Hoku Corp Contracts & Agreements

CREDIT AGREEMENT Dated as of May 21, 2012 between HOKU CORPORATION as Borrower, and CHINA MERCHANTS BANK CO., LTD., NEW YORK BRANCH as Lender (Filed With SEC on May 23, 2012)

As of May 21, 2012 (Filed With SEC on May 23, 2012)

AMENDMENT NO. 1 TO CREDIT AGREEMENT (Filed With SEC on May 23, 2012)

As of May 22, 2012 (Filed With SEC on May 23, 2012)

Hoku Corporation Hoku Solar, Inc. Hoku Materials, Inc. 1288 Ala Moana Boulevard Suite 220 Honolulu, Hawaii96814 Tel ###-###-#### Fax ###-###-#### www.hokucorp.com (Filed With SEC on March 29, 2012)

RESELLER AGREEMENT (Filed With SEC on March 5, 2012)

Amendment No. 2 To (Filed With SEC on March 5, 2012)

CREDIT AGREEMENT Dated as of February 24, 2012 between HOKU CORPORATION as Borrower, and CHINA MERCHANTS BANK CO., LTD., NEW YORK BRANCH as Lender (Filed With SEC on February 29, 2012)

As of February 24, 2012 (Filed With SEC on February 29, 2012)

CREDIT AGREEMENT Dated as of January 11, 2012 between HOKU CORPORATION as Borrower, and INDUSTRIAL AND COMMERCIAL BANK OF CHINA LIMITED, NEW YORK BRANCH as Lender (Filed With SEC on January 11, 2012)

Reimbursement Agreement Tianwei (Filed With SEC on January 11, 2012)

CREDIT AGREEMENT Dated as of November 30, 2011 between HOKU CORPORATION as Borrower, and INDUSTRIAL AND COMMERCIAL BANK OF CHINA LIMITED, NEW YORK BRANCH as Lender (Filed With SEC on December 1, 2011)

Reimbursement Agreement Tianwei (Filed With SEC on December 1, 2011)

AMENDMENT NO. 3 TO AMENDED & RESTATED SUPPLY AGREEMENT (Filed With SEC on November 25, 2011)

NEW YORK BRANCH (Filed With SEC on October 14, 2011)

Exhibit B (Filed With SEC on October 14, 2011)

CREDIT AGREEMENT Dated as of October 5, 2011 between HOKU CORPORATION as Borrower, and INDUSTRIAL AND COMMERCIAL BANK OF CHINA LIMITED, NEW YORK BRANCH as Lender (Filed With SEC on October 6, 2011)

Reimbursement Agreement Tianwei As of October 5, 2011 (Filed With SEC on October 6, 2011)

CREDIT AGREEMENT Dated as of September 1, 2011 between HOKU CORPORATION as Borrower, and INDUSTRIAL AND COMMERCIAL BANK OF CHINA LIMITED, NEW YORK BRANCH as Lender (Filed With SEC on September 2, 2011)

Reimbursement Agreement Tianwei (Filed With SEC on September 2, 2011)

NEW YORK BRANCH (Filed With SEC on August 22, 2011)

Reimbursement Agreement Tianwei (Filed With SEC on August 22, 2011)

AMENDMENT NO. 1 TO (Filed With SEC on August 15, 2011)

AMENDMENT NO. 2 TO SUPPLY AGREEMENT (Filed With SEC on July 15, 2011)

AMENDED AND RESTATED (Filed With SEC on July 15, 2011)

Hoku Corporation (Nasdaq: HOKU) Hoku Solar, Inc. Hoku Materials, Inc. One Hoku Way Pocatello, Idaho 83204 Tel ###-###-#### Fax ###-###-#### www.hokumaterials.com (Filed With SEC on July 15, 2011)

HOKU CORPORATION WARRANT FOR THE PURCHASE OF SHARES OF COMMON STOCK OF HOKU CORPORATION No. [__]Warrant to Purchase1,196,581 Shares (Filed With SEC on July 5, 2011)

CREDIT AGREEMENT Dated as of June 2, 2011 between HOKU CORPORATION as Borrower, and INDUSTRIAL AND COMMERCIAL BANK OF CHINA LIMITED, NEW YORK BRANCH as Lender (Filed With SEC on June 6, 2011)

As of June 2, 2011 (Filed With SEC on June 6, 2011)

