SCI Engineered Materials, Inc. Contracts & Agreements

10 Contracts & Agreements
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Filed
Description of Bonding Agreement between the Company and Konfoong Material International Co., Ltd. dated as of December 18, 2018
SCI Engineered Materials, Inc.
Semiconductors & Semiconductor Equipment
2019
Description of Securities of the Company
SCI Engineered Materials, Inc.
2023
Description of Securities of the Company
SCI Engineered Materials, Inc.
Semiconductors & Semiconductor Equipment
2022
Description of Securities of the Company
SCI Engineered Materials, Inc.
2021
Description of Unsecured Promissory Note administered by the U.S. Small Business Administration for funds received April 24, 2020
Note Agreements
SCI Engineered Materials, Inc.
Semiconductors & Semiconductor Equipment
2020
Description of Securities of the Company
SCI Engineered Materials, Inc.
Semiconductors & Semiconductor Equipment
2020
Employment agreement entered into as of December 13, 2018, between Jeremy Young and the Company
Employment Agreements
SCI Engineered Materials, Inc.
2019
FIFTHAMENDMENT TO LOAN DOCUMENTS
Loan Agreements
SCI Engineered Materials, Inc.
2016
SECOND AMENDMENT TOLOAN DOCUMENTS
SCI Engineered Materials, Inc.
Semiconductors & Semiconductor Equipment
2012
FIRST AMENDMENTTO LOAN AGREEMENT
Loan Agreements
SCI Engineered Materials, Inc.
2012