PAR TECHNOLOGY CORP Contracts & Agreements

92 Contracts & Agreements
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Filed
Indenture, dated as of January 24, 2025, between PAR Technology Corporation, as Issuer, and U.S. Bank Trust Company, National Association, as Trustee
Indenture Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2025
Amended and Restated PAR Technology Corporation, 2015 Equity Incentive Plan, as amended June 3, 2024
Bonus & Incentive Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2024
Stock Purchase Agreement, dated June 7, 2024, by and among Booz Allen Hamilton Inc., PAR Government Systems Corporation, and PAR Technology Corporation
Stock Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2024
Amendment to the Amended and Restated Employment Letter, dated March 25, 2024
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2024
Registration Rights Agreement, dated March 8, 2024, between PAR Technology Corporation and the purchasers identified therein
Registration Rights Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2024
Purchase Agreement, dated March 8, 2024, PAR Technology Corporation, ParTech, Inc., the persons identified as Company Sellers on the signature pages thereto, Longshore Capital...
Purchase Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2024
Scheme Implementation Agreement, dated March 9, 2024, by and between PAR Technology Corporation and TASK Group Holdings Limited
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2024
Securities Purchase Agreement, dated March 7, 2024, between PAR Technology Corporation and the purchasers identified therein
Purchase Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2024
Description of Securities
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2024
Description of Securities
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2023
Amendment to Employment Letter between PAR Technology Corporation and Savneet Singh, dated March 16, 2022
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2022
Transition Services Agreement, dated November 29, 2021, with Matthew Cicchinelli
Transition Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2022
Offer of Employment letter, dated October 28, 2021, to Michael D. Nelson
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2022
Offer of Employment letter, dated October 4, 2021, to Raju Malhotra
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2022
Description of Securities
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2022
First Supplemental Indenture, dated as of September 17, 2021, between PAR Technology Corporation and The Bank of New York Mellon Trust Company, N.A., as Trustee
Indenture Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2021
Base Indenture, dated as of September 17, 2021, between PAR Technology Corporation and The Bank of New York Mellon Trust Company, N.A., as Trustee
Indenture Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2021
Underwriting Agreement, dated as of September 14, 2021 between PAR Technology Corporation and Goldman Sachs & Co. LLC as representative of the Debt Underwriters
Underwriting Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2021
Underwriting Agreement, dated as of September 14, 2021 between PAR Technology Corporation and Goldman Sachs & Co. LLC as representative of the Equity Underwriters
Underwriting Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2021
Agreement and Plan of Merger, dated April 8, 2021, by and among PAR Technology Corporation, ParTech, Inc., Sliver Merger Sub Inc., Punchh Inc. and Fortis Advisors LLC
Merger Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2021
Amendment to Employment Letter between PAR Technology Corporation and Savneet Singh, dated February 16, 2021
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2021
Description of Securities
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2021
Underwriting Agreement, dated September 30, 2020, between the Company and Jefferies LLC
Underwriting Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2020
Amendment, Grant Notice - Restricted Sock Award and the Restricted Stock Award Agreement, effective July 6, 2020, Matthew Cicchinelli, Participant
Stock Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2020
Employment Letter: Service as President, effective July 6, 2020, between PAR Government Systems Corporation and Matthew Cicchinelli
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2020
Employment Letter: Service as Chief Executive Officer, dated February 27, 2020, between PAR Technology Corporation and Savneet Singh
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2020
Form of Amended and Restated PAR Technology Corporation 2015 Equity Incentive Plan - Grant Notices - Restricted Stock Unit Award and Restricted Stock Unit Award Agreement
Bonus & Incentive Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2020
Description of Securities
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2020
Indenture, dated as of February 10, 2020, between PAR Technology Corporation, as Issuer, and The Bank of New York Mellon Trust Company, N.A., as Trustee
Indenture Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2020
Form of Note Repurchase Agreement
Repurchase Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2020
Purchase Agreement, dated February 5, 2020, by and between PAR Technology Corporation and Jefferies LLC, as Initial Purchaser
Purchase Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2020
Interest Purchase Agreement, dated November 7, 2019, by and among The Drew D. Peloubet Family Trust DTD 6/29/09, Steven A. Roberts, Gary Saling, PJCDSG, Inc., ParTech, Inc., PAR...
