MAGNACHIP SEMICONDUCTOR Corp Contracts & Agreements

Standard Credit Agreement, dated as of March 26, 2024, by and between Magnachip Semiconductor, Ltd. and Korea Development Bank. (English Translation) (Filed With SEC on May 10, 2024)

Kun-Pledge (Mortgage) Agreement, dated as of March 26, 2024, by and between Magnachip Semiconductor, Ltd. and Korea Development Bank. (English Translation) (Filed With SEC on May 10, 2024)

Separation Agreement, dated as of March 22, 2024, by and among the Company, MSK and Chan Ho Park (Filed With SEC on March 26, 2024)

Description of Securities (Filed With SEC on March 8, 2024)

Agreement, dated as of April 11, 2023, by and among Magnachip Semiconductor Corporation, Jackson Square Advisors LLC, GT Investments II Corp and Gilbert Nathan (Filed With SEC on April 13, 2023)

Description of Securities (Filed With SEC on February 22, 2023)

Form of Restricted Stock Units Agreement (Non-employee Directors) (Filed With SEC on November 8, 2022)

Form of Restricted Stock Units Agreement (CEO and other Section 16 Officers) (Filed With SEC on November 8, 2022)

Form of Restricted Stock Units AgreementFinancial Performance (CEO) (Filed With SEC on November 8, 2022)

Form of Restricted Stock Units AgreementFinancial Performance (Non-CEO Section 16 Officers) (Filed With SEC on November 8, 2022)

Form of Restricted Stock Units AgreementTSR Performance (CEO) (Filed With SEC on November 8, 2022)

Form of Restricted Stock Units AgreementTSR Performance (Non-CEO Section 16 Officers) (Filed With SEC on November 8, 2022)

Second Amendment to Termination and Settlement Agreement, dated as of August 5, 2022, by and between Magnachip Semiconductor Corporation, South Dearborn Limited and Wise Road... (Filed With SEC on November 8, 2022)

Patent Cross-License Agreement, with an effective date as of June 15, 2017, by and between Infineon Technologies AG and Magnachip Semiconductor, Ltd (Filed With SEC on November 8, 2022)

First Amendment to the Patent Cross-License Agreement, with an effective date as of January 1, 2022, by and between Infineon Technologies AG and Magnachip Semiconductor, Ltd (Filed With SEC on November 8, 2022)

First Amendment to Termination and Settlement Agreement, dated as of April 4, 2022, by and between Magnachip Semiconductor Corporation, South Dearborn Limited and Wise Road... (Filed With SEC on April 6, 2022)

Description of Securities (Filed With SEC on February 23, 2022)

Executive Service Agreement, effective as of February 23, 2022, by and between Shin Young Park, Magnachip Semiconductor Corporation and Magnachip Semiconductor, Ltd (Filed With SEC on February 23, 2022)

Separation Agreement, dated as of December 29, 2021, by and among the Company, MSK and Young Soo Woo (Filed With SEC on January 3, 2022)

ASR Agreement dated December 21, 2021 by and between Magnachip Semiconductor Corporation and JPMorgan Chase Bank, National Association (Filed With SEC on December 23, 2021)

ASR Agreement dated December 21, 2021 by and between Magnachip Semiconductor Corporation and JPMorgan Chase Bank, National Association (Filed With SEC on December 21, 2021)

Rights Agreement, dated as of December 13, 2021, between the Company and American Stock Transfer & Trust Company, LLC, which includes as Exhibits thereto the Form of Certificate... (Filed With SEC on December 14, 2021)

Termination and Settlement Agreement, dated as of December 13, 2021, by and between Magnachip Semiconductor Corporation and South Dearborn Limited (Filed With SEC on December 14, 2021)

Letter Agreement, dated as of August 23, 2021, by and among South Dearborn Limited, Michigan Merger Sub, Inc., and Magnachip Semiconductor Corporation (Filed With SEC on August 23, 2021)

Letter Agreement, dated as of June 11, 2021, by and among Magnachip Semiconductor Corporation, South Dearborn Limited and Michigan Merger Sub, Inc (Filed With SEC on June 14, 2021)

Agreement and Plan of Merger, dated as of March 25, 2021, by and among South Dearborn Limited, Michigan Merger Sub, Inc., and Magnachip Semiconductor Corporation (Filed With SEC on March 29, 2021)

Executive Service Agreement, dated as of May 25, 2020, by and between Young Soo Woo, MagnaChip Semiconductor Corporation and MagnaChip Semiconductor, Ltd (Filed With SEC on August 7, 2020)

Executive Service Agreement, dated as of June 1, 2020, by and between Chan Ho Park, MagnaChip Semiconductor Corporation and MagnaChip Semiconductor, Ltd (Filed With SEC on August 7, 2020)

MagnaChip Semiconductor Corporation 2020 Equity and Incentive Compensation Plan (Filed With SEC on June 17, 2020)