HOKU CORPORATION LONG-TERM INCENTIVE COMPENSATION PLAN ARTICLE I NAME AND PURPOSE (Filed With SEC on June 1, 2011)

HOKU CORPORATION RESTRICTED STOCK UNIT ISSUANCE AGREEMENT (Filed With SEC on June 1, 2011)

HOKU CORPORATION PERFORMANCE SHARE AWARD AGREEMENT (Filed With SEC on June 1, 2011)

CREDIT AGREEMENT Dated as of August 16, 2010 between HOKU CORPORATION as Borrower, and CHINA MERCHANTS BANK CO., LTD., NEW YORK BRANCH as Lender (Filed With SEC on April 26, 2011)

CREDIT AGREEMENT Dated as of April 6, 2011 between HOKU CORPORATION as Borrower, and INDUSTRIAL AND COMMERCIAL BANK OF CHINA LIMITED, NEW YORK BRANCH as Lender (Filed With SEC on April 7, 2011)

As of April 6, 2011 (Filed With SEC on April 7, 2011)

NEW YORK BRANCH (Filed With SEC on March 3, 2011)

Reimbursement Agreement Tianwei (Filed With SEC on March 3, 2011)

Amendment No. 5 to (Filed With SEC on February 14, 2011)

NOTE: Portions of this Exhibit are the subject of a Confidential Treatment Request by the Registrant to the Securities and Exchange Commission (the Commission).Such portions have... (Filed With SEC on February 14, 2011)

Exhibit 10.9[*] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED FROM PUBLIC FILING PURSUANT TO A REQUEST FOR CONFIDENTIAL... (Filed With SEC on February 14, 2011)

CREDIT AGREEMENT Dated as of January 10, 2011 between HOKU CORPORATION as Borrower, and INDUSTRIAL AND COMMERCIAL BANK OF CHINA LIMITED, NEW YORK BRANCH as Lender (Filed With SEC on February 14, 2011)

[Signature Page Follows] (Filed With SEC on February 14, 2011)

TERM LOAN CREDIT AGREEMENT Dated as of February 7, 2011 between HOKU CORPORATION as Borrower, and CITIC BANK INTERNATIONAL LIMITED, NEW YORK BRANCH as Lender (Filed With SEC on February 14, 2011)

Reimbursement Agreement Tianwei (Filed With SEC on February 14, 2011)

CREDIT AGREEMENT (Filed With SEC on December 28, 2010)

As of December 23, 2010 (Filed With SEC on December 28, 2010)

[Remainder of page is intentionally blank] (Filed With SEC on December 27, 2010)

Void if not signed & delivered on or before November 30, 2010 (Filed With SEC on December 3, 2010)

Attention to:(REF: CB/010/019) (Filed With SEC on October 20, 2010)

As of October 18, 2010 (Filed With SEC on October 20, 2010)

CREDIT AGREEMENT Dated as of October 8, 2010 between HOKU CORPORATION as Borrower, and CHINA MERCHANTS BANK CO., LTD., NEW YORK BRANCH as Lender (Filed With SEC on October 12, 2010)

As of October 8, 2010 (Filed With SEC on October 12, 2010)

CREDIT AGREEMENT Dated as of September 16, 2010 between HOKU CORPORATION as Borrower, and CHINA MERCHANTS BANK CO., LTD., NEW YORK BRANCH as Lender (Filed With SEC on September 17, 2010)

As of September 16, 2010 (Filed With SEC on September 17, 2010)

CREDIT AGREEMENT Dated as of August 26, 2010 between HOKU CORPORATION as Borrower, and CHINA MERCHANTS BANK CO., LTD., NEW YORK BRANCH as Lender (Filed With SEC on August 30, 2010)

[Remainder of page is intentionally blank] (Filed With SEC on August 30, 2010)

HOKU CHANGE ORDER4.0 (Filed With SEC on July 14, 2010)

AmendmentNo. 4 to SecondAmended & Restated Supply Agreement (Filed With SEC on July 14, 2010)

SALESAGREEEMENT (Filed With SEC on July 14, 2010)

SECOND AMENDED& RESTATED SUPPLY AGREEMENT (Filed With SEC on July 14, 2010)

One Hoku Way Pocatello, Idaho 83204 Tel ###-###-#### Fax ###-###-#### www.hokumaterials.com (Filed With SEC on July 14, 2010)

