Lien Release Agreement between Irvine Sensors Corporation and Investor (March 18, 2009)

Exhibit 10.3

 

 

FORM OF LIEN RELEASE AGREEMENT

 

THIS LIEN RELEASE AGREEMENT (this “Agreement”) is made and entered into this 18th day of March, 2009 by and between Irvine Sensors Corporation, a Delaware corporation (the “Company”), and the undersigned investor (the “Investor”). Each of the Company and the Investor is sometimes referred to herein as a “Party,” and collectively as the “Parties.”

 

RECITALS

 

A. WHEREAS, the Company owes the Investor principal and interest totaling approximately $           as of          , 2009 pursuant to that certain Secured Promissory Note dated as of           in favor of the Investor (the “Note”);

 

B. WHEREAS, the Investor is a party to, and the Company’s assets are secured by liens (the “Liens”) pursuant to, that certain Security Agreement dated as of November 5, 2008 and Intercreditor Agreement dated as of November 5, 2008;

 

C. WHEREAS, the Company has entered into an agreement to sell most of its patent portfolio and related assets (“Patent Assets”) to a patent acquisition company (the “Patent Buyer”) for up to a $9.5 million cash payment and it is anticipated that the Company will be granted a perpetual, worldwide, royalty-free, non-exclusive license to use the sold patents in its business (the “Patent Sale and License”), a condition to which is a requirement that the Investor agrees to release its Liens relating to the Patent Assets pursuant to the terms of this Agreement;

 

D. WHEREAS, the parties desire to effect such a release of the Investor’s Liens relating to the Patent Assets; and

 

E. WHEREAS, the Company, U.S. Bank National Association (the “Escrow Agent”) and certain holders of the bridge notes issued by the Company pursuant to that certain Private Placement Memorandum, dated as of September 29, 2008 and as supplemented on January 26, 2009, (the “Bridge Notes”) have entered into an Escrow Agreement, pursuant to which the Company has agreed to deposit out of the proceeds of the Patent Sale and License an amount equal to $1,040,000 (the “Escrow Deposit”).

 

AGREEMENT

 

NOW THEREFORE, in consideration of the foregoing and the agreements and covenants contained herein, the Parties agree as follows:

 

1. Release of Liens.   As consideration for the Investor’s release of Liens relating to the Patent Assets, the Investor agrees as follows (Please Initial One):

 

a.          (Initials)   Investor agrees to (i) upon receipt of the outstanding principal and accrued interest owing under the Note, such amount to be paid to Investor out of the Escrow Deposit promptly after the closing of the Patent Sale and License, surrender the Note to the Company for cancellation and (ii) upon the Escrow Agent’s receipt of the Escrow Deposit, execute and deliver the release of Liens relating to the Patent Assets attached hereto as Exhibit A; or

 

b.          (Initials)   Investor agrees to (i) upon receipt of the number of shares of the Company’s common stock (the “Shares”) set forth in this Section 1(b), surrender the Note to the Company for cancellation in exchange for the Company’s agreement to issue to Investor, subject to approval of the Company’s stockholders, the number of Shares equal to 125% of the value of the outstanding principal and accrued interest under the Note, based on the greater of (a) $0.40, (b) the last reported closing sale price of the Company’s common stock on the Nasdaq Capital Market immediately prior to the closing of the Patent Sale and License and (c) the consolidated closing bid price of the Company’s common stock on the Nasdaq Capital Market immediately prior to the closing of the Patent

Sale and License and (ii) upon the Escrow Agent’s receipt of the Escrow Deposit, execute and deliver the release of Liens relating to the Patent Assets attached hereto as Exhibit A; or

