Diodes Incorporated Contracts & Agreements

Letter agreement dated January 13, 2023, by and between the Company and Evan Yu (Filed With SEC on January 17, 2023)

Amendment No. 3 to Second Amended and Restated Credit Agreement, dated as of March 4, 2021, by and among Diodes Incorporated, Diodes Holdings UK Limited, certain subsidiaries of... (Filed With SEC on May 6, 2021)

First Amendment to Second Amended and Restated Credit Agreement dated as of September 21, 2020 (Filed With SEC on February 22, 2021)

Consent Agreement with Respect to Second Amended and Restated Credit Agreement and Foreign Security Agreements dated as of November 2, 2020 (Filed With SEC on February 22, 2021)

First Amendment to Second Amended and Restated Credit Agreement, dated as of September 21, 2020 (Filed With SEC on November 9, 2020)

Consent and Amendment No. 4 to Amended and Restated Credit Agreement (Filed With SEC on May 11, 2020)

Consent and Amendment No. 5 to Amended and Restated Credit Agreement and Limited Waiver (Filed With SEC on May 11, 2020)

Press release dated March 23, 2020 (Filed With SEC on March 26, 2020)

Description of Securities Registered Pursuant to Section 12 of the Securities Exchange Act of 1934 (Filed With SEC on February 12, 2020)

Consent to Credit Agreement (Filed With SEC on August 5, 2019)

Consent to Credit Agreement (Portions of this Exhibit have been omitted) (Filed With SEC on May 7, 2019)

Amended transition agreement between Diodes Incorporated and Richard D. White (Filed With SEC on April 1, 2019)

Transition agreement between Diodes Incorporated and Richard White (Filed With SEC on March 6, 2019)

Consent and Amendment No. 3 to Amended and Restated Credit Agreement dated December 27, 2018, among the parties to the Amended and Restated Credit Agreement dated October 26, 2016... (Filed With SEC on February 21, 2019)

CONSENT TO CREDIT AGREEMENT (Filed With SEC on November 6, 2018)

Amendment to Dinghong Building Lease Agreements between Shanghai Kaihong Electronic Co. Ltd. and Shanghai Dinghong Electronic Co., Ltd (Filed With SEC on November 6, 2018)

Amendment to Yuanhao Building Lease Agreements (Filed With SEC on November 6, 2018)

Termination Agreement to Dinghong Male Dorm Building Lease Agreement between Shanghai Kaihong Electronic Co. Ltd. and Shanghai Dinghong Electronic Co., Ltd (Filed With SEC on November 6, 2018)

Termination Agreement to Dinghong Female Dorm Building Lease Agreement between Shanghai Kaihong Electronic Technology Co, Limited and Shanghai Dinghong Electronic Co. Ltd (Filed With SEC on November 6, 2018)

Power Account Transfer Agreement between Shanghai Kaihong Technology Company Limited and Shanghai YuanHao Co (Filed With SEC on November 6, 2018)

Separation letter between the Company and Mark King dated January 11, 2018 (Filed With SEC on May 8, 2018)

Separation letter between the Company and Ed Tang date d January 18, 2018 (Filed With SEC on May 8, 2018)

Amendment No. 2 dated August 24, 2017 by and among the parties to the Amended and Restated Credit Agreement dated October 26, 2016 (Exhibit 10.85 above) (Filed With SEC on February 20, 2018)

DIODES INCORPORATED SECOND AMENDED AND RESTATED DEFERRED COMPENSATION PLAN ORIGINALLY EFFECTIVE JANUARY 1, 2007 FIRST AMENDED AND RESTATED DECEMBER 22, 2008 AS FURTHER AMENDED AND... (Filed With SEC on February 27, 2017)

Specimen Document For Use By Counsel First Amendment To the Diodes Incorporated Second Amended and Restated Deferred Compensation Plan (Filed With SEC on February 27, 2017)

FRAMEWORK AGREEMENT (Filed With SEC on February 27, 2017)

