maximum Amount between Industrial and Commercial Bank of China Ltd, Shenzhen Henggang Branch and Hong Kong Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Guaranty Contract of Maximum Amount between Industrial and Commercial Bank of China Ltd, Shenzhen Henggang Branch and Dangyu Pan
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Guaranty Contract of Maximum Amount between Industrial and Commercial Bank of China Ltd, Shenzhen Henggang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Amount Guaranty Agreement between Shenzhen Highpower Technology and Bank of China
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Guaranty Agreement between Huizhou Highpower Technology (Shenzhen) Co., Ltd and Bank of China
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Guaranty Agreement between Dangyu Pan and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Guaranty Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Guaranty Agreement between Dangyu Pan and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Working Capital Loan Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Guaranty Agreement between Industrial Bank Co., Ltd. Shenzhen Longgang Branch and Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Guarantee Contract among Pan Dangyu, China Minsheng Banking Corp., Ltd. Shenzhen Branch, and Others
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Working Capital Loan Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Guaranteed Maximum Contract between China Everbright Bank and Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Guaranteed Maximum Contract between China Everbright Bank and Icon Energy Systems (Shenzhen) Co., Ltd. as Guarantor for Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Guaranteed Maximum Contract between Huizhou Highpower Technology Co., Ltd. and China Everbright Bank Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Guaranteed Maximum Liability Agreement between China Everbright Bank and Pan Dangyu for Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Guaranteed Maximum Contract between Springpower Technology (Shenzhen) Co., Ltd. and China Everbright Bank Co., Ltd. Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Guaranteed Maximum Contract between China Everbright Bank and Icon Energy Systems (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Guaranteed Maximum Contract between Huizhou Highpower Technology Co., Ltd. and China Everbright Bank (Shenzhen Branch)
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Guaranteed Maximum Contract between China Everbright Bank and Pan Dangyu as Guarantor for Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Basic Credit Line Agreement between Industrial Bank Co., Ltd., Shenzhen Longgang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Guaranty Agreement between Industrial Bank Co., Ltd., Shenzhen Longgang Branch and Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Comprehensive Credit Line Agreement between Ping An Bank Co., Ltd. Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Loan Agreement between Ping An Bank Co., Ltd. Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Guarantee Contract between Ping An Bank Co., Ltd. Shenzhen Branch and Pan Dangyu for Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Guarantee Contract between Ping An Bank Co., Ltd. Shenzhen Branch and Springpower Technology (Shenzhen) Company Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Personal Joint Responsibility Guarantee between Guarantor and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Guaranty Agreement between Springpower Technology (Shenzhen) Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Personal Joint Responsibility Guarantee between Bank of Jiangsu and Guarantor for Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Amount Guaranty Agreement between Icon Energy System Company Limited and Bank of Jiangsu, Shenzhen Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Guarantee Contract between Pan Dangyu and SHEN ZHEN BAO AN GUIYIN COUNTY BANK
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Maximum Guarantee Contract between Shenzhen Highpower Technology Co., Ltd. and SHEN ZHEN BAO AN GUIYIN COUNTY BANK
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Comprehensive Credit Line Contract between Springpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Maximum Amount Guaranty Agreement between Shenzhen Highpower Technology and Bank of China
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Maximum Amount Guaranty Agreement between Huizhou Highpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Maximum Amount Guaranty Contract between Dangyu Pan and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Maximum Amount Guaranty Agreement between Wenliang Li and Bank of China, Buji Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Working Capital Loan Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Maximum Guarantee Contract among Pan Dangyu, China Minsheng Banking Corp., Ltd. Shenzhen Branch, and Others
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Trade Financing Master Agreement between Shenzhen Highpower Technology Co., Ltd. and China Minsheng Banking Corp., Ltd.
Financing Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Comprehensive Credit Granting Contract between China CITIC Bank Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd. & Springpower Technology (Shenzhen) Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Guaranty Contract of Maximum Amount between Springpower Science & Technology (Shenzhen) Co., Ltd. and China CITIC Bank Corporation Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Guaranty Contract of Maximum Amount between Shenzhen Haopeng Science & Technology Co., Ltd. and China CITIC Bank Corporation Limited Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Guaranty Contract of Maximum Amount between Huizhou Highpower Science & Technology Co., Ltd. and China CITIC Bank Corporation Limited Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Guaranty Contract of Maximum Amount between Pan Yudang and China CITIC Bank Corporation Limited Shenzhen Branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Loan and Foreign Exchange Facility Agreement between China Construction Bank (Asia) and Hong Kong Highpower Technology Company Ltd
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Working Capital Loan Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Comprehensive Credit Line Agreement between Shenzhen Highpower Technology and Bank of China
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Exclusive Placement Agent Agreement between Highpower International, Inc. and Ardour Capital Investments, LLC (April 13, 2014)
Highpower International, Inc.
