AMKOR TECHNOLOGY, INC. Contracts & Agreements

Third Amended and Restated Non-Employee Director Compensation Policy (Filed With SEC on July 30, 2024)

Global Performance-Vested Restricted Stock Unit Award Agreement Guillaume Marie Jean Rutten December 2023 (Filed With SEC on February 16, 2024)

Form of Global Performance-Vested Restricted Stock Unit Award Agreement December 2023 (Filed With SEC on February 16, 2024)

Underwriting Agreement, dated as of September 6, 2023, by and among Amkor Technology, Inc., 915 Investments, LP, and J.P. Morgan Securities LLC and Morgan Stanley & Co. LLC, as... (Filed With SEC on September 7, 2023)

Second Amended and Restated Non-Employee Director Compensation Policy (Filed With SEC on February 22, 2023)

Executive Severance Agreement, dated November 15, 2022, between Amkor Technology, Inc. and Giel Rutten (Filed With SEC on February 22, 2023)

Executive Severance Agreement, dated November 15, 2022, between Amkor Technology, Inc. and Megan Faust (Filed With SEC on February 22, 2023)

Executive Severance Agreement, dated November 15, 2022, between Amkor Technology, Inc. and Farshad Haghighi (Filed With SEC on February 22, 2023)

Executive Severance Agreement, dated November 15, 2022, between Amkor Technology, Inc. and Mark Rogers (Filed With SEC on February 22, 2023)

Executive Severance Agreement, dated February 13, 2023, between Amkor Technology, Inc. and Kevin Engel (Filed With SEC on February 22, 2023)

Executive Employment Agreement, effective January 1, 2023, between Amkor Technology Korea, Inc. and Steve Shin (Filed With SEC on February 22, 2023)

Amended and Restated Amkor Technology, Inc. Non-Employee Director Compensation Policy (Filed With SEC on August 4, 2022)

Non-Employee Director Compensation Policy (Filed With SEC on February 18, 2022)

Form of Global Non-Employee Director Time-Vested Restricted Stock Unit Award Agreement (Filed With SEC on February 18, 2022)

Amendment One to the Amkor Technology, Inc. 2021 Equity Incentive Plan (Filed With SEC on February 18, 2022)

Separation and Release Agreement, dated September 27, 2021, between Amkor Technology, Inc. and John C. Stone (Filed With SEC on October 29, 2021)

Amkor Technology, Inc. 2021 Equity Incentive Plan (Filed With SEC on May 20, 2021)

Form of Global Non-Employee Director Nonstatutory Stock Option Award Agreement (Filed With SEC on May 20, 2021)

Form of Global Non-Employee Director Restricted Stock Award Agreement (Filed With SEC on May 20, 2021)

Form of Global Stock Option Award Agreement (Filed With SEC on May 20, 2021)

Form of Global Restricted Stock Award Agreement (Filed With SEC on May 20, 2021)

Form of Global Performance-Vested Restricted Stock Unit Award Agreement (Filed With SEC on May 20, 2021)

Form of Global Time-Vested Restricted Stock Unit Award Agreement (Filed With SEC on May 20, 2021)

Form of PSU Award Agreement (Filed With SEC on February 5, 2021)

Form of RSU Award Agreement (Filed With SEC on February 5, 2021)

Form of Global Outside Director Nonstatutory Stock Option Award Agreement under the Second Amended and Restated 2007 Equity Incentive Plan (Filed With SEC on October 30, 2020)

Form of Global Outside Director Restricted Stock Award Agreement under the Second Amended and Restated 2007 Equity Incentive Plan (Filed With SEC on October 30, 2020)

Form of Global Stock Option Award Agreement under the Second Amended and Restated 2007 Equity Incentive Plan (Filed With SEC on July 30, 2020)

Form of Global Restricted Stock Award Agreement under the Second Amended and Restated 2007 Equity Incentive Plan (Filed With SEC on July 30, 2020)

Employment Letter Agreement, dated June 24, 2020, between Amkor Technology, Inc. and Guillaume Marie Jean Rutten (Filed With SEC on July 30, 2020)

Separation Agreement and Release, effective July 4, 2020, between Amkor Technology, Inc. and Stephen D. Kelley (Filed With SEC on July 30, 2020)

Description of the Registrants Securities Registered Pursuant to Section 12 of the Securities Exchange Act of 1934 (Filed With SEC on February 19, 2020)

Syndicated Loan Agreement among J-Devices Corporation, Sumitomo Mitsui Banking Corporation and other financial institutions, dated as of December 23, 2019 (English translation) (Filed With SEC on December 26, 2019)

Guaranty by Amkor Technology, Inc. in favor of Sumitomo Mitsui Banking Corporation and other financial institutions, dated as of December 23, 2019 (English translation) (Filed With SEC on December 26, 2019)