AMENDMENT NO. 1 to AMENDED AND RESTATED Credit Agreement and Limited waiver (Filed With SEC on February 14, 2017)

CONSENT TO CREDIT AGREEMENT (Filed With SEC on September 7, 2016)

AMENDMENT NO. 4 TO CREDIT AGREEMENT, CONSENT AND JOINDER AGREEMENT (Filed With SEC on July 22, 2016)

DIODES INCORPORATED 2013 EQUITY INCENTIVE PLAN STOCK UNIT AGREEMENT (Filed With SEC on May 5, 2016)

LIMITED WAIVER AND CONSENT (Filed With SEC on May 5, 2016)

AMENDMENT NO. 1 TO AGREEMENT AND PLAN OF MERGER BY AND AMONG DIODES INCORPORATED, PSI MERGER SUB, INC. AND PERICOM SEMICONDUCTOR CORPORATION Dated as of November 6, 2015 AMENDMENT... (Filed With SEC on November 9, 2015)

Chemical Warehouse Lease Agreement (Filed With SEC on November 6, 2015)

Fifth Supplemental Agreement to the Factory Building Lease Agreement (Filed With SEC on November 6, 2015)

AGREEMENT AND PLAN OF MERGER BY AND AMONG DIODESINCORPORATED PSI MERGER SUB, INC. AND PERICOMSEMICONDUCTOR CORPORATION Dated as of September 2, 2015 TABLE OF CONTENTS (Filed With SEC on September 3, 2015)

CONSULTING AGREEMENT AMENDMENT (Filed With SEC on March 2, 2015)

Equity Transfer Agreement (Filed With SEC on May 9, 2014)

Equity Transfer Agreement Amendment (Filed With SEC on May 9, 2014)

Fourth Supplemental Agreement to the Factory Building Lease Agreement (Filed With SEC on May 9, 2014)

PLATING PROCESSING AGREEMENT (Filed With SEC on May 9, 2014)

FRAMEWORK AGREEMENT DATED 2014 BETWEEN DIODES ZETEXLIMITED AND DIODES ZETEX SEMICONDUCTORS LIMITED AND DIODES INCORPORATED and HRTRUSTEES LIMITED AND OTHERS relating to the DIODES... (Filed With SEC on May 9, 2014)

DIODES INCORPORATED 2001 OMNIBUS EQUITY INCENTIVE PLAN STOCK AWARD AGREEMENT (Filed With SEC on May 9, 2014)

DIODES INCORPORATED 2013 EQUITY INCENTIVE PLAN NONSTATUTORY STOCK OPTION AGREEMENT (Filed With SEC on February 27, 2014)

DIODES INCORPORATED 2013 EQUITY INCENTIVE PLAN STOCK UNIT AGREEMENT (Filed With SEC on February 27, 2014)

For Use in China, Germany, South Korea, Taiwan and the United Kingdom (Filed With SEC on February 27, 2014)

Supplement Agreement to Lease Agreement (Filed With SEC on November 12, 2013)

2012 Diodes (Chengdu) Package Testing Plant Construction Project CONSTRUCTION DESIGN CONSULTING ASSIGNMENT AGREEMENT Supplemental Agreement (Filed With SEC on August 8, 2013)

PROCUREMENT AGREEMENT (Filed With SEC on August 8, 2013)

Share Transfer Memorandum of Understanding (Filed With SEC on August 8, 2013)

PLATING PROCESSING AGREEMENT (Filed With SEC on May 10, 2013)

AGREEMENT AND PLAN OF MERGER BY AND AMONG DIODES INCORPORATED DIODES CAYMAN ISLANDS COMPANY LIMITED AND BCD SEMICONDUCTOR MANUFACTURING LIMITED Dated as of December 26,2012... (Filed With SEC on February 27, 2013)

Supplementary Agreement (2) (Filed With SEC on February 27, 2013)

DSH #2 Building Lease Agreement (Filed With SEC on February 27, 2013)