Business Transfer Agreement, dated as of March 31, 2020, by and among Magnus Semiconductor, LLC, MagnaChip Semiconductor S.A. and MagnaChip Semiconductor, Ltd (Filed With SEC on March 31, 2020)

Jonathan W. Kim Separation Agreement, dated March 26, 2020 (Filed With SEC on March 27, 2020)

Description of Securities (Filed With SEC on February 21, 2020)

MagnaChip Semiconductor Corporation 2011 Equity Incentive Plan (as amended on April 26, 2018) (Filed With SEC on February 22, 2019)

Separation Agreement, dated as of January 9, 2019 among MagnaChip Semiconductor, Ltd. (Korea), MagnaChip Semiconductor Corporation and Tae Jong Lee (Filed With SEC on February 22, 2019)

Amendment to Employment Agreement by and between MagnaChip Semiconductor Corporation and Young Joon Kim, dated as of September 3, 2018 (Filed With SEC on February 22, 2019)

Employment Agreement with Theodore Kim, dated October 22, 2018 (Filed With SEC on October 26, 2018)

Employment Agreement with Woung Moo Lee, dated October 22, 2018 (Filed With SEC on October 26, 2018)

Form of Restricted Stock Units Agreement (Filed With SEC on October 26, 2018)

Form of Restricted Stock Units Agreement (TSR Performance) (Filed With SEC on October 26, 2018)

Form of Restricted Stock Units Agreement (AOP Performance) (Filed With SEC on October 26, 2018)

Employment Agreement with Young-Joon Kim, dated April 26, 2018 (Filed With SEC on April 27, 2018)

Form of Restricted Stock Units Agreement (Filed With SEC on April 27, 2018)

Form of Restricted Stock Units Agreement (TSR Performance) (Filed With SEC on April 27, 2018)

Form of Restricted Stock Units Agreement (AOP Performance) (Filed With SEC on April 27, 2018)

MagnaChip Semiconductor Corporation 2011 Equity Incentive Plan (as amended on October 23, 2017) (Filed With SEC on February 22, 2018)

MagnaChipSemiconductor Corporation Common Stock, par value $0.01 per share Underwriting Agreement (Filed With SEC on August 11, 2017)

MAGNACHIP SEMICONDUCTOR S.A. asthe Company MAGNACHIP SEMICONDUCTOR CORPORATION as the Parent AND U.S. BANK NATIONAL ASSOCIATION, as Trustee INDENTURE Dated as of January 17, 2017... (Filed With SEC on February 21, 2017)

AMENDMENT NO. 2 TO RIGHTS AGREEMENT (Filed With SEC on September 2, 2016)

TRANSLATION Amendmentto Basic Contract on Joint Development and Grant of License (Filed With SEC on August 5, 2016)

AGREEMENT (Filed With SEC on May 27, 2016)

MAGNACHIP SEMICONDUCTOR CORPORATION RESTRICTED STOCK UNITS AGREEMENT (For Nonemployee Director) (Filed With SEC on May 6, 2016)

AMENDMENT NO. 1 TO RIGHTS AGREEMENT (Filed With SEC on March 2, 2016)

-Signature page follows - (Filed With SEC on November 6, 2015)

SEPARATION AGREEMENT (Filed With SEC on August 7, 2015)

ADVISORY SERVICES AND SEPARATION AGREEMENT (Filed With SEC on May 28, 2015)

Rights Agreement, dated as of March 5, 2015, between the Company and American Stock Transfer & Trust Company, LLC, which includes as Exhibits thereto the Form of Certificate of... (Filed With SEC on March 6, 2015)

SEPARATION AGREEMENT (Filed With SEC on February 12, 2015)

SEPARATIONAGREEMENT (Filed With SEC on February 12, 2015)

MAGNACHIP SEMICONDUCTOR CORPORATION as the Issuer 6.625% SENIORNOTES DUE 2021 FIRST SUPPLEMENTAL INDENTURE Dated as of March 27, 2014 WILMINGTONTRUST, NATIONAL ASSOCIATION, as... (Filed With SEC on June 25, 2014)

MagnaChip Semiconductor Corporation Common Stock, par value $0.01 per share Underwriting Agreement (Filed With SEC on September 11, 2013)

MAGNACHIP SEMICONDUCTOR CORPORATION as the Issuer 6.625% SENIOR NOTES DUE 2021 INDENTURE Dated as of July 18, 2013 WILMINGTONTRUST, NATIONAL ASSOCIATION, as Trustee... (Filed With SEC on July 18, 2013)

MagnaChip Semiconductor Corporation 6.625% Senior Notes due 2021 Exchange and Registration Rights Agreement (Filed With SEC on July 18, 2013)

MagnaChip Semiconductor Corporation Common Stock, par value $0.01 pershare Underwriting Agreement (Filed With SEC on February 6, 2013)

