TTM Technologies, Inc. Contracts & Agreements

TTM Technologies, Inc. 2023 Form of Performance-Based RSU Grant Notice and Award Agreement pursuant to TTM Technologies, Inc. 2023 Incentive Compensation Plan (Filed With SEC on August 10, 2023)

TTM Technologies, Inc. 2023 Form of Restricted Stock Unit Award Grant Notice and Award Agreement (for non-U.S. taxpayers) pursuant to TTM Technologies, Inc. 2023 Incentive... (Filed With SEC on August 10, 2023)

TTM Technologies, Inc. 2023 Form of Restricted Stock Unit Award Grant Notice and Award Agreement (for U.S. taxpayers) pursuant to TTM Technologies, Inc. 2023 Incentive... (Filed With SEC on August 10, 2023)

Letter Agreement, dated as of July 28, 2023, by and between the Company and Daniel L. Boehle (Filed With SEC on August 2, 2023)

Amended & Restated ABL Credit Agreement, dated as of May 30, 2023, by and among TTM Technologies, Inc., as Borrower, the several Lenders from time to time parties thereto,... (Filed With SEC on May 30, 2023)

Amended & Restated Term Loan Credit Agreement, dated as of May 30, 2023, by and among TTM Technologies, Inc., as Borrower, the several Lenders from time to time parties thereto,... (Filed With SEC on May 30, 2023)

Share Purchase Agreement, dated as of April 18, 2022, by and among TTM Technologies, Inc., Exphonics, Inc. and Griffon Corporation (Filed With SEC on April 18, 2022)

Indenture dated as of March 10, 2021, by and among the Company, the Guarantors named therein, and Wilmington Trust, National Association, as Trustee (Filed With SEC on March 10, 2021)

Second Supplemental Indenture dated as of March 9, 2021 by and among the Company, the Guarantors named therein, and Wilmington Trust, National Association, as Trustee (Filed With SEC on March 10, 2021)

Description of the Registrants Securities (Filed With SEC on February 22, 2021)

Description of the Registrants Securities (Filed With SEC on February 26, 2020)

Payment Guarantee, dated January 21, 2020, issued by DBS Bank Ltd, Hong Kong Branch on behalf of the Seller (Filed With SEC on January 22, 2020)

Payment Guarantee, dated January 21, 2020, issued by Bank of China (Hong Kong) Limited on behalf of the Seller (Filed With SEC on January 22, 2020)

Equity Interests Purchase Agreement, dated as of January 20, 2020, by and among TTM Technologies, Inc., TTM Technologies China Limited and AKMMeadville Electronics (Xiamen) Co.,... (Filed With SEC on January 22, 2020)

Chinese Revolver, dated as of July 18, 2019, by and among Shanghai Kaiser Electronics Co., Ltd. and Shanghai Meadville Electronics Co., Ltd., wholly-owned subsidiaries of TTM... (Filed With SEC on August 7, 2019)

TTM Technologies, Inc. Executive Compensation Recoupment Policy (Filed With SEC on February 26, 2019)

Fourth Amendment to Term Loan Credit Agreement, by and among TTM Technologies, Inc., as Borrower, the several Lenders from time to time parties thereto, JPMorgan Chase Bank, N.A.,... (Filed With SEC on April 18, 2018)

Third Amendment to Term Loan Credit Agreement, by and among TTM Technologies, Inc., as Borrower, the several Lenders from time to time parties thereto, JPMorgan Chase Bank, N.A.,... (Filed With SEC on December 14, 2017)

Commitment Letter, dated as of December 1, 2017, by and between TTM Technologies, Inc. and Barclays Bank PLC (Filed With SEC on December 4, 2017)

Stock Purchase Agreement, dated as of December 1, 2017, by and among Anaren Holdings LLC, Anaren Holding Corp., and TTM Technologies, Inc (Filed With SEC on December 4, 2017)

Second Amendment to Term Loan Credit Agreement, by and among TTM Technologies, Inc., as Borrower, the several Lenders from time to time parties thereto, JPMorgan Chase Bank, N.A.,... (Filed With SEC on September 29, 2017)

Indenture dated as of September 28, 2017, by and among the Company, the Guarantors named therein, and Wilmington Trust, National Association, as Indenture Trustee (Filed With SEC on September 29, 2017)

TTM TECHNOLOGIES, INC. 12,000,000 Shares of Common Stock Underwriting Agreement (Filed With SEC on November 18, 2016)

FIRSTAMENDMENT (Filed With SEC on November 3, 2016)

TTM TECHNOLOGIES, INC. 2014 INCENTIVE COMPENSATION PLAN As Amended May 12, 2016 TTM TECHNOLOGIES 2014 INCENTIVE COMPENSATION PLAN, As Amended May 12, 2016 (Filed With SEC on May 18, 2016)

FORM OF EXECUTIVE CHANGE IN CONTROL SEVERANCE AGREEMENT (Filed With SEC on May 6, 2016)

SECOND AMENDMENT TO SHAREHOLDERS AGREEMENT (Filed With SEC on January 4, 2016)

