Advanced Micro Devices Inc | Business Contracts

Retirement Transition Agreement and General Release dated February 15, 2023 between Advanced Micro Devices, Inc. and Devinder Kumar (Filed With SEC on February 21, 2023)

Offer Letter between Advanced Micro Devices, Inc. and Jean Hu (Filed With SEC on January 11, 2023)

Description of Advanced Micro Devices, Inc. Common Stock (Filed With SEC on August 3, 2022)

First Amendment to Amended and Restated Wafer Supply Agreement No. 7, among Advanced Micro Devices, Inc., GLOBALFOUNDRIES, Inc. and GLOBALFOUNDRIES U.S. Inc., dated December 23,... (Filed With SEC on February 3, 2022)

Agreement and Plan of Merger, dated as of October 26, 2020, by and among Advanced Micro Devices, Inc., Thrones Merger Sub, Inc. and Xilinx, Inc (Filed With SEC on October 27, 2020)

Sign-On Bonus Agreement between Advanced Micro Devices, Inc. and Jean Hu (Filed With SEC on January 11, 2023)

Outside Director Equity Compensation Policy, as amended and restated, dated as (Filed With SEC on November 2, 2022)

Form of Restricted Stock Unit Agreement for Senior Vice Presidents and Above under the Xilinx, Inc. 2007 Equity Incentive Plan (Filed With SEC on August 3, 2022)

Form of Performance-based Restricted Stock Unit Agreement for Senior Vice Presidents and Above under the Xilinx, Inc. 2007 Equity Incentive Plan (Filed With SEC on August 3, 2022)

First Supplemental Indenture, dated as of June 9, 2022, by and between the Company and U.S. Bank Trust Company, National Association, as trustee (Filed With SEC on June 9, 2022)

Indenture, dated as of June 9, 2022, by and between the Company and U.S. Bank Trust Company, National Association, as trustee (Filed With SEC on June 9, 2022)

Underwriting Agreement, dated as of June 7, 2022, by and among Advanced Micro Devices, Inc. and Barclays Capital Inc., BofA Securities, Inc., Credit Suisse Securities (USA) LLC,... (Filed With SEC on June 8, 2022)

Xilinx, Inc. 2007 Equity Incentive Plan (Filed With SEC on May 4, 2022)

Offer Letter between Advanced Micro Devices, Inc. and Victor Peng dated March 8, 2022 (Filed With SEC on May 4, 2022)

2004 Equity Incentive Plan, as amended and restated, dated February 23, 2022 (Filed With SEC on May 4, 2022)

2030 Supplemental Indenture (Filed With SEC on February 14, 2022)

2024 Supplemental Indenture (Filed With SEC on February 14, 2022)

Amended and Restated Wafer Supply Agreement Amendment No. 7, among Advanced Micro Devices, Inc., GLOBALFOUNDRIES, Inc. and GLOBALFOUNDRIES U.S. Inc., dated as of May 12, 2021 (Filed With SEC on July 28, 2021)

Form of Stock Option Agreement for Senior Vice Presidents and Above under the 2004 Equity Incentive plan (Filed With SEC on July 28, 2021)

Form of Restricted Stock Unit Agreement for Senior Vice Presidents and Above under the 2004 Equity Incentive Plan (Filed With SEC on July 28, 2021)

Form of Performance-based Restricted Stock Unit Agreement for Senior Vice Presidents and Above under the 2004 Equity Incentive Plan (Filed With SEC on July 28, 2021)

Company-Provided Business Aircraft Usage and Commercial Travel by Personal Guests Policy revised as of January 25, 2021 (Filed With SEC on January 29, 2021)

Wafer Supply Agreement Amendment No. 5, among Advanced Micro Devices, Inc., GLOBALFOUNDRIES Inc. and GLOBALFOUNDRIES U.S. Inc., dated as of April 16, 2015 (Filed With SEC on October 28, 2020)

Wafer Supply Agreement Amendment No. 6, among Advanced Micro Devices, Inc., GLOBALFOUNDRIES, Inc. and GLOBALFOUNDRIES U.S., Inc., dated August 30, 2016 (Filed With SEC on October 28, 2020)