CREDIT AGREEMENT (Filed With SEC on June 30, 2010)

As of June 30, 2010 (Filed With SEC on June 30, 2010)

CREDIT AGREEMENT Dated as of May 24, 2010 between HOKU CORPORATION as Borrower, and CHINA MERCHANTS BANK CO., LTD., NEW YORK BRANCH as Lender (Filed With SEC on May 26, 2010)

CONSULTINGAGREEMENT (Filed With SEC on March 5, 2010)

AMENDMENTNO. 1 TO AMENDED& RESTATED SUPPLY AGREEMENT (Filed With SEC on February 5, 2010)

AmendmentNo. 3 to SecondAmended & Restated Supply Agreement (Filed With SEC on February 5, 2010)

AMENDMENTNO. 1 TO SUPPLYAGREEMENT (Filed With SEC on February 5, 2010)

HOKUSCIENTIFIC, INC. WARRANTFOR THE PURCHASE OF SHARES OF COMMONSTOCK OF HOKU SCIENTIFIC, INC. (Filed With SEC on December 31, 2009)

INVESTORRIGHTS AGREEMENT dated asof December22, 2009 between TIANWEINEW ENERGY HOLDINGS CO., LTD. and HOKUSCIENTIFIC, INC. TABLEOF CONTENTS (Filed With SEC on December 31, 2009)

Form of Lock-upAgreement (Filed With SEC on December 31, 2009)

AMENDEDAND RESTATED SUPPLY AGREEMENT NO. 1 (Filed With SEC on December 31, 2009)

AMENDEDAND RESTATED SUPPLY AGREEMENT NO. 2 (Filed With SEC on December 31, 2009)

FORMOF SECURITY AGREEMENT (Filed With SEC on December 31, 2009)

[Remainder of page is intentionallyblank] (Filed With SEC on December 31, 2009)

HOKUCHANGE ORDER 4.0 (Filed With SEC on November 9, 2009)

AMENDMENT NO. 3 TO SUPPLYAGREEMENT NO. 1 (Filed With SEC on August 3, 2009)

FIRST AMENDED AND RESTATEDSUPPLY AGREEMENT (Filed With SEC on June 15, 2009)

HOKU CHANGE ORDER3.0 (Filed With SEC on June 15, 2009)

SUPPLYAGREEMENT (Filed With SEC on June 15, 2009)

AMENDED& RESTATED SUPPLY AGREEMENT (Filed With SEC on June 15, 2009)

AmendmentNo. 2 to SecondAmended & Restated Supply Agreement (Filed With SEC on June 15, 2009)

HOKUCHANGE ORDER 3.0 (Filed With SEC on June 15, 2009)

AMENDED& RESTATED SUPPLY AGREEMENT (Filed With SEC on June 15, 2009)

AGREEMENT (Filed With SEC on February 3, 2009)

SUPPLYAGREEMENT (Filed With SEC on February 3, 2009)

HOKUSOLAR POWER I, LLC ACALIFORNIA LIMITED LIABILITY COMPANY OPERATINGAGREEMENT (Filed With SEC on February 3, 2009)

DEVELOPMENTSERVICES AGREEMENT (Filed With SEC on February 3, 2009)

PURCHASEAND SALE AND OPERATION AND MAINTENANCE AGREEMENT (Filed With SEC on February 3, 2009)

RIGHTOF FIRST REFUSAL AGREEMENT (Filed With SEC on February 3, 2009)

GUARANTY (Filed With SEC on February 3, 2009)

AMENDMENTNO. 1 TO SUPPLY AGREEMENT (Filed With SEC on February 3, 2009)

Amendment No. 1 to Second Amended & Restated Supply Agreement (Filed With SEC on October 23, 2008)

ELECTRIC SERVICE AGREEMENT BETWEEN IDAHO POWER COMPANY AND HOKU MATERIALS, INC (Filed With SEC on September 22, 2008)

AMENDED & RESTATED AGREEMENT FOR CONSTRUCTION OF HOKU ELECTRIC SUBSTATION AND ASSOCIATED FACILITIES (Filed With SEC on September 22, 2008)

SUPPLY AGREEMENT (Filed With SEC on July 31, 2008)

Credit Agreement (Filed With SEC on July 30, 2008)

REAL PROPERTY MORTGAGE; SECURITY AGREEMENT; ASSIGNMENT OF RENTS; FIXTURE FILING AND FINANCING STATEMENT (Filed With SEC on July 30, 2008)