FIRST AMENDMENT TO REISTRATION RIGHTS AGREEMENT (Filed With SEC on January 4, 2016)

TTM TECHNOLOGIES, INC. 2014 INCENTIVE COMPENSATION PLAN 2015 RESTRICTED STOCK UNIT AWARD GRANT NOTICE NON-EMPLOYEE DIRECTOR (Filed With SEC on August 10, 2015)

ABL CREDIT AGREEMENT among TTM TECHNOLOGIES, INC. asBorrower, The Several Lenders from Time to Time Parties Hereto, JPMORGAN CHASE BANK, N.A., asAdministrative Agent, BARCLAYS... (Filed With SEC on June 2, 2015)

REGISTRATION RIGHTS AGREEMENT dated as of May 31, 2015 byand among TTM TECHNOLOGIES, INC., HICKS, MUSE, TATE & FURST EQUITY FUND III, L.P. HM3 COINVESTORS, L.P. HMTF EQUITY FUND... (Filed With SEC on June 2, 2015)

TERM LOAN CREDIT AGREEMENT among TTM TECHNOLOGIES, INC. asBorrower, The Several Lenders from Time to Time Parties Hereto, JPMORGAN CHASE BANK, N.A., asAdministrative Agent,... (Filed With SEC on June 2, 2015)

FACILITYAGREEMENT DATED 22 May 2015 US$150,000,000 ASSET BACKED LOANFACILITY FOR TTMTECHNOLOGIES ENTERPRISES (HK) LIMITED as Borrower arranged by THE HONGKONG ANDSHANGHAI BANKING... (Filed With SEC on May 29, 2015)

TTMTECHNOLOGIES, INC. 2014 INCENTIVE COMPENSATION PLAN 20 RESTRICTED STOCK UNIT AWARD GRANT NOTICE NA EMPLOYEE (Filed With SEC on May 5, 2015)

TTM TECHNOLOGIES, INC. 2014 INCENTIVE COMPENSATION PLAN 20 PERFORMANCE-BASED RSU GRANT NOTICE AND AWARD AGREEMENT (Filed With SEC on May 5, 2015)

FORM OF EXECUTIVE CHANGE IN CONTROL SEVERANCE AGREEMENT (Filed With SEC on May 5, 2015)

TTM TECHNOLOGIES, INC. 2014 INCENTIVE COMPENSATION PLAN 20 RESTRICTED STOCK UNIT AWARD GRANT NOTICE FOREIGN EMPLOYEE (Filed With SEC on May 5, 2015)

FORM OF DIRECTOR ANDOFFICER [AMENDED AND RESTATED] INDEMNIFICATION AGREEMENT (Filed With SEC on December 15, 2014)

JPMORGAN CHASE BANK, N.A. J.P. MORGAN SECURITIES LLC 383Madison Avenue New York, New York 10179 (Filed With SEC on October 27, 2014)

VOTING AGREEMENT (Filed With SEC on September 22, 2014)

AGREEMENT AND PLAN OF MERGER by and among VIASYSTEMSGROUP, INC., TTM TECHNOLOGIES, INC. and VECTOR ACQUISITIONCORP. Dated as of September 21, 2014 TABLE OF CONTENTS (Filed With SEC on September 22, 2014)

Registration Rights Agreement Memorandum of Understanding (Filed With SEC on September 22, 2014)

ADDENDUM TO Registration Rights Agreement dated as of April 9, 2010 (Filed With SEC on September 22, 2014)

JPMORGAN CHASE BANK, N.A. J.P. MORGAN SECURITIES LLC 383Madison Avenue New York, New York 10179 (Filed With SEC on September 22, 2014)

VOTING AGREEMENT (Filed With SEC on September 22, 2014)

FORM OF EXECUTIVE CHANGE IN CONTROL SEVERANCE AGREEMENT (Filed With SEC on August 5, 2014)

JPMorgan Chase Bank, National Association Organised under the laws of the United States as a National Banking Association. Main Office 1111 Polaris Parkway, Columbus, Ohio 43240... (Filed With SEC on January 14, 2014)

$220,000,000 TTMTechnologies, Inc. 1.75% Convertible Senior Notes due 2020 Underwriting Agreement (Filed With SEC on December 20, 2013)

TTM TECHNOLOGIES, INC. AND AMERICAN STOCKTRANSFER & TRUST COMPANY, LLC, as Trustee INDENTURE Dated as of December20, 2013 1.75% Convertible Senior Notes due 2020 TABLE OF CONTENTS (Filed With SEC on December 20, 2013)

JPMorgan Chase Bank, National Association Organised under the laws of the United States as a National Banking Association. Main Office 1111 Polaris Parkway, Columbus, Ohio 43240... (Filed With SEC on December 20, 2013)

EQUITY AWARDS AMENDMENT AGREEMENT (Filed With SEC on August 6, 2013)

CONFIDENTIAL SEPARATION AND RELEASE AGREEMENT AGREEMENT (Filed With SEC on May 7, 2013)

