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Tech Hardware & Peripherals
Technology Hardware, Storage & Peripherals (1,164) | Uncategorized (1,164)
- 3D Systems Corporation (15 contracts)
- AEROHIVE NETWORKS, INC (8)
- Apple (38)
- AstroNova, Inc. (6)
- AVID TECHNOLOGY, INC. (15)
- AZZURRA HOLDING CORP (2)
- Blockchain Holdings Capital Ventures, Inc. (13)
- Borqs Technologies, Inc. (35)
- Boxlight Corp (56)
- Corsair Gaming, Inc. (1)
- CPI Card Group Inc. (10)
- Cray Inc. (40)
- DELL INC (37)
- Dell Technologies Inc (9)
- Diebold Nixdorf, Incorporated (64)
- dMY Technology Group, Inc. III (9)
- EASTMAN KODAK CO (35)
- Electronics for Imaging, Inc. (15)
- Helo Corp. (1)
- Hewlett Packard Enterprise (19)
- HP Inc. (67)
- iMine Corp (3)
- IMMERSION CORP (34)
- INTEVAC INC (15)
- IONIX TECHNOLOGY, INC. (3)
- LOGITECH INTERNATIONAL SA (10)
- Movano Inc. (7)
- NCR Corp (59)
- NetApp (94)
- NOVINT TECHNOLOGIES INC (8)
- ON TRACK INNOVATIONS LTD (9)
- ONE STOP SYSTEMS, INC. (3)
- PUGET TECHNOLOGIES, INC. (9)
- Pure Storage, Inc. (9)
- QUALSTAR CORP (4)
- QUANTUM CORP (41)
- Roman DBDR Tech Acquisition Corp. (10)
- Seagate Technology (48)
- SOCKET MOBILE, INC. (1)
- SONIM TECHNOLOGIES INC (5)
- Super Micro Computer, Inc. (26)
- TRANSACT TECHNOLOGIES INC (9)
- VERITEC INC (5)
- VIDEO DISPLAY CORP (8)
- Western Digital (163)
- Xerox (81)
- Xerox Holdings Corp (5)
- FIRST SUPPLEMENTAL INDENTURE (Diebold Nixdorf, Incorporated, Filed With SEC on June 1, 2023)
- FIRSTAMENDMENT AND WAIVER (Diebold Nixdorf, Incorporated, Filed With SEC on June 1, 2023)
- FORBEARANCE AND AMENDMENT AGREEMENT (Diebold Nixdorf, Incorporated, Filed With SEC on June 1, 2023)
- GUARANTORLIMITED RELEASE AGREEMENT (Diebold Nixdorf, Incorporated, Filed With SEC on June 1, 2023)
- GUARANTOR LIMITED RELEASE AGREEMENT (Diebold Nixdorf, Incorporated, Filed With SEC on June 1, 2023)
- SECURITY RELEASE AND AMENDMENT AGREEMENT (Sicherheitenfreigabe- und -änderungsvereinbarung) (Diebold Nixdorf, Incorporated, Filed With SEC on June 1, 2023)
- FIRST SUPPLEMENTAL INDENTURE (Diebold Nixdorf, Incorporated, Filed With SEC on June 1, 2023)
- FIRST SUPPLEMENTAL INDENTURE (Diebold Nixdorf, Incorporated, Filed With SEC on June 1, 2023)
- 2023 Amendment to the HP Inc. Cash Account Restoration Plan (HP Inc., Filed With SEC on May 31, 2023)
- Third Amendment to the HP Inc. Excess Benefit Plan (HP Inc., Filed With SEC on May 31, 2023)
- Restructuring Support Agreement, dated as of May 30, 2023, among Diebold Nixdorf, Incorporated, certain of its subsidiaries and the Initial Consenting Creditors identified therein (Diebold Nixdorf, Incorporated, Filed With SEC on May 30, 2023)
- Offer Letter, dated May 26, 2023, between Immersion Corporation and J. Michael Dodson (IMMERSION CORP, Filed With SEC on May 30, 2023)
- Description of the Registrant's Securities (LOGITECH INTERNATIONAL SA, Filed With SEC on May 17, 2023)
- Offer Letter between Logitech Inc, and Charles Boynton, dated (LOGITECH INTERNATIONAL SA, Filed With SEC on May 17, 2023)
- Officers Certificate of Apple Inc., dated May 10, 2023 (Apple, Filed With SEC on May 10, 2023)
- Offer Letter, dated May 3, 2023 by and between CPI Card Group Inc. and Jeffrey Hochstadt (CPI Card Group Inc., Filed With SEC on May 9, 2023)
- Letter Agreement, dated April 24, 2023, between the Company and John M. Dillon (TRANSACT TECHNOLOGIES INC, Filed With SEC on April 26, 2023)
- Notice of Borrowing, dated April 24, 2023, from Boxlight Corporation addressed to Whitehawk Capital Partners, LP (Boxlight Corp, Filed With SEC on April 26, 2023)
