Loan Agreement, effective August 17, 2021, by and between Xi Wen and Senmiao Technology Limited
Exhibit 10.45
Loan Agreement
Party A: Xi Wen
ID No.: [***]
Party B: Senmiao Technology Limited
For Senmiao Technology Limited (hereinafter referred to as the “Company”), due to the operation needs of the Company and upon consensus through negotiation, Mr. Xi Wen provides the Company with interest-free loan to carry out relevant businesses.
I. | Loan amount: $300,000.00 |
II. | Loan term: three months, calculated from August 17, 2021. Party B may repay all or part of the loan in advance. |
III. | Loan interest: this loan is an interest-free loan. |
IV. | Loan purpose: it shall be used for daily operation of the company, and Party B shall not change the loan purpose. |
V. | The loan shall be remitted to: |
Account Name: Senmiao Technology Limited
Address: 1345 Avenue of the Americas, New York, NY 10105
Bank Name: Chase Bank
Swift Code：CHASUS33
Account number: [***]
VII. | If there are any disputes between both parties on the performance of the agreement, they shall solve them through friendly negotiation; if the negotiation fails, any party can file a lawsuit to Changsha People’s Court for solution. |
VIII. | The agreement is in duplicate, with each party holding one copy respectively. |
| Party B: Senmiao Technology Limited |
Party A: Xi Wen | |
| CFO: /s/ Xiaoyuan Zhang |
| |
Signing date: August 17, 2021 | Signing date: August 17, 2021 |
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Signing place: Chengdu, Sichuan | |