Purchase Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2019
Bill of Sale, dated September 4, 2019, by and among 3M Company and the Selling Subsidiaries and ParTech, Inc
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2019
Grant Notice - Restricted Stock Award and Restricted Stock Award Agreement, Grant Date May 13, 2019, Savneet Singh
Stock Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2019
Form of Amended and Restated PAR Technology Corporation 2015 Equity Incentive Plan - Grant Notice - Option Award and Option Award Agreement
Bonus & Incentive Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2019
Form of Amended and Restated PAR Technology Corporation 2015 Equity Incentive Plan - Grant Notice - Restricted Stock Award and Restricted Stock Award Agreement
Bonus & Incentive Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2019
Employment Letter: Service as Chief Executive Officer, dated March 22,2019, between PAR Technology Corporation and Savneet Singh
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2019
Indenture, dated as of April 15, 2019, between PAR Technology Corporation, as Issuer, and The Bank of New York Mellon Trust Company, N.A., as Trustee
Indenture Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2019
Purchase Agreement, dated April 10, 2019, by and between PAR Technology Corporation and Jefferies LLC, as Initial Purchaser
Purchase Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2019
Amendment to Option Award Agreement dated December 4, 2018 between PAR Technology Corporation and Donald H. Foley
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2019
Letter of Separation, dated December 4, 2018 from PAR Technology Corporation to Donald H. Foley
Separation Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2019
Amendment to Restricted Stock Award Agreement dated December 4, 2018 between PAR Technology Corporation and Donald H. Foley
Stock Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2019
Consulting Services Agreement dated December 4, 2018 between PAR Technology Corporation and Donald H. Foley
Consulting Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2019
Employment Agreement, dated December 4, 2018, between PAR Technology Corporation and Savneet Singh
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2019
First Amendment to Credit Agreement dated March 4, 2019 among PAR Technology Corporation, the Loan Parties and Citizens Bank, N.A
Loan Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2019
Waiver dated May 8, 2018 among PAR Technology Corporation, ParTech, Inc., Ausable Solutions, Inc., PAR Government Systems Corporation, Rome Research Corporation, Brink Software,...
Waiver Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2018
Restricted Stock Award Agreement, dated March 20, 2018 between PAR Technology Corporation and Donald H. Foley
Stock Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2018
Employment Offer Letter, dated April 11, 2018, between Donald H. Foley and PAR Technology Corporation
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2018
Employment Offer Letter; Amendment dated April 12, 2017, between Karen E. Sammon and PAR Technology Corporation
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2018
PAR Technology Corporation 2015 Equity Incentive Plan - Grant Notice - Option Award and Option Award Agreement (Form Effective November 2017)
Bonus & Incentive Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2018
PAR Technology Corporation 2015 Equity Incentive Plan - Grant Notice - Restricted Stock Award and Restricted Stock Award Agreement (Form Effective November 2017, employees and...
Bonus & Incentive Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2018
Waiver dated March 14, 2018 among PAR Technology Corporation, ParTec, Inc., Ausable Solutions, Inc., PAR Government Systems Corporation, Rome Research Corporation, Brink Software,...
Waiver Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2018
Amendment to Employment Offer Letter, dated March 14, 2018, between Donald H. Foley and PAR Technology Corporation
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2018
Grant Notice - Restricted Stock Award and Restricted Stock Award Agreement dated January 31, 2018, between Donald H. Foley and PAR Technology Corporation
Stock Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2018
Employment Offer Letter, dated April 12, 2017, between Donald H. Foley and PAR Technology Corporation
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2017
Restricted Stock Award Agreement, dated May 17, 2017, between PAR Technology Corporation and Donald H. Foley
Stock Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2017
Amendment to Restricted Stock Award Agreement, dated May 31, 2017, between PAR Technology Corporation and Donald H. Foley
Stock Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2017
Omnibus Amendment Number 1 to Loan Documents dated August 10, 2017 among PAR Technology Corporation, ParTech, Inc., Ausable Solutions, Inc., PAR Government Systems Corporation,...