SIXTH AMENDMENT TO CREDIT AGREEMENT (Filed With SEC on November 9, 2012)

Diodes (Chengdu) 1A Packet Test Plant Building Construction Project CONSTRUCTION DESIGN CONSULTING ASSIGNMENT AGREEMENT (Filed With SEC on August 9, 2012)

Due date (no later than) (Filed With SEC on August 9, 2012)

FRAMEWORK AGREEMENT DATED 2012 BETWEEN DIODES ZETEX LIMITED AND DIODES ZETEX SEMICONDUCTORS LIMITED AND DIODES INCORPORATED and HR TRUSTEES LIMITED AND OTHERS relating to the... (Filed With SEC on August 9, 2012)

GUARANTEE DATED 2012 BY DIODES ZETEX SEMICONDUCTORS LIMITED AND DIODES ZETEX LIMITED FOR HR TRUSTEES LIMITED AND OTHERS as trustees of the Diodes Zetex Pension Scheme (Filed With SEC on August 9, 2012)

DIODES ZETEX PENSION SCHEME INFORMATION PROTOCOL 1 CONTENTS (Filed With SEC on August 9, 2012)

LEGAL CHARGE DATED 2012 DIODES ZETEX SEMICONDUCTORS LIMITED and HR TRUSTEES LIMITED AND OTHERS CONTENTS (Filed With SEC on August 9, 2012)

EXCHANGE AGREEMENT (Filed With SEC on February 28, 2012)

FOURTH AMENDMENT TO CREDIT AGREEMENT (Filed With SEC on February 28, 2012)

FIFTH AMENDMENT TO CREDIT AGREEMENT (Filed With SEC on February 7, 2012)

EX-101 INSTANCE DOCUMENT (Filed With SEC on November 9, 2011)

EX-101 INSTANCE DOCUMENT (Filed With SEC on August 9, 2011)

EX-101 INSTANCE DOCUMENT (Filed With SEC on February 28, 2011)

THIRD AMENDMENT TO CREDIT AGREEMENT (Filed With SEC on February 15, 2011)

SECOND AMENDMENT TO CREDIT AGREEMENT (Filed With SEC on December 1, 2010)

EX-101 INSTANCE DOCUMENT (Filed With SEC on November 9, 2010)

EX-101 INSTANCE DOCUMENT (Filed With SEC on August 6, 2010)

CURRENT ASSETS (Filed With SEC on May 7, 2010)

Power Facility Construction Application Agreement (Filed With SEC on March 1, 2010)

First Amendment to the DSH #2 Building Lease Agreement (Filed With SEC on March 1, 2010)

CREDIT AGREEMENT Dated as of November 25, 2009 among DIODES INCORPORATED, and DIODES ZETEX LIMITED as Borrowers, and BANK OF AMERICA, N.A., as Lender (Filed With SEC on December 2, 2009)

As Adjusted (Filed With SEC on November 6, 2009)

EXCHANGE AGREEMENT (Filed With SEC on October 2, 2009)

EXCHANGE AGREEMENT (Filed With SEC on June 15, 2009)

As Adjusted (Filed With SEC on May 8, 2009)

DISTRIBUTORSHIP AGREEMENT (Filed With SEC on February 26, 2009)

Lease Facility Safety Management Agreement Lease Facility Safety Management Agreement Party A (Lessor): Shanghai Yuan Howe Electronic Co., Ltd. Legal Address: No.8 of 18 Lane San... (Filed With SEC on February 26, 2009)

AIADocument B151TM 1997 (Filed With SEC on February 26, 2009)

1969 Incentive Bonus Plan (Amended December 22, 2008) (Filed With SEC on February 26, 2009)

DIODES INCORPORATED 2001 OMNIBUS EQUITY INCENTIVE PLAN (As Amended December 22, 2008) (Filed With SEC on February 26, 2009)

Specimen Draft For Use of Counsel Only Diodes Incorporated Deferred Compensation Plan Effective January 1, 2007 As Amended and Restated December 22, 2008 (Filed With SEC on February 26, 2009)