 

c.          (Initials)   Investor agrees to (i) upon receipt of the number of Shares set forth in this Section 1(c) and the amount of principal and accrued interest set forth in this Section 1(c), surrender the Note to the Company for cancellation in exchange for the Company’s agreement to (y) pay Investor $           of the outstanding principal and accrued interest under the Note in cash out of the proceeds of the Patent Sale and License, such amount to be paid to Investor out of the Escrow Deposit promptly after the closing of the Patent Sale and License and (z) issue to Investor, subject to approval of the Company’s stockholders, the number of Shares equal to 125% of the value of the remaining $           of the outstanding principal and accrued interest under the Note, based on the greater of (1) $0.40, (2) the last reported closing sale price of the Company’s Common Stock on the Nasdaq Capital Market immediately prior to the closing of the Patent Sale and License and (3) the consolidated closing bid price of the Company’s Common Stock on the Nasdaq Capital Market immediately prior to the closing of the Patent Sale and License and (ii) upon the Escrow Agent’s receipt of the Escrow Deposit, execute and deliver the release of Liens relating to the Patent Assets attached hereto as Exhibit A.

 

2. Equity Consideration.   In the event the Investor agrees to either Section 1(b) or 1(c) of this Agreement, the Company shall use commercially reasonable efforts to obtain stockholder approval for the issuance of the Shares no later than the Company’s 2009 Annual Meeting of Stockholders. The Company shall issue the Shares to the Investor as soon as practicable after such issuance has been approved by the Company’s stockholders. If the Company is unable to obtain stockholder approval for the issuance of the Shares, the Note shall remain outstanding in accordance with its terms.

 

3. Governing Law.  This Agreement shall be governed by, and construed in accordance with, the laws of the State of California without regard to conflicts of laws that would result in the application of the substantive laws of another jurisdiction.

 

4. Attorneys’ Fees.  If any action or proceeding in contract or tort arising out of or relating to this Agreement is commenced by any party to this Agreement, the prevailing party shall be entitled to receive from the other party, in addition to any other relief that may be granted, the reasonable attorneys’ fees, costs and expenses incurred in the action or proceeding by the prevailing party, along with any reasonable attorneys’ fees, costs and expenses incurred to collect any amount awarded in connection with any such action or proceeding.

 

5. Waiver of Jury Trial and Setoff; Consent to Jurisdiction; Etc.   In any litigation in any court with respect to, in connection with, or arising out of this Agreement or any instrument or document delivered pursuant to this Agreement, or the validity, protection, interpretation, collection or enforcement hereof or thereof, or any other claim or dispute howsoever arising, between the parties hereto WAIVES TRIAL BY JURY IN CONNECTION WITH ANY SUCH LITIGATION AND ANY RIGHT IT MAY HAVE TO CLAIM OR RECOVER IN ANY SUCH LITIGATION ANY SPECIAL, EXEMPLARY, PUNITIVE OR CONSEQUENTIAL DAMAGES OR ANY DAMAGES OTHER THAN, OR IN ADDITION TO, ACTUAL DAMAGES. EACH INVESTOR AGREES THAT THIS SECTION 5 IS A SPECIFIC AND MATERIAL ASPECT OF THIS AGREEMENT AND ACKNOWLEDGE THAT THE OTHER PARTY WOULD NOT ENTER THIS AGREEMENT IF THIS SECTION 5 WERE NOT PART OF THIS AGREEMENT. Each party irrevocably consents to the exclusive jurisdiction of any State or Federal Court located within the County of Orange, State of California, in connection with any action or proceeding arising out of or relating to this Agreement or any document or instrument delivered pursuant to this Agreement or otherwise. In any such litigation, each party waives, to the fullest extent it may effectively do so, personal service of any summons, complaint or other process and agree that the service thereof may be made by certified or registered mail directed to such party at its address for notice determined in accordance with this Section 5. Each party hereby waives, to the fullest extent it may effectively do so, the defenses of forum non conveniens and improper venue.

 

6. Representation by Counsel.  The Parties acknowledge and agree that they have been represented or have had the opportunity to be represented by counsel of their own choice in the negotiations leading to their execution of this Agreement and that they have read this Agreement. The Parties further acknowledge that the waivers they made herein are knowing, conscious and with full appreciation that they are forever foreclosed from pursuing any of the rights so waived and that they understand this Agreement and are signing it voluntarily and without coercion.