Loan Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DC
2017
Employment Offer Letter, dated November 14, 2016, between Bryan Menar and PAR Technology Corporation
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2017
Credit Agreement dated as of November 29, 2016, among PAR Technology Corporation, the other Loan Parties (as defined in the Credit Agreement) and JPMorgan Chase Bank N.A
Loan Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2017
Sixth Amendment to Credit Agreement, dated as of November 14, 2016 by and among PAR Technology Corporation, the other Loan Parties (as defined in the Credit Agreement dated...
Loan Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2016
Fifth Amendment to Credit Agreement, dated as of August 5, 2016 by and among PAR Technology Corporation, the other Loan Parties (as defined in the Credit Agreement dated September...
Loan Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2016
Fourth Amendment to Credit Agreement with JPMorgan Chase Bank, N.A. dated as of March 24, 2016
Credit Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2016
Employment Offer Letter dated July 13, 2015 between Registrant and Michael Bartusek
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2016
November 2015 Asset Purchase Agreement by and among Gary Jonas Computing Ltd., SMS Software Holdings LLC, Jonas Computing (UK) Ltd., PAR Springer-Miller Systems, Inc.,...
Purchase Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2016
Employment Offer Letter dated November 16, 2015 between Registrant and Karen Sammon
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2016
Employment Offer Letter dated December 10, 2015 between Registrant and Matthew Cicchinelli
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2016
Separation Agreement between PAR Technology Corporation and Stephen P. Lynch dated August 31, 2015
Separation Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2015
Form of Outside Director Notice of Restricted Stock Award and Agreement Pursuant to the 2005 Equity Incentive Plan
Bonus & Incentive Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2015
Form of Notice of Award and Agreement Pursuant to the 2005 Equity Incentive Plan
Bonus & Incentive Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2015
Second Amendment to Credit Agreement and Other Loan Documents with JPMorgan Chase Bank, N.A. dated as of March 19, 2014
Loan Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2015
Credit Agreement
Credit Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
IL
2014
Pledge and Security Agreement
Security Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2014
Stock Purchase Agreement
Stock Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2014
AMENDMENT NO. 3 TO AMENDED AND RESTATED CREDIT AGREEMENT
Credit Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2014
Form of Notice of Equity Award and Agreement Pursuant to the 2005 Equity Incentive Plan
Bonus & Incentive Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2014
Form of Restricted Stock Agreement Pursuant to the 2005 Equity Incentive Plan
Bonus & Incentive Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2013
Employment Offer Letter dated March 21, 2013 between Registrant and Ronald J. Casciano
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2013
Employment Offer Letter dated March 21, 2013 between Registrant and Robert P. Jerabeck
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2013
Employment Offer Letter dated March 21, 2013 between Registrant and Karen E. Sammon
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2013
Separation Letter Agreement dated March 25, 2013 between Registrant and Paul B. Domorski
Separation Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2013
AMENDMENT NO. 2 TO AMENDED AND RESTATED CREDIT AGREEMENT
Credit Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2013
Notice of Stock Option Award - Long Term Incentive Program
Bonus & Incentive Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2012
Notice of Stock Option Award
Stock Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
DE
2012
PAR TECHNOLOGY CORPORATION INDEPENDENT DIRECTORS RESTRICTED STOCK AGREEMENT
Stock Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2012
Exhibit 10.16 AMENDMENT NO. 1 TO AMENDED AND RESTATED CREDIT AGREEMENT
Credit Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2011
Exhibit 10(iii)(A)
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2011
AMENDMENT NUMBER 1 TO PLEDGE AND SECURITY AGREEMENT
Security Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2011
TABLE OF CONTENTS
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2011
Employment Agreement Between PAR Technology Corporation and Ronald J. Casciano
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2011
Exhibit 10(iii)(A) Employment Agreement Between PAR Technology Corporation and Gregory T. Cortese EMPLOYMENT AGREEMENT
Employment Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2010
January 2010 amendment to bank line of credit agreement JP Morgan Chase, N.A.; NBTBank, N.A.; Alliance Bank, N.A
Credit Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2010