Leidos, Inc. Contracts & Agreements

57 Contracts & Agreements
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Filed
Consensual Foreclosure Agreement under UCC ยง9-620 among Plainfield Renewable Energy Owner, LLC, Plainfield Renewable Energy Holdings, LLC, and Leidos Renewable Energy, LLC
Leidos, Inc.
2013
Amendment 2006-1 to Science Applications International Corporation Key Executive Stock Deferral Plan
Compensation Agreements
Leidos, Inc.
2006
Science Applications International Corporation Management Stock Compensation Plan (Amended and Restated as of January 1, 2005)
Bonus & Incentive Agreements
Leidos, Inc.
CA
2006
Science Applications International Corporation Amended and Restated Stock Compensation Plan (Effective January 1, 2005)
Bonus & Incentive Agreements
Leidos, Inc.
CA
2006
Keystaff Deferral Plan of Science Applications International Corporation (Effective January 1, 1997)
Bonus & Incentive Agreements
Leidos, Inc.
CA
2006
Science Applications International Corporation 1984 Bonus Compensation Stock Restriction Agreement
Bonus & Incentive Agreements
Leidos, Inc.
DE
2006
Science Applications International Corporation 1999 Non-Qualified Stock Option Agreement
Bonus & Incentive Agreements
Leidos, Inc.
DE
2006
Science Applications International Corporation Key Executive Stock Deferral Plan (as Amended and Restated)
Bonus & Incentive Agreements
Leidos, Inc.
CA
2006
Science Applications International Corporation Bonus Compensation Stock Restriction Agreement
Bonus & Incentive Agreements
Leidos, Inc.
DE
2006
Employment Letter Agreement between Science Applications International Corporation and Mark W. Sopp
Employment Agreements
Leidos, Inc.
2005
Termination of Severance Protection Agreement between SAIC and Thomas E. Darcy
Termination Agreements
Leidos, Inc.
DE
2005
Indemnification Agreement between Science Applications International Corporation and Indemnitee
Indemnification Agreements
Leidos, Inc.
DE
2005
Severance Protection Agreement between Science Applications International Corporation and Executive
Severance Agreements
Leidos, Inc.
CA
2005
SAIC and Randy Walker Severance Benefits and Release Memorandum of Understanding (2005)
Separation Agreements
Leidos, Inc.
2005
Science Applications International Corporation 1984 Bonus Compensation Stock Restriction Agreement
Bonus & Incentive Agreements
Leidos, Inc.
DE
2004
Science Applications International Corporation Key Executive Stock Deferral Plan (Effective January 4, 1996)
Bonus & Incentive Agreements
Leidos, Inc.
CA
2004
Science Applications International Corporation Key Executive Stock Deferral Plan Stock Restriction Agreement with Participant
Stock Agreements
Leidos, Inc.
2004
Stock Purchase Agreement between Science Applications International Corporation and TTI Holding Corporation (Telcordia Technologies, Inc.)
Stock Agreements
Leidos, Inc.
NY
2004
Credit Agreement (Multi-Year Facility) among Science Applications International Corporation and Lenders, dated July 28, 2004
Credit Agreements
Leidos, Inc.
NY
2004
Executive Change in Control, Incentive and Severance Agreement between Telcordia Technologies, Inc. and Matthew J. Desch
Change of Control Agreements
Leidos, Inc.
NJ
2004
Keystaff Deferral Plan Agreement between Science Applications International Corporation and Key Executives/Directors (Effective January 1, 1997)
Compensation Agreements
Leidos, Inc.
2004
Science Applications International Corporation Key Executive Stock Deferral Plan (Effective January 4, 1996)
Bonus & Incentive Agreements
Leidos, Inc.
CA
2004
Employment Agreement between Carl M. Albero and Science Applications International Corporation (SAIC)
Employment Agreements
Leidos, Inc.
VA
2004
Telcordia Technologies, Inc. CEO Employment Offer Letter to Matthew J. Desch
Employment Agreements
Leidos, Inc.
2004
Science Applications International Corporation Equity and Incentive Compensation Offer Letter to Matthew J. Desch
Bonus & Incentive Agreements
Leidos, Inc.
2004
Science Applications International Corporation Executive Employment Offer Letter to Randy Walker
Employment Agreements
Leidos, Inc.
2004
Science Applications International Corporation Equity and Incentive Compensation Offer Letter to Randy Walker
Bonus & Incentive Agreements
Leidos, Inc.
2004
Science Applications International Corporation CEO Employment Offer Letter with Kenneth C. Dahlberg
Employment Agreements
Leidos, Inc.