Deed of Guaranty by Amkor Technology Singapore Holding Pte. Ltd. in favor of Sumitomo Mitsui Banking Corporation and other financial institutions, dated as of December 23, 2019... (Filed With SEC on December 26, 2019)

Retirement and Release Agreement, dated May 15, 2019, between Amkor Technology, Inc. and Gil C. Tily (Filed With SEC on August 1, 2019)

Amendment One to Second Amended and Restated 2007 Equity Incentive Plan (Filed With SEC on August 1, 2019)

Amendment to Loan and Security Agreement, dated as of July 8, 2019, by and amount Amkor Technology Singapore Holding Pte, Ltd., Bank of America, N.A. and other financial... (Filed With SEC on August 1, 2019)

Indenture, dated March 15, 2019, by and between Amkor Technology, Inc. and U.S. Bank National Association, as trustee (Filed With SEC on March 15, 2019)

Syndicated Loan Agreement among J-Devices Corporation, Sumitomo Mitsui Banking Corporation and other financial institutions, dated as of July 13, 2018 (English translation) (Filed With SEC on July 19, 2018)

Guaranty by Amkor Technology, Inc. in favor of Sumitomo Mitsui Banking Corporation and other financial institutions, dated as of July 13, 2018 (English translation) (Filed With SEC on July 19, 2018)

AMKOR TECHNOLOGY, INC. SECOND AMENDED AND RESTATED 2007 EQUITY INCENTIVE PLAN STOCK OPTION AWARD AGREEMENT (Filed With SEC on May 5, 2017)

AMKOR TECHNOLOGY, INC. SECOND AMENDED AND RESTATED 2007 EQUITY INCENTIVE PLAN RESTRICTED STOCK AWARD AGREEMENT (Filed With SEC on May 5, 2017)

AMKOR TECHNOLOGY, INC. SECOND AMENDED AND RESTATED 2007 EQUITY INCENTIVE PLAN OUTSIDE DIRECTOR NONSTATUTORY STOCK OPTION AWARD AGREEMENT (Filed With SEC on May 5, 2017)

AMKOR TECHNOLOGY, INC. SECOND AMENDED AND RESTATED 2007 EQUITY INCENTIVE PLAN (Filed With SEC on May 5, 2017)

AMKOR TECHNOLOGY, INC. (Filed With SEC on May 5, 2017)

AGREEMENT AND RELEASE (Filed With SEC on November 4, 2016)

AMENDMENT NO. 2 TO AMKOR TECHNOLOGY, INC. AMENDED AND RESTATED 2007 EQUITY INCENTIVE PLAN (Filed With SEC on August 8, 2016)

AMKOR TECHNOLOGY, INC. AMENDED AND RESTATED 2007 EQUITY INCENTIVE PLAN OUTSIDE DIRECTOR STOCK OPTION AWARD AGREEMENT (Filed With SEC on May 5, 2016)

AMENDMENT NO. 1 TO AMKOR TECHNOLOGY, INC. AMENDED AND RESTATED 2007 EQUITY INCENTIVE PLAN (Filed With SEC on October 30, 2015)

AMKOR TECHNOLOGY, INC. AMENDED AND RESTATED 2007 EQUITY INCENTIVE PLAN STOCK OPTION AWARD AGREEMENT (Filed With SEC on April 30, 2015)

AMKOR TECHNOLOGY, INC. AMENDED AND RESTATED 2007 EQUITY INCENTIVE PLAN OUTSIDE DIRECTOR STOCK OPTION AWARD AGREEMENT (Filed With SEC on April 30, 2015)

SEPARATION AGREEMENT AND RELEASE (Filed With SEC on April 30, 2015)

AMKOR TECHNOLOGY, INC. AMENDED AND RESTATED 2007 EQUITY INCENTIVE PLAN STOCK OPTION AWARD AGREEMENT (Filed With SEC on February 19, 2015)

AMENDMENT AGREEMENT TO LOAN AGREEMENT (Filed With SEC on February 28, 2014)

SEPARATION AND CONSULTING AGREEMENT (Filed With SEC on August 2, 2013)

LOAN AGREEMENT USD 150,000,000 AMKOR TECHNOLOGY KOREA, INC. Borrower THE KOREA DEVELOPMENT BANK Lender April 29, 2013 TABLE OF CONTENTS Article 1.Definitions.11.01Defined... (Filed With SEC on August 2, 2013)

Department Head (Filed With SEC on August 2, 2013)

Guarantee Date:April 29, 2013 (Filed With SEC on August 2, 2013)

Prepared by (Filed With SEC on August 2, 2013)

REGISTRATION RIGHTS AGREEMENT Dated May 20, 2013 among AMKORTECHNOLOGY, INC. and DEUTSCHE BANK SECURITIES INC. and CREDIT SUISSE SECURITIES (USA) LLC REGISTRATION RIGHTS AGREEMENT (Filed With SEC on May 20, 2013)