- Form of Deferred Cash Award Agreement (Diebold Nixdorf, Incorporated, Filed With SEC on April 3, 2023)
- Amended and Restated Insider Trading Policy (Boxlight Corp, Filed With SEC on March 17, 2023)
- Description of Securities (Boxlight Corp, Filed With SEC on March 17, 2023)
- Amendment to Executive Chairman and CEO Agreement between Eastman Kodak Company and JamesV. Continenza, dated November 30, 2022 (EASTMAN KODAK CO, Filed With SEC on March 16, 2023)
- Offer Letter, dated February 7, 2023, by and between Diebold Nixdorf, Incorporated and James Barna (Diebold Nixdorf, Incorporated, Filed With SEC on February 9, 2023)
- Offer Letter between the Company and Kenneth P. Gianella dated December 15, 2022 (QUANTUM CORP, Filed With SEC on January 11, 2023)
- Second Amendment to Transaction Support Agreement, dated as of December 20, 2022, among Diebold Nixdorf, Incorporated, other guarantors under the Existing Documents (as defined in... (Diebold Nixdorf, Incorporated, Filed With SEC on December 21, 2022)
- First Amendment to Transaction Support Agreement, dated as of November 28, 2022, among Diebold Nixdorf, Incorporated, other guarantors under the Existing Documents (as defined in... (Diebold Nixdorf, Incorporated, Filed With SEC on November 29, 2022)
- Offer Letter dated October 31, 2022 between the Company and John G. Bruno (Xerox, Filed With SEC on November 18, 2022)
- Offer Letter - Joe Myers (Diebold Nixdorf, Incorporated, Filed With SEC on November 9, 2022)
- Certificate of Amendment to the Amended and Restated Certificate of Incorporation (QUANTUM CORP, Filed With SEC on November 2, 2022)
- Description of Securities of the Registrant (Apple, Filed With SEC on October 28, 2022)
- Transaction Support Agreement, dated as of October 20, 2022, among Diebold Nixdorf, Incorporated, certain of its subsidiaries and the Initial Consenting Holders identified therein (Diebold Nixdorf, Incorporated, Filed With SEC on October 20, 2022)
- Offer letter, effective as of October 6, 2022, between Intevac and Mark Popovich (INTEVAC INC, Filed With SEC on October 12, 2022)
- Director Offer Letter between Quantum Corporation and Don Jaworski, dated September 16, 2022 (QUANTUM CORP, Filed With SEC on September 28, 2022)
- Director Offer Letter between Quantum Corporation and (QUANTUM CORP, Filed With SEC on September 28, 2022)
- FFL Second Commitment and Extension Agreement, dated as of May 15, 2019, by and among Toshiba Memory Corporation, Toshiba Memory Iwate Corporation, Western Digital Corporation,... (Western Digital, Filed With SEC on August 25, 2022)
- FFL Commitment and Extension Agreement, dated as of December 12, 2017, by and among Toshiba Memory Corporation, Western Digital Corporation, SanDisk LLC and SanDisk Flash B.V (Western Digital, Filed With SEC on August 25, 2022)
- Flash Forward Master Agreement, dated as of July 13, 2010, entered into by and among, on one side, Toshiba Corporation and, on the other side, SanDisk Corporation, and SanDisk... (Western Digital, Filed With SEC on August 25, 2022)
- At the Market Issuance Agreement, dated August 15, 2022 by and between the Company, as issuer, and B. Riley Securities, Inc. as sale agent (Movano Inc., Filed With SEC on August 15, 2022)
- Officers Certificate of Apple Inc., dated August 8, 2022 (Apple, Filed With SEC on August 8, 2022)
- Offer Letter dated August 2, 2022, between Steven Bandrowczak, Xerox Holdings Corporation and Xerox Corporation (Xerox, Filed With SEC on August 3, 2022)