Diodes Incorporated Services Agreements

7 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Plating Processing Agreement between Zetex (Chengdu) Electronic Company Limited and Diodes Technology (Chengdu) Company Limited
Services Agreements
Diodes Incorporated
Semiconductors & Semiconductor Equipment
2014
Supplemental Agreement to Construction Design Consulting Assignment between Diodes Technology (Chengdu) and Lite-On Technology
Services Agreements
Diodes Incorporated
Semiconductors & Semiconductor Equipment
2013
Plating Processing Agreement between Zetex (Chengdu) Electronic Company Limited and Diodes Technology (Chengdu) Company Limited
Services Agreements
Diodes Incorporated
Semiconductors & Semiconductor Equipment
2013
Construction Design Consulting Assignment Agreement between Diodes Technology (Chengdu) Company Limited and Lite-On Technology Corporation
Services Agreements
Diodes Incorporated
Semiconductors & Semiconductor Equipment
2012
Plating Processing Agreement among Shanghai Ding Hong Electronic, Shanghai Micro-Surface, Shanghai Kai Hong Electronic, and Shanghai Kai Hong Technology (2007)
Services Agreements
Diodes Incorporated
Semiconductors & Semiconductor Equipment
2008
Power Facility Expansion Construction Contract between Shanghai Kai Hong Technology Electronic Co., Ltd. and Shanghai Yuan Howe Electronic Co., Ltd.
Services Agreements
Diodes Incorporated
Semiconductors & Semiconductor Equipment
2011
Architectural Services Agreement between Diodes, Inc. and Corgan Associates, Inc. for Plano, Texas Headquarters Project
Services Agreements
Diodes Incorporated
Semiconductors & Semiconductor Equipment
2009