RETIREMENT AGREEMENT AND RELEASE (Filed With SEC on May 10, 2013)

Reviewed by (Filed With SEC on May 3, 2013)

(Corporate Borrower) (Filed With SEC on May 3, 2013)

LOAN AGREEMENT USD 100,000,000 AMKOR TECHNOLOGY KOREA, INC. - Borrower - THE KOREA DEVELOPMENT BANK - Lender - November 23, 2012 TABLE OF CONTENTS (Filed With SEC on November 27, 2012)

Department Head (Filed With SEC on November 27, 2012)

AMKOR TECHNOLOGY, INC. 6.375% SENIOR NOTES DUE 2022 INDENTURE Dated as of September 21, 2012 U.S. BANKNATIONAL ASSOCIATION Trustee TABLE OF CONTENTS (Filed With SEC on September 21, 2012)

REGISTRATION RIGHTS AGREEMENT Dated September 21, 2012 among AMKOR TECHNOLOGY, INC. and DEUTSCHEBANK SECURITIES INC. and UBS SECURITIES LLC REGISTRATION RIGHTS AGREEMENT (Filed With SEC on September 21, 2012)

AMKOR TECHNOLOGY, INC. AMENDED AND RESTATED 2007 EQUITY INCENTIVE PLAN STOCK OPTION AWARD AGREEMENT (Filed With SEC on August 2, 2012)

AMKOR TECHNOLOGY, INC. AMENDED AND RESTATED 2007 EQUITY INCENTIVE PLAN RESTRICTED STOCK AWARD AGREEMENT (Filed With SEC on August 2, 2012)

Person in Charge (Filed With SEC on March 23, 2012)

General Terms and Conditions for BankCredit Transactions (Corporate Borrower) (Filed With SEC on March 23, 2012)

EX-101 INSTANCE DOCUMENT (Filed With SEC on August 4, 2011)

AMKOR TECHNOLOGY, INC. (Filed With SEC on May 20, 2011)

REGISTRATION RIGHTS AGREEMENT Dated May 20, 2011 among AMKOR TECHNOLOGY, INC. and DEUTSCHE BANK SECURITIES INC. and CITIGROUP GLOBAL MARKETS INC. (Filed With SEC on May 20, 2011)

Credit Facility Agreement (For Corporate Borrower) To: Woori Bank Date: May 24, 2010 (Filed With SEC on May 27, 2010)

Additional Agreement (Filed With SEC on May 27, 2010)

General Terms and Conditions for Bank Credit Transactions (Corporate Borrower) (Filed With SEC on May 27, 2010)

Prepared by Reviewed by Approved by (Filed With SEC on May 27, 2010)

Kun-guarantee (for Customer) (Filed With SEC on May 27, 2010)

Financial Statements (Filed With SEC on May 5, 2010)

AMKOR TECHNOLOGY, INC. (Filed With SEC on May 5, 2010)

REGISTRATION RIGHTS AGREEMENT (Filed With SEC on May 5, 2010)

Financial Statements (Filed With SEC on May 6, 2009)

AMKOR TECHNOLOGY, INC., as Borrower (Filed With SEC on April 16, 2009)

AMKOR TECHNOLOGY, INC. (Filed With SEC on April 1, 2009)

Designing and developing new package and test technologies (Filed With SEC on February 24, 2009)

AMKOR TECHNOLOGY, INC. (Filed With SEC on August 7, 2008)

Financial Statements (Filed With SEC on May 5, 2008)

2007 Executive Incentive Bonus Plan (Filed With SEC on August 10, 2007)

Financial Statements (Filed With SEC on May 4, 2007)

For the Three Months (Filed With SEC on October 6, 2006)

Limited Waiver of Loan and Security Agreement, dated as of September 25, 2006, among Amkor Technology, Inc. and its Subsidiaries party thereto, the Lenders party thereto, and Bank... (Filed With SEC on September 29, 2006)

Supplemental Indenture, dated as of June 30, 2006, among Amkor Technology, Inc. (Amkor), Amkor International Holdings (AIH), Amkor Technology Limited (ATL), Amkor Technology... (Filed With SEC on July 7, 2006)

Underwriting Agreement, dated May 11, 2006, between Amkor Technology, Inc. and Citigroup Global Markets Inc., for $400 million aggregate principal amount of 9.25% Senior Notes due... (Filed With SEC on May 15, 2006)

FIRST AMENDMENT TO LOAN AND SECURITY AGREEMENT (Filed With SEC on May 11, 2006)

Guaranty Supplement (Filed With SEC on May 11, 2006)

Joinder Agreement (Filed With SEC on May 11, 2006)

Providing a broad portfolio of packaging and test technologies and services (Filed With SEC on March 16, 2006)