7. Admissibility of this Agreement.  Each of the parties agrees that any copy of this Agreement signed by it and transmitted by facsimile for delivery to the other party shall be admissible in evidence as the original itself in any judicial or administrative proceeding, whether or not the original is in existence.

 

8. Notices.  All notices, demands, requests, consents, approvals, and other communications required or permitted hereunder shall be in writing and, unless otherwise specified herein, shall be (i) personally served, (ii) deposited in the mail, registered or certified, return receipt requested, postage prepaid, (iii) delivered by reputable overnight courier service with charges prepaid, or (iv) transmitted by hand delivery, electronic mail, or facsimile, addressed as set forth on the signature page hereto or to such other address as such party shall have specified most recently by written notice. Any notice or other communication required or permitted to be given hereunder shall be deemed effective (a) upon hand delivery or delivery by electronic mail or facsimile, with accurate confirmation generated by the transmitting facsimile machine, at the address or number designated below (if delivered on a business day during normal business hours where such notice is to be received), or the first business day following such delivery (if delivered other than on a business day during normal business hours where such notice is to be received) or (b) on the second business day following the date of mailing by express courier service, fully prepaid, addressed to such address, or upon actual receipt of such mailing, whichever shall first occur.

 

9. Amendments and Modification.   No provision hereof shall be modified, altered, waived or limited except by written instrument expressly referring to this Agreement and to such provision, and executed by the parties hereto.

 

10. Counterparts/Execution.  This Agreement may be executed in any number of counterparts and by the different signatories hereto on separate counterparts, each of which, when so executed, shall be deemed an original, but all such counterparts shall constitute but one and the same instrument. This Agreement may be executed by facsimile signature and delivered electronically.

 

11. Successors and Assigns.  Whenever in this Agreement reference is made to any party, such reference shall be deemed to include the successors, assigns, heirs and legal representatives of such party. No party hereto may transfer any rights under this Agreement, unless the transferee agrees to be bound by, and comply with all of the terms and provisions of this Agreement, as if an original signatory hereto on the date hereof.

 

12. Severability.  In the event that any term or provision of this Agreement shall be finally determined to be superseded, invalid, illegal or otherwise unenforceable pursuant to applicable law by an authority having jurisdiction and venue, that determination shall not impair or otherwise affect the validity, legality or enforceability (i) by or before that authority of the remaining terms and provisions of this Agreement, which shall be enforced as if the unenforceable term or provision were deleted, or (ii) by or before any other authority of any of the terms and provisions of this Agreement provided each party is able to receive the substantial benefit of this Agreement.

 

13. Entire Agreement.  This Agreement contains the entire agreement of the parties and supersedes all other agreements and understandings, oral or written, with respect to the matters contained herein.

 

[SIGNATURE PAGE FOLLOWS]

IN WITNESS WHEREOF, this Agreement has been executed to be effective as of the date and year first above written. This Agreement may be executed in counterparts, each of which shall be deemed an original, but all of which together shall constitute one and the same instrument. This Agreement may be executed by facsimile signature, which signature shall be deemed of the same legal effect as an original hard copy signature.

 

IRVINE SENSORS CORPORATION
a Delaware corporation

 

By:
		John Carson, President and Chief Executive Officer
Address:

 

INVESTOR:

 

By:
Name:
Title:
Address:

FORM OF RELEASE OF SECURITY INTEREST

     This release of security interest is made and executed by                                                              ,                                                             , (the “Secured Party”), in favor of Irvine Sensors Corporation, a Delaware corporation (“Debtor”).

A. The Secured Party loaned money to Debtor, and Debtor granted the Secured Party a security interest in all of Debtor’s intellectual property assets to secure indebtedness and obligations of Debtor to the Secured Party.