2003
Science Applications International Corporation Equity and Incentive Award Offer Letter to Kenneth C. Dahlberg
Bonus & Incentive Agreements
Leidos, Inc.
2003
Amended and Restated Credit Agreement (Multi-Year Facility) among Science Applications International Corporation and Lenders
Credit Agreements
Leidos, Inc.
NY
2003
Agreement and Plan of Merger among Science Applications International Corporation, SAIC, Inc., and SAIC Merger Sub, Inc.
Merger Agreements
Leidos, Inc.
DE
2006
Amendment to Five Year Credit Agreement among Science Applications International Corporation and Lenders
Credit Agreements
Leidos, Inc.
2006
Five Year Credit Agreement among Science Applications International Corporation and Lenders (2006)
Credit Agreements
Leidos, Inc.
NY
2006
Agreement and Plan of Merger among Science Applications International Corporation, SAIC, Inc., and SAIC Merger Sub, Inc.
Merger Agreements
Leidos, Inc.
DE
2006
Stock Restriction Agreement between Science Applications International Corporation and Participant
Stock Agreements
Leidos, Inc.
2006
SAIC Stock Offer Letter to Mark Sopp Dated November 14, 2005
Stock Agreements
Leidos, Inc.
2005
Alumni Stock Agreement between Science Applications International Corporation and Former Employee
Stock Agreements
Leidos, Inc.
CA
2005
Option Cancellation Agreement among SAIC, Telcordia Technologies, and Matthew J. Desch
Waiver Agreements
Leidos, Inc.
NJ
2005
Science Applications International Corporation Management Stock Compensation Plan Stock Restriction Agreement with Participant
Stock Agreements
Leidos, Inc.
2004
Science Applications International Corporation 1999 Non-Qualified Stock Option Agreement with Employee
Warrant Agreements
Leidos, Inc.
DE
2004
Amended and Restated Credit Agreement (Multi-Year Facility) among Science Applications International Corporation and Lenders, dated July 28, 2004
Credit Agreements
Leidos, Inc.
NY
2004
Science Applications International Corporation 5.5% Note Due 2033 (Global Security)
Note Agreements
Leidos, Inc.
2003
Purchase Agreement for $300,000,000 5.5% Notes due 2033 between Science Applications International Corporation and Initial Purchasers
Purchase Agreements
Leidos, Inc.
NY
2003
Registration Rights Agreement between Science Applications International Corporation and Initial Purchasers for $300,000,000 5.5% Notes due 2033
Registration Rights Agreements
Leidos, Inc.
NY
2003
Science Applications International Corporation 5.5% Note Due 2033 (Rule 144A)
Note Agreements
Leidos, Inc.
DE
2003
Science Applications International Corporation 5.5% Note Due 2033 (Regulation S)
Note Agreements
Leidos, Inc.
2003
Science Applications International Corporation 6.25% Note Due 2012 (Global Security)
Note Agreements
Leidos, Inc.
2002
Science Applications International Corporation 7 1/8% Note Due 2032 (Global Security)
Note Agreements
Leidos, Inc.
2002
Credit Agreement (364-Day Facility) among Science Applications International Corporation and Lenders, dated July 31, 2002
Credit Agreements
Leidos, Inc.
NY
2002
Credit Agreement (Multi-Year Facility) among Science Applications International Corporation and Lenders, dated July 31, 2002
Credit Agreements
Leidos, Inc.
NY
2002
Purchase Agreement for $550,000,000 6.25% Notes Due 2012 and $250,000,000 7.125% Notes Due 2032 between Science Applications International Corporation and J.P. Morgan Securities...
Purchase Agreements
Leidos, Inc.
NY
2002
Registration Rights Agreement between Science Applications International Corporation and Initial Purchasers (June 28, 2002)
Registration Rights Agreements
Leidos, Inc.
NY
2002
Indenture Agreement between Science Applications International Corporation and JPMorgan Chase Bank, dated June 28, 2002
Indenture Agreements
Leidos, Inc.
2002
Science Applications International Corporation 6.25% Note Due 2012 (Global Security)
Note Agreements
Leidos, Inc.
DE
2002
Science Applications International Corporation 6.25% Note Due 2012 (Global Security)
Note Agreements
Leidos, Inc.
2002
Science Applications International Corporation 7 1/8% Note due 2032 (Global Security)
Note Agreements
Leidos, Inc.
DE
2002
Science Applications International Corporation 2001 Employee Stock Purchase Plan
Equity Distribution Agreements
Leidos, Inc.
DE
2002