For the Three Months Ended (Filed With SEC on November 8, 2005)

For the Three Months Ended (Filed With SEC on August 8, 2005)

Amendment No. 2 to Credit Agreement, dated as of May 24, 2005 among Amkor Technology, Inc., the Lenders party thereto and Citicorp North America, Inc., as Administrative Agent (Filed With SEC on May 27, 2005)

Guaranty Supplement (Filed With SEC on May 18, 2005)

JOINDER AGREEMENT (Filed With SEC on May 18, 2005)

Guaranty Supplement (Filed With SEC on May 18, 2005)

JOINDER AGREEMENT (Filed With SEC on May 18, 2005)

SUPPLEMENTAL INDENTURE (Filed With SEC on January 10, 2005)

EXHIBIT 10.1 SUPPLEMENTAL INDENTURE REGARDING AMKOR'S 10 1/2% SENIOR SUBORDINATED NOTES DUE 2009 (Filed With SEC on November 4, 2004)

EXHIBIT 10.2 SUPPLEMENTAL INDENTURE REGARDING AMKOR'S 10 1/2% SENIOR SUBORDINATED NOTES DUE 2009 (Filed With SEC on November 4, 2004)

EXHIBIT 10.3 SUPPLEMENTAL INDENTURE REGARDING AMKOR'S 9 1/4% SENIOR NOTES DUE 2008 (Filed With SEC on November 4, 2004)

EXHIBIT 10.4 SUPPLEMENTAL INDENTURE REGARDING AMKOR'S 9 1/4% SENIOR NOTES DUE 2008 (Filed With SEC on November 4, 2004)

EXHIBIT 10.5 SUPPLEMENTAL INDENTURE REGARDING AMKOR'S 7.75% SENIOR NOTES DUE 2013 (Filed With SEC on November 4, 2004)

EXHIBIT 10.6 SUPPLEMENTAL INDENTURE REGARDING AMKOR'S 7.75% SENIOR NOTES DUE 2013 (Filed With SEC on November 4, 2004)

EXHIBIT 10.7 SUPPLEMENTAL INDENTURE REGARDING AMKOR'S 7 1/8% SENIOR NOTES DUE 2011 (Filed With SEC on November 4, 2004)

EXHIBIT 10.8 SUPPLEMENTAL INDENTURE REGARDING AMKOR'S 7 1/8% SENIOR NOTES DUE 2011 (Filed With SEC on November 4, 2004)

SECOND LIEN CREDIT AGREEMENT, DATED AS OF OCTOBER 27, 2004 (Filed With SEC on November 2, 2004)

SECOND LIEN PLEDGE AND SECURITY AGREEMENT DATED AS OF OCTOBER 27, 2004 (Filed With SEC on November 2, 2004)

SUBSIDIARY GUARANTY, DATED AS OF OCTOBER 27, 2004 (Filed With SEC on November 2, 2004)

AMENDMENT NO. 1 TO CREDIT AGREEMENT, DATED AS OF OCTOBER 27, 2004 (Filed With SEC on November 2, 2004)

AMENDMENT NO. 1 TO PLEDGE AND SECURITY AGREEMENT, DATED AS OF OCTOBER 27, 2004 (Filed With SEC on November 2, 2004)

GUARANTY SUPPLEMENT, DATED AS OF OCTOBER 27, 2004 (Filed With SEC on November 2, 2004)

INTERCREDITOR AGREEMENT, DATED AS OF OCTOBER 27, 2004 (Filed With SEC on November 2, 2004)

STOCK PURCHASE AGREEMENT DATED JULY 19, 2004 (Filed With SEC on September 3, 2004)

STOCK PURCHASE AGREEMENT DATED JUNE 3, 2004 (Filed With SEC on September 3, 2004)

Asset Purchase Agreement dated as of May 17, 2004; IBM Singapore Pte Ltd (Filed With SEC on August 6, 2004)

Asset Purchase Agreement dated as of May 17, 2004; IBM Interconnect Packaging Solutions (Shanghi) Co., Ltd (Filed With SEC on August 6, 2004)

Sales Contract of Commodity Premises (Filed With SEC on August 6, 2004)

$30,000,000 CREDIT AGREEMENT Dated as of June 29, 2004 among AMKOR TECHNOLOGY, INC. as Borrower and THE LENDERS AND ISSUERS PARTY HERETO and CITICORP NORTH AMERICA, INC. as... (Filed With SEC on July 9, 2004)

GUARANTY (Filed With SEC on July 9, 2004)

PLEDGE AND SECURITY AGREEMENT Dated as of June 29, 2004 among AMKOR TECHNOLOGY, INC. GUARDIAN ASSETS, INC. as Grantors and Each Other Grantor From Time to Time Party Hereto and... (Filed With SEC on July 9, 2004)

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AMKOR TECHNOLOGY, INC. Contracts & Agreements