B. The Secured Party recorded its security interest as follows:

		Secured		Execution				Recordation
Debtor		Party		Date		Reel/Frame		Date
Irvine Sensors Corporation

     NOW, THEREFORE, for valuable consideration received, by its execution of this Release of Security Interest, the Secured Party hereby irrevocably and unconditionally releases all right, title and interest in all of the following:

     (a) the patents and patent applications listed in Exhibit A (the “Patents”);

     (b) all patents and patent applications (i) to which any of the Patents directly or indirectly claims priority, (ii) for which any of the Patents directly or indirectly forms a basis for priority, and/or (iii) that directly or indirectly incorporate by reference, or are directly or indirectly incorporated by reference into, the Patents;

     (c) all reissues, reexaminations, extensions, continuations, continuations in part, continuing prosecution applications, requests for continuing examinations, divisions, registrations of any item in any of the foregoing categories (a) and (b);

     (d) all non-United States patents, patent applications, and counterparts relating to the Patents or any item in any of the foregoing categories (a) through (c), including, without limitation, certificates of invention, utility models, industrial design protection, design patent protection, other governmental grants or issuances, and any rights to apply in any or all countries of the world for patents, certificates of invention, utility models, industrial design protections, design patent protections, or governmental grants or issuances of any type related to any of the Patents and the inventions, invention disclosures, and discoveries therein;

     (e) inventions, invention disclosures, and discoveries described in any of the Patents of any item in the foregoing categories (a) though (d);

     (f) all rights to apply in any or all countries of the world for patents, certificates of invention, utility models, industrial design protections, design patent protections, or other governmental grants or issuances of any type related to any item in any of the foregoing categories (a) through (e), including, without limitation, under the Paris Convention for the Protection of Industrial Property, the International Patent Cooperation Treaty, or any other convention, treaty, agreement, or understanding;

     (g) causes of action (whether known or unknown or whether currently pending, filed, or otherwise) and other enforcement rights under, or on account of, any of the Patents and/or the rights described in the above subparagraphs (a) through (f), including, without limitation, all causes of action and other enforcement rights for

(i) damages,

(ii) injunctive relief, and

(iii) any other remedies of any kind

for past, current and future infringement; and

     (h) all rights to collect royalties and other payments under or on account of any of the Patents and/or any item in any of the foregoing categories (a) through (g).

     If necessary or desired, the Secured Party hereby authorizes Debtor’s authorized representative to file UCC Financing Statement Amendment(s) with the applicable filing office(s) in order to memorialize the release of any security interest related to the items set forth in categories (a) through (h) by the Secured Party.

     This Release is governed by the law of the State of Delaware, excluding its choice of law principles to the contrary. This Release shall be binding upon the Secured Party and its successors and assigns and inures, to the benefit of, with respect to the Patents (including any purchaser). The Secured Party acknowledges that it is aware that it may hereafter discover facts different from or in addition to what it now knows, believes or suspects to be true with respect to the matters herein released, that such facts may give rise to claims, causes of action, damages, consequences or results that are unforeseen or unsuspected, and that the Secured Party is nonetheless giving up its rights, and the releases in this Release Agreement will be and remain in effect in all respects as complete, general releases, notwithstanding any such different or additional facts.

     IN WITNESS WHEREOF, the undersigned has executed this Release of Security Interest on this                      day of                                          2009.

Secured Party

Name:
Address:

(Signature)

Title:                                                                                                                                              
(If Applicable)

Exhibit A

						Title of Patent and First
Patent or Application No.		Country		Filing Date		Named Inventor
5,235,672 (07/651,477)		US		8/10/1993 (2/6/1991)		Hardware for electronic neural network
						Carson, John C.
6,389,404 (09/223,476)		US		5/14/2002 (12/30/1998)		Neural processing module with input architectures that make maximal use of a weighted synapse array
						Carson, John C.; Saunders, Christ H.
6,650,704 (09/427,384)		US		11/18/2003 (10/25/1999)		Method of producing a high quality, high resolution image from a sequence of low quality, low resolution images that are undersampled and subject to jitter
						Carlson, Randolph S.; Arnold, Jack L.; Feldmus, Valentine G.
6,829,237 (09/973,857)		US		12/7/2004 (10/9/2001)		High speed multi-stage switching network formed from stacked switching layers Carson, John C.; Ozguz, Volkan H.
7,082,591 (10/346,363)		US		7/25/2006 (1/17/2003)		Method for effectively embedding various integrated circuits within field programmable gate arrays
						Carlson, Randolph S.
6,856,167 (10/347,038)		US		2/15/2005 (1/17/2003)		Field programmable gate array with a variably wide word width memory
						Ozguz, Volkan H.; Carlson, Randolph S.; Gann, Keith D.; Leon, John P.