CURRENT ASSETS (Filed With SEC on November 7, 2008)

CURRENT ASSETS (Filed With SEC on August 11, 2008)

CURRENT ASSETS (Filed With SEC on May 12, 2008)

SUPPLEMENT TO LEASE AGREEMENT-LE0603 (Filed With SEC on February 29, 2008)

SUPPLEMENT TO LEASE AGREEMENT-LE0604 (Filed With SEC on February 29, 2008)

PLATING PROCESSING AGREEMENT (Filed With SEC on February 29, 2008)

Supplementary Agreement to Lease Agreement dated on 28th June 2004 0701-01 (Filed With SEC on February 29, 2008)

Lease Agreement - LE0701 (Filed With SEC on February 29, 2008)

CONSULTING AGREEMENT (Filed With SEC on February 29, 2008)

Exhibit 10.2 THIRD AMENDMENT TO AMENDED AND RESTATED CREDIT AGREEMENT (Filed With SEC on May 10, 2007)

CONFIDENTIALTREATMENT REQUESTED: INFORMATION FOR WHICH CONFIDENTIAL TREATMENT HAS BEEN REQUESTED ISOMITTED AND IS NOTED WITH [REDACTED]. AN UNREDACTED VERSION OFTHIS DOCUMENT HAS... (Filed With SEC on October 24, 2006)

AMENDMENT (Filed With SEC on October 24, 2006)

Amended and Restated Lease Agreement between Townsend Summit, LLC and Diodes FabTech, Inc, effective as of September 1, 2006 (Filed With SEC on October 11, 2006)

DIODES INCORPORATED $200,000,000 2.25% Convertible Senior Notes due 2026 UNDERWRITING AGREEMENT (Filed With SEC on October 6, 2006)

Agreement on purchase of office building located in Taiwan dated April 14, 2006, between Diode-Taiwan and First International Computer, Inc (Filed With SEC on August 9, 2006)

Exhibit - 10.14 Supplementary Agreement to Lease Agreement dated on 5th September 2004 (Filed With SEC on May 10, 2006)

Exhibit - 10.15 Supplementary Agreement to Lease Agreement dated on 28th June 2004 (Filed With SEC on May 10, 2006)

Exhibit - 10.16 Agreement on Application, Construction and Transfer of Power Facilities (Filed With SEC on May 10, 2006)

Exhibit 10.59 SECOND AMENDMENT TO AMENDED AND RESTATED CREDIT AGREEMENT (Filed With SEC on September 2, 2005)

Exhibit 10.60 (Filed With SEC on September 2, 2005)

Exhibit 10.61 REVOLVING NOTE (Filed With SEC on September 2, 2005)

EMPLOYMENT AGREEMENT (Filed With SEC on September 2, 2005)

Exhibit 10.62 TERM NOTE (Filed With SEC on September 2, 2005)

EMPLOYMENT AGREEMENT (Filed With SEC on September 2, 2005)

Exhibit 10.52 Lease Agreement (Filed With SEC on August 9, 2004)

Exhibit 10.53 TERM NOTE (Filed With SEC on August 9, 2004)

Exhibit 10.54 FIRST AMENDMENTTO AMENDED AND RESTATED CREDIT AGREEMENT (Filed With SEC on August 9, 2004)

Exhibit 10.55 (Filed With SEC on August 9, 2004)

Exhibit 10.56 Amendment to The Sale and Lease Agreement dated as January 31, 2002 with Shanghai Ding Hong Electronic Co., Ltd (Filed With SEC on August 9, 2004)

Exhibit 10.57 Lease Agreement (Filed With SEC on August 9, 2004)

Exhibit 10.58 Supplementary to The Lease agreement dated as September 30, 2003 with Shanghai Ding Hong Electronic Co., Ltd (Filed With SEC on August 9, 2004)

CURRENT ASSETS (Filed With SEC on August 13, 2001)

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Diodes Incorporated Contracts & Agreements