Shengyi Technology Co., Ltd. and TTMTechnologies China Limited on Equity Interest Transfer Agreement in relation to Dongguan Meadville Circuits Limited - 1 - (Filed With SEC on May 7, 2013)

Shengyi Technology Co., Ltd. and TTMTechnologies China Limited on Equity Interest Transfer Agreement in relation to Dongguan Shengyi Electronics Ltd. 1 (Filed With SEC on May 7, 2013)

FIRST AMENDMENT TO SHAREHOLDERS AGREEMENT (Filed With SEC on September 19, 2012)

AMENDMENT NO. 1 TO RESTATED EMPLOYMENT AGREEMENT (Filed With SEC on January 19, 2012)

FORM OF EXECUTIVE CHANGE IN CONTROL SEVERANCE AGREEMENT (Filed With SEC on January 19, 2012)

THE TTM TECHNOLOGIES, INC. EXECUTIVE AND DIRECTOR DEFERRED COMPENSATION PLAN Effective as of October 1, 2011 (Filed With SEC on September 19, 2011)

AMENDMENT LETTER (Filed With SEC on July 27, 2011)

SPECIAL SECURITY AGREEMENT (Filed With SEC on October 22, 2010)

WAIVER AND AMENDMENT LETTER To: TTM Hong Kong Limited (the Company) for itself and as agent for each of the other Obligors party tothe Agreement (as defined below) For the... (Filed With SEC on August 5, 2010)

INDEMNIFICATION AGREEMENT (Filed With SEC on June 2, 2010)

REGISTRATION RIGHTS AGREEMENT (Filed With SEC on April 13, 2010)

SHAREHOLDERS AGREEMENT between TTM TECHNOLOGIES, INC., MEADVILLE HOLDINGS LIMITED, SU SIH (BVI) LIMITED, TANG HSIANG CHIEN, TANG CHUNG YEN, TOM (solely for the purposes of... (Filed With SEC on April 13, 2010)

CREDIT AGREEMENT (Filed With SEC on April 13, 2010)

TTM TECHNOLOGIES, INC. 2006 INCENTIVE COMPENSATION PLAN (Filed With SEC on March 30, 2010)

FORM OF EXECUTIVE CHANGE IN CONTROL SEVERANCE AGREEMENT (Filed With SEC on March 24, 2010)

RESTATED EMPLOYMENT AGREEMENT (Filed With SEC on March 24, 2010)

SELL-DOWN REGISTRATION RIGHTS AGREEMENT (Filed With SEC on December 23, 2009)

STOCK PURCHASE AGREEMENT (Filed With SEC on November 16, 2009)

Organised under the laws of the United States as a National Banking Association. Main Office 1111 Polaris Parkway, Columbus, Ohio 43271 Registered as a branch in England & Wales... (Filed With SEC on May 22, 2008)

JPMorgan Chase Bank, National Association Organised under the laws of the United States as a National Banking Association. Main Office 1111 Polaris Parkway, Columbus, Ohio 43271... (Filed With SEC on May 22, 2008)

Trade Date: May 16, 2008 Effective Date: May 20, 2008; provided that the Effective Dateshall not occur and this Confirmation and theAgreement shall become null and void if UBS has... (Filed With SEC on May 22, 2008)

Entry into a Material Definitive Agreement (Filed With SEC on May 15, 2008)

Current assets (Filed With SEC on August 13, 2007)

Departure of Directors or Certain Officers; Election of Directors.; Appointment of Certain Officers; Compensatory Arrangements of Certain Officers (Filed With SEC on April 12, 2007)

One-stop manufacturing solution. We offer a one-stop manufacturing solution to our customers through our specialized and integrated facilities, some of which focus on different... (Filed With SEC on March 16, 2007)

$240,000,000 (Filed With SEC on November 2, 2006)

Current assets (Filed With SEC on August 14, 2006)

One-stop manufacturing solution. We offer a one-stop manufacturing solution to our customers through our specialized and integrated facilities, each of which generally focuses on... (Filed With SEC on March 14, 2006)

[TTM TECHNOLOGIES LOGO] (Filed With SEC on August 30, 2005)

AGREEMENT AND PLAN OF MERGER (Filed With SEC on August 30, 2005)

$25,000,000 SECOND AMENDED AND RESTATED CREDIT AGREEMENT among TTM TECHNOLOGIES, INC., as Borrower, THE DOMESTIC SUBSIDIARIES OF THE BORROWER FROM TIME TO TIME PARTIES HERETO, as... (Filed With SEC on July 21, 2005)

TTM TECHNOLOGIES, INC. Compensation Plan for Non-Employee Directors Effective as of May 4, 2005 (Filed With SEC on May 11, 2005)

CONSENT AND WAIVER March 27, 2003 (Filed With SEC on May 15, 2003)

AMENDMENT TO CONSENT January6, 2002 (Filed With SEC on May 15, 2003)

Financial Statements of Business Acquired (Filed With SEC on December 27, 2002)

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TTM Technologies, Inc. Contracts & Agreements