						Title of Patent and First
Patent or Application No.		Country		Filing Date		Named Inventor
7,265,579 (11/037,490)		US		9/4/2007 (1/18/2005)		Field programmable gate array incorporating dedicated memory stacks
						Carlson, Randolph Stuart; Ozguz, Volkan; Gann, Keith D.; Leon, John P.
5,508,836 (08/305,066)		US		4/16/1996 (9/13/1994)		Infrared wireless communication between electronic system components DeCaro, Robert; Saunders, Christ H.; Maeding, Dale
5,635,705 (08/526,415)		US		6/3/1997 (9/11/1995)		Sensing and selecting observed events for signal processing
						Saunders, Christ H.
6,195,268 (09/031,435)		US		2/27/2001 (2/26/1998)		Stacking layers containing enclosed IC chips
						Eide, Floyd K.
5,045,685 (07/534,969)		US		9/3/1991 (6/6/1990)		Analog to digital conversion on multiple channel IC chips
						Wall, Llewellyn E.
5,104,820 (07/720,025)		US		4/14/1992 (6/24/1991)		Method of fabricating electronic circuitry unit containing stacked IC layers having lead rerouting
						Go, Tiong C.(deceased,); Minahan, Joseph A.; Shanken, Stuart N.
5,279,991 (07/996,794)		US		1/18/1994 (12/24/1992)		Method for fabricating stacks of IC chips by segmenting a larger stack
						Minahan, Joseph A.; Pepe, Angel A.

						Title of Patent and First
Patent or Application No.		Country		Filing Date		Named Inventor
5,432,318 (08/178,923)		US		7/11/1995 (1/7/1994)		Apparatus for segmenting stacked IC chips
						Minahan, Joseph A.
5,304,790 (07/956,914)		US		4/19/1994 (10/5/1992)		Apparatus and system for controllably varying image resolution to reduce data output
						Arnold, Jack
5,347,428 (07/985,837)		US		9/13/1994 (12/3/1992)		Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip
						Carson, John C.; Indin, Ronald J.; Shanken, Stuart N.
5,406,701 (08/120,675)		US		4/18/1995 (9/13/1993)		Fabrication of dense parallel solder bump connections
						Pepe, Angel A.; Reinker, David M.; Minahan, Joseph A.
5,424,920 (08/232,739)		US		6/13/1995 (4/25/1994)		Non-conductive end layer for integrated stack of IC chips
						Miyake, Michael K.
5,432,729 (08/255,465)		US		7/11/1995 (6/8/1994)		Electronic module comprising a stack of IC chips each interacting with an IC chip secured to the stack
						Carson, John C.; Some, Raphael R.
5,581,498 (08/326,645)		US		12/3/1996 (10/20/1994)		Stack of IC chips in lieu of single IC chip
						Ludwig, David E.; Saunders, Christ H.; Some, Raphael R.; Stuart, John J.

