Rambus Inc. (25)

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Contracts

Form of ASR Agreement (Filed With SEC on September 12, 2022)
Director Transition and Consulting Agreement dated March 11, 2022, by and between Rambus Inc. and James Mitarotonda (Filed With SEC on March 11, 2022)
Form of Indemnification Agreement (Filed With SEC on May 7, 2021)
Semiconductor Patent License Agreement, dated June 11, 2013, between Registrant and SK hynix (Filed With SEC on February 26, 2021)
First Amendment to Net Lease Agreement dated April 22, 2020 relating to the New San Jose Headquarters Location between Rambus Inc. and 237 North First Street Holdings, LLC (Filed With SEC on August 7, 2020)
2015 Employee Stock Purchase Plan, as amended (Filed With SEC on May 6, 2020)
Letter agreement dated as of March 11, 2022, among Rambus Inc., Barington Companies Equity Partners, L.P. and certain other parties (Filed With SEC on March 11, 2022)
Description of Securities (Filed With SEC on February 28, 2022)
Employment Agreement for Interim Vice President, Finance and Chief Financial Officer between the Company and Keith Jones, dated as of October 12, 2021 (Filed With SEC on October 13, 2021)
Master Confirmation between Deutsche Bank AG, London Branch, through its agent Deutsche Bank Securities Inc. (Dealer) and Rambus Inc., dated June 15, 2021 (Filed With SEC on June 16, 2021)
Letter agreement dated as of March 12, 2021, among Rambus Inc. and Barington Companies Equity Partners, L.P. and certain other parties (Filed With SEC on March 16, 2021)
Amendment No. 2 dated December 15, 2020, to the Semiconductor Patent License Agreement between Rambus Inc. and Micron Technology, Inc (Filed With SEC on February 26, 2021)
Semiconductor Patent License Agreement, dated December 9, 2013, between Rambus, Inc. and Micron Technology, Inc (Filed With SEC on February 26, 2021)
Settlement Agreement, dated December 9, 2013, between Rambus Inc., Micron Technology, Inc., and certain Micron affiliates (Filed With SEC on February 26, 2021)
Settlement Agreement, dated June 11, 2013, among Registrant, SK hynix and certain SK hynix affiliates (Filed With SEC on February 26, 2021)
Semiconductor Patent License Agreement, dated January 19, 2010, between Registrant and Samsung Electronics Co., Ltd (Filed With SEC on February 26, 2021)
Settlement Agreement, dated January 19, 2010, among Registrant, Samsung Electronics Co., Ltd, Samsung Electronics America, Inc., Samsung Semiconductor, Inc. and Samsung Austin... (Filed With SEC on February 26, 2021)
Master Confirmation between Deutsche Bank AG, London Branch as counterparty, through its agent Deutsche Bank Securities Inc. (Deutsche Bank) and Rambus Inc., dated November 11,... (Filed With SEC on November 12, 2020)
Amendment dated September 2, 2020 relating to Semiconductor Patent License Agreement between Rambus Inc. and Micron Technology, Inc (Filed With SEC on November 6, 2020)
2015 Equity Incentive Plan, as amended (Filed With SEC on May 6, 2020)
Description of Securities (Filed With SEC on February 26, 2020)
2019 Inducement Equity Incentive Plan (Filed With SEC on August 28, 2019)
Form of Performance Based Restricted Stock Unit Agreement (2019 Inducement Equity Incentive Plan) (Filed With SEC on August 28, 2019)
Form of Restricted Stock Unit Agreement (2019 Inducement Equity Incentive Plan) (Filed With SEC on August 28, 2019)
Offer Letter between the Company and Mr. Fan, dated as of August 9, 2019 (Filed With SEC on August 28, 2019)