HOKU SCIENTIFIC, INC. $54,000,000 Common Stock (par value $0.001 per share) EQUITY DISTRIBUTION AGREEMENT (Filed With SEC on June 16, 2008)

EQUIPMENT PURCHASE & SALE AGREEMENT (Filed With SEC on June 6, 2008)

HOKU CHANGE ORDER 2.0 (Filed With SEC on June 6, 2008)

EQUIPMENT PURCHASE & SALE AGREEMENT (Filed With SEC on June 6, 2008)

FIRST AMENDED & RESTATED SUPPLY AGREEMENT (Suntech Contract No. ____________) (Filed With SEC on June 6, 2008)

SECOND AMENDED & RESTATED SUPPLY AGREEMENT (Filed With SEC on June 6, 2008)

AMENDMENT NO. 1 TO ENGINEERING SERVICES& TECHNOLOGY TRANSFER AGREEMENT NUMBER0743.01 (Filed With SEC on April 9, 2008)

Amendment No. 1 to Supply Agreement (Filed With SEC on March 5, 2008)

REGISTRATION RIGHTS AGREEMENT (Filed With SEC on February 29, 2008)

Amendment No. 2 to Supply Agreement, dated February 25, 2008, by and between Hoku Materials, Inc., and Wuxi Suntech Power Co., Ltd (Filed With SEC on February 25, 2008)

Securities Purchase Agreement, dated February 25, 2008, by and between Hoku Scientific, Inc., and the Purchasers named therein (Filed With SEC on February 25, 2008)

PowerPoint presentation dated January 2008 (Filed With SEC on February 25, 2008)

SUPPLY AGREEMENT (Filed With SEC on February 1, 2008)

AGREEMENT FOR CONSTRUCTION OF HOKU ELECTRIC SUBSTATION AND ASSOCIATED FACILITIES (Filed With SEC on February 1, 2008)

FIRST AMENDED & RESTATED SUPPLY AGREEMENT (Filed With SEC on February 1, 2008)

Whereas, HOKU and SANYO desire to amend the Supply Agreement as hereinafter set forth: (Filed With SEC on January 2, 2008)

COST PLUS INCENTIVE CONSTRUCTION CONTRACT (Filed With SEC on November 13, 2007)

ENGINEERING, PROCUREMENT & CONSTRUCTION (Filed With SEC on November 13, 2007)

PURCHASE &SALE AGREEMENT (Filed With SEC on November 13, 2007)

- and - DYNAMIC ENGINEERING INC ENGINEERING SERVICES & TECHNOLOGY TRANSFER AGREEMENT NUMBER: (Filed With SEC on November 13, 2007)

Whereas, HOKU and SANYO desire to amend the Supply Agreement as hereinafter set forth: (Filed With SEC on October 16, 2007)

AMENDMENT NO. 1 TOSUPPLY AGREEMENT (SUNTECH CONTRACT NO. PUR1-0706092)) (Filed With SEC on August 31, 2007)

SUPPLY AGREEMENT (Filed With SEC on August 6, 2007)

AGREEMENT FOR ENGINEERING OF HOKU ELECTRIC SUBSTATION AND ASSOCIATED FACILITIES (Filed With SEC on August 6, 2007)

SUPPLY AGREEMENT (SUNTECH CONTRACT NO. PUR1-0706092) (Filed With SEC on August 6, 2007)

LOAN MODIFICATION AGREEMENT (Filed With SEC on August 6, 2007)

SUPPLY AGREEMENT (Filed With SEC on June 29, 2007)

Contract (Proposal) (Filed With SEC on June 29, 2007)

AMENDMENT NO. 1 TO SUPPLYAGREEMENT (Filed With SEC on June 29, 2007)

AMENDMENT NO. 1 TO CONTRACT (Filed With SEC on June 29, 2007)

AMENDMENT NO. 1 (Filed With SEC on June 20, 2007)

CREDIT AGREEMENT (Filed With SEC on March 29, 2007)

PLEDGE AND SECURITY AGREEMENT (Filed With SEC on March 29, 2007)

GROUND LEASE BETWEEN The City of Pocatello, a municipal corporation of Idaho (Filed With SEC on March 28, 2007)

contract-no. HOKU-SW 06A Seller Swiss Wafers AG Fichten Str. 2, 8570-Weinfelden, Switzerland ###-###-#### ###-###-#### Buyer Hoku Scientific,Inc. 1075 Opakapaka St., Kapolei, HI... (Filed With SEC on February 14, 2007)