Electronic Equipment, Instruments & Components
NY
2014
Securities Purchase Agreement between Highpower International, Inc. and Purchasers (April 14, 2014)
Purchase Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
NY
2014
Comprehensive Credit Line Agreement between Ping An Bank Co., Ltd. Shenzhen Xinzhou Branch and Shenzhen Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Loan Agreement between Ping An Bank Co., Ltd. Shenzhen Xinzhou Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Maximum Guarantee Contract between Pingan Bank Co., Ltd. Shenzhen Xinzhou Branch and Pan Dangyu for Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Maximum Guarantee Contract between Pingan Bank Co., Ltd. Shenzhen Xinzhou Branch and Springpower Technology (Shenzhen) Company Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Maximum Amount Comprehensive Credit Line Contract between Shenzhen Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of Jiangsu
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Basic Credit Line Agreement between Industrial Bank Co., Ltd., Shenzhen Longgang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Working Capital Loan Agreement between Industrial Bank Co., Ltd., Shenzhen Longgang Branch and Springpower Technology (Shenzhen) Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Comprehensive Credit Line Agreement between Springpower Technology (Shenzhen) Co., Ltd. and China Everbright Bank Shenzhen Longhua Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Working Capital Loan Agreement between China Everbright Bank Shenzhen Longhua Sub-branch and Springpower Technology (Shenzhen) Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Maximum Amount Comprehensive Credit Line Contract between Springpower Technology (Shenzhen) Co., Ltd and Bank of Jiangsu, Shenzhen Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Working Capital Loan Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of Jiangsu, Shenzhen Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Comprehensive Credit Line Agreement between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank Shenzhen Longhua Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Working Capital Loan Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Comprehensive Credit Line Contract between China CITIC Bank Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Comprehensive Credit Line Agreement between Shenzhen Highpower Technology and Bank of China
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Comprehensive Credit Line Agreement between Springpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Revolving Short-Term Secured Loan Facility Agreement between The Shanghai Commercial & Savings Bank, Ltd., Hong Kong Branch and Hong Kong Highpower Technology Company Limited
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Comprehensive Credit Line Contract between Shenzhen Development Bank Xinzhou Branch and Shenzhen Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Guaranty Contract of Maximum Amount between Shenzhen Development Bank and Guarantor for Shenzhen Highpower Technology Co. Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Comprehensive Credit Agreement between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank Shenzhen Longhua Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Guaranty Contract of Maximum Amount between Pan Dangyu and China Everbright Bank Shenzhen Longhua Sub-branch
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Working Capital Loan Agreement between Industrial and Commercial Bank of China Ltd, Shenzhen Henggang Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Guaranty Contract of Maximum Amount between Industrial and Commercial Bank of China Ltd, Shenzhen Henggang Branch and Guarantor
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Comprehensive Credit Agreement between Shenzhen Highpower Technology Co., Ltd. and Zhuhai China Resources Bank Co., Ltd., Shenzhen Branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Term Loan Amendment Agreement between Wing Lung Bank Limited and Hong Kong Highpower Technology Company Limited (March 21, 2012)
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Line of Credit Agreement between Bank of China Ltd. Shenzhen Buji Sub-branch and Shenzhen Highpower Technology Co., Ltd. dated January 13, 2012
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Bank Loan Contract for Fixed Assets between Bank of China Ltd. Shenzhen Buji Sub-Branch and Shenzhen Highpower Technology Co., Ltd. dated January 13, 2012
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Guaranty Contract of Maximum Amount between Hong Kong Highpower Technology Co., Ltd and Bank of China (Shenzhen Buji Sub-branch)
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Land Use Right Agreement between Ganzhou Land and Resource Bureau and Ganzhou Highpower Technology Company Limited (January 5, 2012)
Lease Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Comprehensive Line of Credit Agreement between Shenzhen Development Bank Co., Ltd. and Shenzhen Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Maximum Amount Guarantee Agreement between Shenzhen Development Bank and Dangyu Pan for Shenzhen Highpower Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Maximum Amount Guarantee Agreement between Shenzhen Development Bank and Springpower Technology (Shenzhen) Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Current Fund Loan Agreement between Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch and Shenzhen Highpower Technology Co., Ltd.
Loan Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Comprehensive Line of Credit Agreement between Shenzhen Development Bank Co., Ltd. and Shenzhen Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Comprehensive Line of Credit Agreement between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank Shenzhen Longhua Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Non-Commitment Financing Confirmation Letter between Standard Chartered Bank (China) Limited, Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd.
Financing Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Line of Credit Agreement between Shenzhen Development Bank Co., Ltd. and Shenzhen Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Maximum Amount Guarantee Contract between Shenzhen Development Bank and Pan Dangyu for Shenzhen Highpower Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Comprehensive Line of Credit Agreement between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank Shenzhen Longhua Sub-branch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Maximum Amount Guarantee Contract between Standard Chartered Bank (China) Co., Ltd. and Guarantor for Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Uncommitted Demand Credit Facility Agreement between Citibank, N.A., Hong Kong Branch and Hong Kong Highpower Technology Company Limited
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Line of Credit Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China Limited, Shenzhen Buji Subbranch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Guaranty Agreement of Maximum Amount between Pan Dangyu and Shenzhen Buji Subbranch of Bank of China (2010)
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Guaranty Agreement between Pan Dangyu and Citibank (China) Co., Ltd. for Shenzhen Highpower Co., Ltd. Obligations
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Comprehensive Line of Credit Agreement between China Merchants Bank Shenzhen Longgang Sub-branch and Shenzhen Highpower Technology Co., Ltd.
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Irrevocable Maximum Amount Guaranty Agreement between China Merchants Bank and Shenzhen Highpower Technology Co., Ltd.
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Line of Credit Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China Limited, Shenzhen Buji Subbranch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2010
Guaranty Agreement of Maximum Amount between [Guarantor] and Shenzhen Buji Subbranch of Bank of China Limited
Guaranty Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2010
Line of Credit Agreement between Shenzhen Highpower Technology Co., Ltd. and Bank of China Limited, Shenzhen Buji Subbranch
Credit Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2009
Redemption Agreement between SRKP 11, Inc. and Thomas Poletti
Purchase Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
DE
2007