						Title of Patent and First
Patent or Application No.		Country		Filing Date		Named Inventor
5,688,721 (08/62,2671)		US		11/18/1997 (3/26/1996)		3D stack of IC chips having leads reached by vias through passivation covering access plane
						Johnson, Tony K.
5,953,588 (08/777,747)		US		9/14/1999 (12/21/1996)		Stackable layers containing encapsulated IC chips
						Camien, Andrew N; Yamaguchi, James S.
6,072,234 (09/316,740)		US		6/6/2000 (5/21/1999)		Stack of equal layer neo-chips containing encapsulated IC chips of different sizes
						Camien, Andrew N.; Yamaguchi, James S.
5,955,668 (09/166,458)		US		9/21/1999 (10/5/1998)		Multi-element micro gyro
						Hsu, Ying W.; Reeds, III, John W.; Saunders, Christ H.
6,089,089 (09/301,847)		US		7/18/2000 (4/29/1999)		Multi-element micro gyro Hsu, Ying W.
6,578,420 (09/604,782)		US		6/17/2003 (6/26/2000)		Multi-axis micro gyro structure
						Hsu, Ying Wen
6,014,316 (09/095,416)		US		1/11/2000 (6/10/1998)		IC stack utilizing BGA contacts
						Eide, Floyd K.
6,028,352 (09/095,415)		US		2/22/2000 (6/10/1998)		IC stack utilizing secondary leadframes Eide, Floyd K.
6,117,704 (09/282,704)		US		9/12/2000 (3/31/1999)		Stackable layers containing encapsulated chips

						Title of Patent and First
Patent or Application No.		Country		Filing Date		Named Inventor
						Yamaguchi, James S.; Ozguz, Volkan H.; Camien, Andrew N.
6,476,392 (09/853,819)		US		11/5/2002 (5/11/2001)		Method and apparatus for temperature compensation of an uncooled focal plane array
						Kaufman, Charles S.; Carson, Randolph S.; Hornback, William B.
6,891,160 (10/281,393)		US		5/10/2005 (10/25/2002)		Method and apparatus for temperature compensation of an uncooled focal plane array
						Kaufman, Charles S.; Carson, Randolph S.; Hornback, William B.
7,235,785 (11/048,634)		US		6/26/2007 (1/31/2005)		Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane array
						Hornback, Bert; Harwood, Doug; Boyd, W. Eric; Carlson, Randy
6,596,997 (09/921,525)		US		7/22/2003 (8/3/2001)		Retro-reflector warm stop for uncooled thermal imaging cameras and method of using the same
						Kaufman, Charles S.
6,706,971 (10/142,557)		US		3/16/2004 (5/10/2002)		Stackable microcircuit layer formed from a plastic encapsulated microcircuit
						Albert, Douglas M.; Gann, Keith D.
7,174,627 (10/338,974)		US		2/13/2007 (1/9/2003)		Method of fabricating known good dies from packaged integrated circuits

						Title of Patent and First
Patent or Application No.		Country		Filing Date		Named Inventor
						Gann, Keith D.
6,560,109 (09/949,024)		US		5/6/2003 (9/7/2001)		Stack of multilayer modules with heat-focusing metal layer
						Yamaguchi, James Satsuo; Pepe, Angel Antonio; Ozguz, Volkan H.; Camien, Andrew Nelson
6,717,061 (09/949,512)		US		4/6/2004 (9/7/2001)		Stacking of multilayer modules
						Yamaguchi, James Satsuo; Pepe, Angel Antonio; Ozguz, Volkan H.; Camien, Andrew Nelson
6,734,370 (09/948,950)		US		5/11/2004 (9/7/2001)		Multilayer modules with flexible substrates
						Yamaguchi, James Satsuo; Pepe, Angel Antonio; Ozguz, Volkan H.; Camien, Andrew Nelson
7,127,807 (10/431,914)		US		10/31/2006 (5/7/2003)		Process of manufacturing multilayer modules
						Yamaguchi, James Satsuo; Pepe, Angel Antonio; Ozguz, Volkan H.; Camien, Andrew Nelson
6,797,537 (09/938,686)		US		9/28/2004 (10/30/2001)		Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers
						Pepe, Angel Antonio; Yamaguchi, James Satsuo
6,784,547 (10/302,680)		US		8/31/2004 (11/21/2002)		Stackable layers containing encapsulated integrated circuit chips with one or more