1075 Opakapaka St., Kapolei, HI 96707 ###-###-#### (Main) (808) 682-7807 (Fax) PURCHASE ORDER #: 061023HS (Filed With SEC on February 14, 2007)

PURCHASE AND SALEAGREEMENT October 13, 2006 (Filed With SEC on February 14, 2007)

CONSULTING AGREEMENT (Filed With SEC on November 6, 2006)

HOKU SCIENTIFIC, INC. FISCAL YEAR 2007 EXECUTIVE INCENTIVE COMPENSATION PLAN (Filed With SEC on July 20, 2006)

AMENDMENT OF SOLICITATION/MODIFICATION OFCONTRACT (Filed With SEC on June 29, 2006)

AMENDMENT NO. 1 TO AGREEMENT (SUBCONTRACT NO. USN-001.01) (Filed With SEC on June 29, 2006)

[ * ] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED AND FILEDSEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT... (Filed With SEC on February 14, 2006)

13. THIS ITEM APPLIES ONLY TO MODIFICATIONS OF CONTRACTS/ORDERS. IT MODIFIES THE CONTRACT/ORDER NO. AS DESCRIBED IN ITEM 14. (Filed With SEC on October 5, 2005)

[ * ] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, (Filed With SEC on August 3, 2005)

[ * ] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED AND FILEDSEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT... (Filed With SEC on August 3, 2005)

[*] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED AND FILEDSEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT TO... (Filed With SEC on August 3, 2005)

[ * ] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED AND FILEDSEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT... (Filed With SEC on August 3, 2005)

[4,200,000] Shares1 Hoku Scientific, Inc. (Filed With SEC on July 29, 2005)

[ * ] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED AND FILEDSEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT... (Filed With SEC on July 29, 2005)

[ * ] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, (Filed With SEC on July 26, 2005)

[ * ] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED AND FILEDSEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT... (Filed With SEC on July 26, 2005)

Page 2 of 36 (Filed With SEC on July 26, 2005)

[*] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED AND FILEDSEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT TO... (Filed With SEC on July 26, 2005)

HOKU SCIENTIFIC, INC. (Filed With SEC on July 13, 2005)

LOAN AGREEMENT (Filed With SEC on July 6, 2005)

SECURITY AGREEMENT (Filed With SEC on July 6, 2005)

MORTGAGE, SECURITYAGREEMENT AND FINANCING STATEMENT (Filed With SEC on July 6, 2005)

[ * ] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED AND FILEDSEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT... (Filed With SEC on June 23, 2005)

HOKU SCIENTIFIC, INC. AMENDED & RESTATEDRIGHTS AGREEMENT December 31, 2003 (Filed With SEC on April 28, 2005)

HOKU SCIENTIFIC, INC. (Filed With SEC on April 28, 2005)

HOKU SCIENTIFIC, INC. ADDENDUM TO STOCK OPTION AGREEMENT (Filed With SEC on April 28, 2005)

INDEMNITY AGREEMENT (Filed With SEC on April 28, 2005)

HOKU SCIENTIFIC, INC. (Filed With SEC on April 28, 2005)

2153 King Street LEASE (May 2002) (Filed With SEC on April 28, 2005)

Hoku Expansion Space (Phase 1 Only) (Filed With SEC on April 28, 2005)

[ * ] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, (Filed With SEC on April 28, 2005)

[ * ] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED AND FILEDSEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT... (Filed With SEC on April 28, 2005)

[ * ] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, (Filed With SEC on April 28, 2005)

[ * ] = CERTAIN CONFIDENTIAL INFORMATIONCONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED AND FILED SEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT... (Filed With SEC on April 28, 2005)

[*] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED AND FILEDSEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT TO... (Filed With SEC on April 28, 2005)

[ * ] = CERTAIN CONFIDENTIAL INFORMATION CONTAINED IN THIS DOCUMENT, MARKED BY BRACKETS, HAS BEEN OMITTED AND FILEDSEPARATELY WITH THE SECURITIES AND EXCHANGE COMMISSION PURSUANT... (Filed With SEC on April 28, 2005)

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Hoku Corp Contracts & Agreements