Highpower International, Inc. Business Finance Contracts & Agreements
269 Contracts & Agreements
- Credit Agreements (69 contracts)
- Financing Agreements (3)
- Guarantee Agreements (45)
- Guaranty Agreements (87)
- Loan Agreements (57)
- Pledge Agreements (1)
- Registration Rights Agreements (2)
- Stock Agreements (1)
- Underwriting Agreements (1)
- Warrant Agreements (3)
- Working Capital Loan Contract dated April 30, 2019, between Icon Energy System (Shenzhen) Co., Ltd. and Bank of Jiangsu Co., Ltd Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Working Capital Loan Contract dated June 18, 2019, between Icon Energy System (Shenzhen) Co., Ltd. and Bank of China, Buji Sub-branch (translated to English) (Filed With SEC on August 13, 2019)
- Maximum Amount Guaranty Contract dated March 13, 2019, between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Maximum Amount Guaranty Contract dated March 13, 2019, between Huizhou Highpower Technology Co., Ltd. and China Everbright Bank Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Maximum Amount Guaranty Contract dated March 13, 2019, between Zhou Tao Yin and China Everbright Bank Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Maximum Amount Guaranty Contract dated March 13, 2019, between Dang Yu Pan and China Everbright Bank Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Maximum Amount Guaranty Contract dated March 13, 2019, between Icon Energy System (Shenzhen) Co., Ltd. and China Everbright Bank Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Comprehensive Credit Contract dated April 4, 2019, between Springpower Technology (Shenzhen) Co., Ltd.. and China Everbright Bank Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Working Capital Loan Contract dated May 15, 2019, between Springpower Technology (Shenzhen) Co., Ltd.. and Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch... (Filed With SEC on August 13, 2019)
- Working Capital Loan Contract dated April 25, 2019, between Springpower Technology (Shenzhen) Co., Ltd.. and Bank of China, Buji Sub-branch (translated to English) (Filed With SEC on August 13, 2019)
- Maximum Amount Guaranty Contract dated March 13, 2019, between Springpower Technology (Shenzhen) Co., Ltd. and China Everbright Bank Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Maximum Amount Guaranty Contract dated March 13, 2019, between Huizhou Highpower Technology Co., Ltd. and China Everbright Bank Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Maximum Amount Guaranty Contract dated March 13, 2019, between Zhou Tao Yin and China Everbright Bank Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Maximum Amount Guaranty Contract dated March 13, 2019, between Dang Yu Pan and China Everbright Bank Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Maximum Amount Guaranty Contract dated March 13, 2019, between Icon Energy System (Shenzhen) Co., Ltd. and China Everbright Bank Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Comprehensive Credit Contract dated April 4, 2019, between Shenzhen Highpower Technology Co., Ltd. and China Everbright Bank Shenzhen Branch (translated to English) (Filed With SEC on August 13, 2019)
- Working Capital Loan Contract dated June 25, 2019, between Shenzhen Highpower Technology Co., Ltd. and Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch... (Filed With SEC on August 13, 2019)
- Working Capital Loan Contract dated May 15, 2019, between Shenzhen Highpower Technology Co., Ltd. and Industrial and Commercial Bank of China Ltd. Shenzhen Henggang Branch... (Filed With SEC on August 13, 2019)
- Maximum Amount Guaranty Contract dated March 19, 2019, between Dang Yu Pan and Industrial Bank Co., Ltd., Shenzhen Longgang Branch (translated to English) (Filed With SEC on May 13, 2019)
- Maximum Amount Guaranty Contract dated March 19, 2019, between Shenzhen Highpower Technology Co., Ltd. and Industrial Bank Co., Ltd., Shenzhen Longgang Branch (translated to... (Filed With SEC on May 13, 2019)