						Title of Patent and First
Patent or Application No.		Country		Filing Date		Named Inventor
						overlying interconnect layers
						Pepe, Angel Antonio; Yamaguchi, James Satsuo
7,239,012 (10/951,990)		US		7/3/2007 (9/28/2004)		Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers
						Pepe, Angel; Yamaguchi, James
6,806,559 (10/128,728)		US		10/19/2004 (4/22/2002)		Method and apparatus for connecting vertically stacked integrated circuit chips Gann, Keith D.; Albert, Douglas M.
6,912,862 (10/615,641)		US		7/5/2005 (7/8/2003)		Cryopump piston position tracking Sapir, Itzhak
6,967,411 (10/360,244)		US		11/22/2005 (2/7/2003)		Stackable layers containing ball grid array packages Eide, Floyd K.
7,242,082 (11/229,351)		US		6/10/2007 (9/15/2005)		Stackable layer containing ball grid array package Eide, Floyd
6,993,835 (10/726,888)		US		2/7/2006 (12/4/2003)		Method for electrical interconnection of angularly disposed conductive patterns Albert, Douglas Marice
6,998,328 (10/701,783)		US		2/14/2006 (11/5/2003)		Method for creating neo-wafers from singulated integrated circuit die and a device made according to the method Stern, Jonathan Michael

						Title of Patent and First
Patent or Application No.		Country		Filing Date		Named Inventor
7,417,323 (10/703,177)		US		(11/6/2003)		Neo-wafer device and method Sambo S. He
7,198,965 (11/354,370)		US		4/3/2007 (2/14/2006)		Method for making a neo-layer comprising embedded discrete components
						He, Sambo
7,180,579 (10/806,037)		US		2/20/2007 (3/22/2004)		Three-dimensional imaging processing module incorporating stacked layers containing microelectronic circuits
						Ludwig, David E.; Kennedy, John V.; Kleinhans, William; Liu, Tina; Krutzik, Christian
7,436,494 (11/706,724)		US		10/14/2008 (2/15/2007)		Three-dimensional lanar module with alignment refernce insert circuitry Ludwig, David E.; Kennedy, John V.; Kleinhans, William; Liu, Tina; Krutzik, Christian
7,335,576 (11/197,828)		US		2/26/2008 (8/5/2005)		Method for precision integrated circuit die singulation using differential etch rates
						David, Ludwig; Yamaguchi, James; Clark, Stuart; Boyd, W. Eric
7,380,459 (11/654,292)		US		6/3/2008 (1/16/2007)		Absolute pressure sensor
						Sapir, Itzhak
09/949,203		US		9/7/2001		Method of manufacturing multilayer modules
						James Satsuo Yamaguchi; Angel Antonio Pepe; Volkan

						Title of Patent and First
Patent or Application No.		Country		Filing Date		Named Inventor
						H. Ozguz; Andrew Nelson Camien
10/968,572		US		10/19/2004		Vertically stacked pre-packaged integrated circuit chips
						Keith Gann; Douglas N. Albert
7,440,449 (10/960,712)		US		10/6/2004		High speed switching module comprised of stacked layers incorporating T-connect structures
						John C. Carson; Volkan H. Orguz
11/977,447		US				Inventorship not available
11/897,938		US				Inventorship not available
11/825,643		US		7/7/2007		Inventorship not available
11/807,671		US				Inventorship not available
11/731,154		US				Inventorship not available
11/644,438		US		12/22/2006		Method for making stacked integrated circuits (ICs) using prepackaged parts
						Keith D. Gann
11/524,090		US		9/20/2006		Stackable tier structure comprising high density feedthrough
						Volkan Ozguz; Jonathan Stern

						Title of Patent and First
Patent or Application No.		Country		Filing Date		Named Inventor
11/511117		US		8/26/2006		MEMS cooling device
						Itzhak Sapir
11/499,403		US		8/4/2006		High density interconnect assembly comprising stacked electronic module
						John V. Kennedy
11/441908		US		5/26/2006		Stackable tier structure comprising prefabricated high density feedthrough
						Volkan Ozguz; Jonathan Stern
11/429,468		US				Inventorship not available
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Patent or Application No.		Country		Filing Date		Named Inventor
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12/008,253		US				Inventorship not available
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PCT/US06/039915		WO		8/26/2006		MEMS cooling device Itzhak Sapir
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