VIASYSTEMS INC Contracts & Agreements

16 Contracts & Agreements
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Indenture for 12.00% Senior Secured Notes Due 2015 between Viasystems, Inc., Guarantors, and Wilmington Trust FSB
Indenture Agreements
VIASYSTEMS INC
DE
2009
Termination and Release Agreement among Viasystems, Inc., Wire Harness Industries, Inc., Wire Harness Contractors, Inc., and The Bank of New York (May 1, 2006)
Release Agreements
VIASYSTEMS INC
2006
Stock Purchase Agreement among Electrical Components International Holdings Company, Viasystems Group, Inc., Wire Harness Holding Company, Inc., and Wire Harness Industries, Inc....
Stock Agreements
VIASYSTEMS INC
IN
2006
Indenture Agreement for 10.50% Senior Subordinated Notes Due 2011 between Viasystems, Inc., Guarantors, and The Bank of New York
Indenture Agreements
VIASYSTEMS INC
NY
2004
Collateral Trust Agreement among Viasystems, Inc., Wilmington Trust FSB, and Other Parties (November 24, 2009)
Trust Agreements
VIASYSTEMS INC
DE
2009
Credit Facility Agreement between Guangzhou Termbray Electronics Technology Co., Ltd and China Construction Bank (August 17, 2009)
Credit Agreements
VIASYSTEMS INC
2009
Maximum-Amount Mortgage Contract between Guangzhou Termbray Electronics Technology Co., Ltd and China Construction Bank (August 17, 2009)
Mortgage Agreements
VIASYSTEMS INC
2009
Fifth Amendment to Credit Agreement among Viasystems Group, Inc., Viasystems, Inc., Lenders, and JPMorgan Chase Bank, N.A. (May 1, 2006)
Credit Agreements
VIASYSTEMS INC
2006
Letter Agreement Regarding Sale of Wire Harness Division and Executive Compensation – Viasystems Group, Inc. and David J. Webster
Separation Agreements
VIASYSTEMS INC
2006
Viasystems Group, Inc. 2003 Stock Option Plan
Equity Distribution Agreements
VIASYSTEMS INC
2006
Third Amendment and First Waiver to Credit Agreement among Viasystems Group, Inc., Viasystems, Inc., Lenders, and JPMorgan Chase Bank
Credit Agreements
VIASYSTEMS INC
NY
2005
Fourth Amendment to Credit Agreement among Viasystems Group, Inc., Viasystems, Inc., Lenders, and JPMorgan Chase Bank, N.A.
Credit Agreements
VIASYSTEMS INC
2005
Viasystems, Inc. Exchange and Registration Rights Agreement for 10.50% Senior Subordinated Notes Due 2011 with Goldman Sachs, Lehman Brothers, and J.P. Morgan
Registration Rights Agreements
VIASYSTEMS INC
NY
2004
First Amended and Restated Prepackaged Joint Plan of Reorganization of Viasystems Group, Inc. and Viasystems, Inc. under Chapter 11
Plan of Reorganization Agreements
VIASYSTEMS INC
NY
2003
Confirmation Order Approving Joint Plan of Reorganization for Viasystems Group, Inc. and Viasystems, Inc.
Plan of Reorganization Agreements
VIASYSTEMS INC
2003
Prepackaged Joint Plan of Reorganization of Viasystems Group, Inc. and Viasystems, Inc. under Chapter 11
Plan of Reorganization Agreements
VIASYSTEMS INC
NY
2002