Wafer Supply Agreement Amendment No. 4, among Advanced Micro Devices, Inc., GLOBALFOUNDRIES Inc. and GLOBALFOUNDRIES U.S. Inc., dated March 30, 2014 (Filed With SEC on October 28, 2020)

Wafer Supply Agreement Amendment No. 2, among Advanced Micro Devices, Inc., GLOBALFOUNDRIES Inc., GLOBALFOUNDRIES U.S. Inc., Advanced Technology Investment Company LLC and ATIC... (Filed With SEC on October 28, 2020)

Wafer Supply Agreement Amendment No. 1, among Advanced Micro Devices, Inc., GLOBALFOUNDRIES Inc., GLOBALFOUNDRIES U.S. Inc. and GLOBALFOUNDRIES Singapore. Pte. Ltd., dated March... (Filed With SEC on October 28, 2020)

Wafer Supply Agreement, among Advanced Micro Devices, Inc., The Foundry Company and AMD Fab Technologies US, Inc., dated March 2, 2009 (Filed With SEC on October 28, 2020)

Wafer Supply Agreement Amendment No. 3, among Advanced Micro Devices, Inc., GLOBALFOUNDRIES Inc. and GLOBALFOUNDRIES U.S. Inc., dated December 6, 2012 (Filed With SEC on October 28, 2020)

Form of Restricted Stock Unit Agreement for Senior Vice (Filed With SEC on July 29, 2020)

Form of Stock Option Agreement for Senior Vice Presidents and Above under the 2004 Equity Incentive Plan (Filed With SEC on July 29, 2020)

Form of Performance-based Restricted Stock Unit Agreement for Senior Vice Presidents and Above under the 2004 Equity Incentive Plan (Filed With SEC on July 29, 2020)

Advanced Micro Devices, Inc. Outside Director Equity Compensation Policy, as amended and restated, dated February 12, 2020 (Filed With SEC on April 29, 2020)

Description of Advanced Micro Devices, Inc. Common Stock (Filed With SEC on February 4, 2020)

Value Creation Performance-Based Restricted Stock Unit Grant Notice between Advanced Micro Devices, Inc. and Lisa T. Su, dated August 9, 2019 (Filed With SEC on October 30, 2019)

Offer Letter between Advanced Micro Devices, Inc. and Rick Bergman dated August 1, 2019 (Filed With SEC on October 30, 2019)

Sign-On Bonus Letter between Advanced Micro Devices, Inc. and Rick Bergman dated August 1, 2019 (Filed With SEC on October 30, 2019)

2004 Equity Incentive Plan, as amended and restated, dated August 21, 2019 (Filed With SEC on October 30, 2019)

Value Creation Performance-Based Restricted Stock Unit Grant Notice between Advanced Micro Devices, Inc. and Mark Papermaster, dated August 9, 2019 (Filed With SEC on October 30, 2019)

Advanced Micro Devices, Inc. Outside Director Equity Compensation Policy, as amended and restated, dated August 21, 2019 (Filed With SEC on October 30, 2019)

Amendment to Advanced Micro Devices, Inc. Executive Incentive Plan dated as of August 21, 2019 (Filed With SEC on October 30, 2019)

Wafer Supply Agreement Amendment No. 7, among Advanced Micro Devices, Inc., GLOBALFOUNDRIES Inc. and GLOBALFOUNDRIES U.S. Inc., dated January 28, 2019 (Filed With SEC on May 1, 2019)

Sign-On Bonus Agreement, between Advanced Micro Devices, Inc. and Sandeep Chennakeshu, dated January 19, 2019 (Filed With SEC on May 1, 2019)

Offer Letter, between Advanced Micro Devices, Inc. and Sandeep Chennakeshu, dated January 14, 2019 (Filed With SEC on May 1, 2019)

Form of Performance-based Restricted Stock Unit Agreement for Senior Vice Presidents and Above under the 2004 Equity Incentive Plan (Filed With SEC on February 8, 2019)

Form of Restricted Stock Unit Agreement for Senior Vice Presidents and Above under the 2004 Equity Incentive Plan (Filed With SEC on February 8, 2019)

Form of Stock Option Agreement for Senior Vice Presidents and Above under the 2004 Equity Incentive plan (Filed With SEC on February 8, 2019)

Advanced Micro Devices Inc (47)