Loan Agreement between Xi Wen and Senmiao Technology Limited dated August 17, 2021
This agreement is between Xi Wen and Senmiao Technology Limited. Xi Wen is lending $300,000 to the company for three months, starting August 17, 2021. The loan is interest-free and must be used for the company's daily operations. Senmiao Technology Limited can repay the loan early if desired. Any disputes will be resolved first through negotiation, and if unresolved, through the Changsha People’s Court. Both parties have signed and hold a copy of the agreement.
Exhibit 10.45
Loan Agreement
Party A: Xi Wen
ID No.: [***]
Party B: Senmiao Technology Limited
For Senmiao Technology Limited (hereinafter referred to as the “Company”), due to the operation needs of the Company and upon consensus through negotiation, Mr. Xi Wen provides the Company with interest-free loan to carry out relevant businesses.
I. | Loan amount: $300,000.00 |
II. | Loan term: three months, calculated from August 17, 2021. Party B may repay all or part of the loan in advance. |
III. | Loan interest: this loan is an interest-free loan. |
IV. | Loan purpose: it shall be used for daily operation of the company, and Party B shall not change the loan purpose. |
V. | The loan shall be remitted to: |
Account Name: Senmiao Technology Limited
Address: 1345 Avenue of the Americas, New York, NY 10105
Bank Name: Chase Bank
Swift Code：CHASUS33
Account number: [***]
VII. | If there are any disputes between both parties on the performance of the agreement, they shall solve them through friendly negotiation; if the negotiation fails, any party can file a lawsuit to Changsha People’s Court for solution. |
VIII. | The agreement is in duplicate, with each party holding one copy respectively. |
| Party B: Senmiao Technology Limited |
Party A: Xi Wen | |
| CFO: /s/ Xiaoyuan Zhang |
| |
Signing date: August 17, 2021 | Signing date: August 17, 2021 |
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Signing place: Chengdu, Sichuan | |
