Loan Agreement between Wong Chiu Kin and Summit Networks, Inc. dated June 15, 2020
This agreement is between Wong Chiu Kin, a shareholder, and Summit Networks, Inc. Wong Chiu Kin agrees to lend $120,000 to Summit Networks, Inc. to support its merger and acquisition activities. The loan is interest-free and will be repaid by Summit Networks, Inc. after it completes its first financing. The agreement was signed electronically by both parties on June 15, 2020.
Exhibit 10.6
合约LOAN AGREEMENT
日期:2020年6月15日
Date: 15th June 2020
通过电子邮件签署 (sign via email)
甲方 :黄朝健Wong Chiu Kin
乙方:Summit Networks, Inc.
甲乙双方因资金借贷问题达成如下意见。
Party A and Party B agree as following regarding the capital lending.
甲方黄朝健作为乙方的股东,同意为乙方垫付流动资金12万美金,提供并购项目运作支持。
Party A, Wong Chiu Kin, as shareholder of Party B, agrees to lend 120,000 in US dollar to Party B as financial support for merging and acquiring projects.
并确认一下条款:And also confirm the following terms:
1, | 资金用于借贷来入账。 |
The fund can be recorded as loan.
2, | 不计算利息。 |
Interest is not requested.
3, | 在乙方第一次融资后还款。 |
Party B shall repay after the first financing.
甲方Party A: | /s/Wong Chiu Kin | |
Wong Chiu Kin |
乙方Party B: Summit Networks, Inc.
/s/Shu Hua Liu | |
CEO: Shu Hua Liu |
/s/Chao Long Huang | |
CFO: Chao Long Huang |