- Maximum Amount Guaranty Contract dated March 19, 2019, between Springpower Technology (Shenzhen) Company Limited and Industrial Bank Co., Ltd., Shenzhen Longgang Branch... (Filed With SEC on May 13, 2019)
- Maximum Amount Guaranty Contract dated March 19, 2019, between Icon Energy System (Shenzhen) Company Limited and Industrial Bank Co., Ltd., Shenzhen Longgang Branch (translated to... (Filed With SEC on May 13, 2019)
- Basic Credit Line Contract dated March 19, 2019, between Huizhou Highpower Technology Co., Ltd. and Industrial Bank Co., Ltd., Shenzhen Longgang Branch (translated to English) (Filed With SEC on May 13, 2019)
- Maximum Amount Guaranty Contract dated March 19, 2019, between Dang Yu Pan and Industrial Bank Co., Ltd., Shenzhen Longgang Branch (translated to English) (Filed With SEC on May 13, 2019)
- Maximum Amount Guaranty Contract dated March 19, 2019, between Shenzhen Highpower Technology Co., Ltd. and Industrial Bank Co., Ltd., Shenzhen Longgang Branch (translated to... (Filed With SEC on May 13, 2019)
- Maximum Amount Guaranty Contract dated March 19, 2019, between Huizhou Highpower Technology Co., Ltd. and Industrial Bank Co., Ltd., Shenzhen Longgang Branch (translated to... (Filed With SEC on May 13, 2019)
- Maximum Amount Guaranty Contract dated March 19, 2019, between Icon Energy System (Shenzhen) Company Limited and Industrial Bank Co., Ltd., Shenzhen Longgang Branch (translated to... (Filed With SEC on May 13, 2019)
- Basic Credit Line Contract dated March 19, 2019, between Springpower Technology (Shenzhen) Company Limited and Industrial Bank Co., Ltd., Shenzhen Longgang Branch (translated to... (Filed With SEC on May 13, 2019)
- Comprehensive Credit Line Contract dated January 22, 2019, between Springpower Technology (Shenzhen) Company Limited and Bank of Beijing Co., Ltd. Shenzhen Branch (translated to... (Filed With SEC on May 13, 2019)
- Working Capital Loan Contract dated January 9, 2019, between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch, (translated to English) (Filed With SEC on May 13, 2019)
- Working Capital Loan Contract dated October 9, 2018, between Icon Energy System (Shenzhen) Co. Ltd. and Bank of China, Buji Sub-branch (translated to English) (Filed With SEC on March 28, 2019)
- Maximum Amount Guaranty Contract between Huizhou Highpower Technology (Shenzhen) Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch (translated to English) (Filed With SEC on March 28, 2019)
- Maximum Amount Guaranty Contract between Icon Energy System (Shenzhen) Company, Limited and Bank of Jiangsu, Shenzhen Sub-branch (translated to English) (Filed With SEC on March 28, 2019)
- Maximum Amount Guaranty Contract between Shenzhen Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch (translated to English) (Filed With SEC on March 28, 2019)
- Maximum Amount Comprehensive Credit Line Contract dated October 16, 2018, between Springpower Technology (Shenzhen) Co. Ltd. and Bank of Jiangsu, Shenzhen Sub-branch (translated... (Filed With SEC on March 28, 2019)
- Maximum Amount Guaranty Contract between Huizhou Highpower Technology (Shenzhen) Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch (translated to English) (Filed With SEC on March 28, 2019)
- Maximum Amount Guaranty Contract between Springpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch (translated to English) (Filed With SEC on March 28, 2019)
- Maximum Amount Guaranty Contract between Shenzhen Highpower Technology Co., Ltd. and Bank of Jiangsu, Shenzhen Sub-branch (translated to English) (Filed With SEC on March 28, 2019)
- Maximum Amount Comprehensive Credit Line Contract dated October 16, 2018, between Icon Energy System (Shenzhen) Company Limited and Bank of Jiangsu, Shenzhen Sub-branch... (Filed With SEC on March 28, 2019)
- Working Capital Loan Contract dated December 5, 2018, between Shenzhen Highpower Technology Co., Ltd and Bank of China, Buji Sub-branch (translated to English) (Filed With SEC on March 28, 2019)