MagnaChip Semiconductor Corporation Common Stock, par value $0.01 pershare Underwriting Agreement (Filed With SEC on May 2, 2012)

AMENDMENT NO. 1 TO WARRANT AGREEMENT (Filed With SEC on March 8, 2012)

MagnaChip Semiconductor Profit Sharing Plan as adopted onDecember 31, 2009 and as amended on February 15, 2010 (Filed With SEC on August 5, 2011)

Securities Purchase Agreement (Filed With SEC on May 16, 2011)

DEPOSIT AGREEMENT by and among MagnaChip Semiconductor Corporation as Issuer, AND American Stock Transfer & Trust Company, LLC as Depositary, Custodian and Registrar, AND THE... (Filed With SEC on March 11, 2011)

MagnaChip Semiconductor Corporation Common Stock, par value $0.01 pershare, in the form of Depositary Shares Underwriting Agreement (Filed With SEC on February 18, 2011)

MAGNACHIP SEMICONDUCTOR CORPORATION 2011 EQUITY INCENTIVE PLAN TABLE OF CONTENTS (Filed With SEC on February 18, 2011)

MAGNACHIP SEMICONDUCTOR CORPORATION 2011 EMPLOYEE STOCK PURCHASE PLAN (Filed With SEC on February 18, 2011)

MAGNACHIP SEMICONDUCTOR CORPORATION FORM OF STOCK OPTION AGREEMENT (For US Participant) (Filed With SEC on February 18, 2011)

MAGNACHIP SEMICONDUCTOR CORPORATION FORM OF STOCK OPTION AGREEMENT (For Non-US Participant) (Filed With SEC on February 18, 2011)

MAGNACHIP SEMICONDUCTOR CORPORATION FORM OF RESTRICTED STOCK UNITSAGREEMENT (For US Participant) (Filed With SEC on February 18, 2011)

MAGNACHIP SEMICONDUCTOR CORPORATION FORM OF RESTRICTED STOCK UNITSAGREEMENT (For Non-US Participant) (Filed With SEC on February 18, 2011)

MAGNACHIP SEMICONDUCTOR CORPORATION FORM OF RESTRICTED STOCK AGREEMENT (For US Participant) (Filed With SEC on February 18, 2011)

MAGNACHIP SEMICONDUCTOR CORPORATION FORM OF RESTRICTED STOCK AGREEMENT (For Non-US Participant) (Filed With SEC on February 18, 2011)

Broad and advanced analog and mixed-signal semiconductor technology and intellectual property platform that allows us to develop new products and meet market demands quickly (Filed With SEC on May 21, 2010)

Broad and advanced analog and mixed-signal semiconductor technology and intellectual property platform that allows us to develop new products and meet market demands quickly (Filed With SEC on May 11, 2010)

Broad and advanced analog and mixed-signal semiconductor technology and intellectual property platform that allows us to develop new products and meet market demands quickly (Filed With SEC on April 20, 2010)

Broad and advanced analog and mixed-signal semiconductor technology and intellectual property platform that allows us to develop new products and meet market demands quickly (Filed With SEC on March 15, 2010)

THIRD AMENDMENT TO FORBEARANCE AGREEMENT (Filed With SEC on December 19, 2008)

LIMITED WAIVER AND AMENDMENT TO FORBEARANCE AGREEMENT (Filed With SEC on December 16, 2008)

SECOND AMENDMENT TO FORBEARANCE AGREEMENT (Filed With SEC on December 16, 2008)

CREDIT AGREEMENT (Filed With SEC on November 21, 2008)

TENTH AMENDMENT TO CREDIT AGREEMENT (Filed With SEC on June 20, 2008)

AMENDED AND RESTATED SERVICE AGREEMENT (Filed With SEC on May 14, 2008)

FORM OF THIRD AMENDED AND RESTATED SECURITYHOLDERS AGREEMENT (Filed With SEC on March 31, 2008)

CORPORATION 2008 Equity Incentive Plan MagnaChip Semiconductor Corporation 2008 Equity Incentive Plan (Filed With SEC on March 31, 2008)

2008 Employee Stock Purchase Plan MagnaChip Semiconductor Corporation 2008 Employee Stock Purchase Plan (Filed With SEC on March 31, 2008)

MagnaChip Semiconductor Ltd., 891 Daechi-dong, Kangnam-gu, Seoul 135-798 Korea (Filed With SEC on March 31, 2008)

OPTION AGREEMENT (Filed With SEC on March 31, 2008)

[Korean Language Redacted] (Filed With SEC on March 31, 2008)

TRANSLATION Basic Contract on Joint Development and Grant of License (Filed With SEC on December 26, 2007)

NINTH AMENDMENT AND WAIVER TO CREDIT AGREEMENT (Filed With SEC on November 14, 2007)