Amendment to Product Development Agreement between Toshiba Corporation and SanDisk Corporation (April 10, 2002)

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Summary

This amendment updates the Product Development Agreement between Toshiba Corporation and SanDisk Corporation to align it with a new master agreement signed on April 10, 2002. The amendment replaces Exhibit B, which details how the companies will share wafer processing costs for jointly developed products and controllers, and adds new requirements for exchanging technical and product development information. All other terms of the original agreement remain unchanged. Payments for shared costs must be made within 60 days of invoicing, and both parties agree to cooperate in financial audits related to these costs.

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EX-10.33 6 dex1033.txt AMDT. TO PRODUCT DEVELOPMENT AGRMT. DATED 04/10/02 EXHIBIT 10.33 AMENDMENT TO PRODUCT DEVELOPMENT AGREEMENT THIS AMENDMENT (the "Amendment") to the Product Development Agreement (the "Agreement"), dated as of May 9, 2000 by and between Toshiba Corporation, a Japanese corporation with a principal place of business at 1-1, Shibaura 1-chome, Minato-ku, Tokyo 105-8001, Japan, (hereinafter "Toshiba"), and SanDisk Corporation, a Delaware corporation with a principal place of business at 140 Caspian Court, Sunnyvale, CA 94089, U. S. A. (hereinafter "SanDisk"), is dated and effective as of April 10, 2002. W I T N E S S E T H - - - - - - - - - - WHEREAS, Toshiba and SanDisk have entered into a New Master Agreement dated as of April 10, 2002; WHEREAS, Toshiba and SanDisk desire to amend the Agreement in order to make it consistent with the terms and conditions of the New Master Agreement. NOW THEREFORE, in consideration of the premises and of the mutual promises herein contained, the parties hereto agree as follows: A G R E E M E N T - - - - - - - - - 1. Amendment to Exhibit B to the Agreement. Exhibit B to the Agreement is --------------------------------------- hereby deleted in its entirety and the Exhibit B attached hereto is substituted in lieu thereof. 2. Information Exchange. Each of Toshiba and SanDisk agree to provide to -------------------- the other party certain information relating to product development, including without limitation, the information set forth on Exhibit D attached hereto. 3. Governing Law. This Amendment shall be governed by and construed in ------------- accordance with the Governing Law provision incorporated by reference into the Agreement. 4. Effect of this Amendment. Except as specifically amended hereby, the ------------------------ Agreement shall remain in full force and effect as in existence on the date hereof and is hereby ratified and confirmed in all respects. 5. Counterparts. This Amendment may be executed in any number of ------------ counterparts which together shall constitute one and the same instrument. [Remainder of Page Intentionally Left Blank] CERTAIN INFORMATION IN THIS EXHIBIT HAS BEEN OMITTED AND FILED SEPARATELY WITH THE COMMISSION. CONFIDENTIAL TREATMENT HAS BEEN REQUESTED WITH RESPECT TO THE OMITTED PORTIONS. IN WITNESS WHEREOF, the parties have executed this Amendment as of the date and year first above written. TOSHIBA CORPORATION By: /s/ Takeshi Nakagawa ---------------------------------------- Name: Takeshi Nakagawa Title: Corporate Senior Vice President President & CEO Semiconductor Company SANDISK CORPORATION By: /s/ Eli Harari ---------------------------------------- Name: Eli Harari Title: President & Chief Executive Officer [Signature Page to Amendment to Product Development Agreement] Exhibit B --------- SHARING OF WAFER PROCESSING COSTS - (For Jointly Developed Products and Jointly Developed Controllers) ------------------------------------------------------------------ Jointly Developed Products -------------------------- SanDisk Toshiba ------- ------- (1) 1H/2000 [***] [***] (2) 2H/2000 [***] [***] (3) 1H/2001 [***] [***] (4) 2H/2001 [***] [***] (5) 1Q/2002 [***] [***] (6) 2Q/2002 [***] [***] (7) 3Q/2002 [***] [***] (8) 4Q/2002 [***] [***] (9) 1Q/2003 and beyond [***] Jointly Developed Controllers ----------------------------- (1) Wafer processing cost associated with Jointly Developed Controllers will be shared by the parties as determined by the Coordinating Committee in accordance with Article 3.2. Note 1: All costs charged pursuant to this Exhibit B are direct costs and have been referred to by the parties as Direct R&D charges. Original back-up information and financial detail of all such charges shall be made available to the party paying the shared expense, and all such charges are subject to financial audit by the external auditors of the party paying the charge. The party receiving payment shall cooperate with all reasonable requests to view and make copies of financial back-up and financial detail material associated with the charges. Note 2: Payments specified above shall be made within sixty (60) days after receipt of invoice issued at the end of each calendar half year. [***] INDICATES THAT CERTAIN INFORMATION ON THIS PAGE HAS BEEN OMITTED AND FILED SEPARATELY WITH THE COMMISSION PURSUANT TO RULE 24B-2. CONFIDENTIAL TREATMENT HAS BEEN REQUESTED WITH RESPECT TO THE OMITTED PORTIONS. Exhibit D --------- Information Exchange
- ------------------------------------------------------------------------------------------------------------------- Name of Report / Data Description Frequency - ------------------------------------------------------------------------------------------------------------------- 17. Status of new technology Details of each new product Monthly - by the 15th day of next qualification and production schedule month - ------------------------------------------------------------------------------------------------------------------- 18. Design rule documentation Description of design rules Whenever change is made - ------------------------------------------------------------------------------------------------------------------- 19. DRC / LVS runset DRC/LVS runset file and version control Whenever change is made - ------------------------------------------------------------------------------------------------------------------- 20. Database of product OPUS data base for each product After tapeout - ------------------------------------------------------------------------------------------------------------------- 21. Feature set change or new New function and specification Making decision jointly Document features sent after finalized - ------------------------------------------------------------------------------------------------------------------- 22. Design review document Description of specification, circuit Before tapeout review and design rule - ------------------------------------------------------------------------------------------------------------------- 23. Characterization report (product AC/DC characteristics At release of new product or level) Reliability and qualification report release of product change - ------------------------------------------------------------------------------------------------------------------- 24. Simulation models SPICE model Beginning of circuit design cycles - ------------------------------------------------------------------------------------------------------------------- 25. Transistor characteristics and Specification for each device, Beginning of circuit design cycles detailed device information Transistor measurement data, Measurement data of each device - ------------------------------------------------------------------------------------------------------------------- 26. Design change / revision history Description of data base revision with Document due after each design design change information change - ------------------------------------------------------------------------------------------------------------------- 27. Preliminary information of new Device Target specification At the time new technology technology development begins - ------------------------------------------------------------------------------------------------------------------- 28. Process cross-section Cross-sectional view At the time of process change and technology - ------------------------------------------------------------------------------------------------------------------- 29. Process flow Current POR At the time of process change and technology - -------------------------------------------------------------------------------------------------------------------