Power Integrations, Inc. Business Operations Contracts & Agreements
40 Contracts & Agreements
- Development Agreements (1 contract)
- Settlement Agreements (1)
- Supply Agreements (36)
- Termination Agreements (2)
- Amendment Number Five to the Amended and Restated Wafer Supply Agreement between Power Integrations International, Ltd. and X-FAB Dresden GmbH & Co. KG, dated December 23, 2009 (Filed With SEC on November 7, 2023)
- Amendment Number One to the Amended and Restated Wafer Supply Agreement between Power Integrations International, Ltd. and XFAB Dresden GmbH & Co. KG, effective as of July 20, 2005 (Filed With SEC on November 7, 2023)
- Amended and Restated Wafer Supply Agreement between us and OKI Electric Industry Co., Ltd., dated as of April 1, 2003 (Filed With SEC on November 7, 2023)
- Wafer Supply Agreement between us and ZMD Analog Mixed Signal Services GmbH & Co. KG, dated as of May 23, 2003 (Filed With SEC on November 7, 2023)
- Amendment Number One to the Amended and Restated Wafer Supply Agreement between us and OKI Electric Industry Co., Ltd, effective as of August 11, 2004 (Filed With SEC on November 7, 2023)
- Amendment Number Eleven to Wafer Supply Agreement, effective as of September 16, 2022 by Power Integrations International Ltd. and Seiko Epson Corporation (Filed With SEC on May 4, 2023)
- Amendment Number Eight to the Amended and Restated Wafer Supply Agreement between Power Integrations International, Ltd. and Lapis Semiconductor Co., Ltd., effective as of July... (Filed With SEC on August 4, 2022)
- Amendment Number Thirteen to the Amended and Restated Wafer Supply Agreement between Power Integrations, Ltd. d.b.a. Power Integrations International, Ltd. And Lapis Semiconductor... (Filed With SEC on April 28, 2022)
- Amendment Number Three to the Amended and Restated Wafer Supply Agreement between Power Integrations International, Ltd. And X-FAB Semiconductor Foundries AG, effective as of... (Filed With SEC on July 29, 2021)
- Amendment Number Twelve to the Amended and Restated Wafer Supply Agreement, between Power Integrations International, Ltd. and Lapis Semiconductor Co., Ltd. (formerly OKI... (Filed With SEC on April 29, 2021)
- Amendment Number Six to Wafer Supply Agreement, effective as of December 8, 2015, by Power Integrations International Ltd. and Seiko Epson Corporation (Filed With SEC on February 5, 2021)
- Amendment Number Five to Wafer Supply Agreement, effective as of November 2, 2015, by Power Integrations International Ltd. and Seiko Epson Corporation (Filed With SEC on February 5, 2021)
- Amendment Number Four to Wafer Supply Agreement, effective as of April 1, 2015, by Power Integrations International Ltd. and Seiko Epson Corporation (Filed With SEC on February 5, 2021)
- Development Addendum to Wafer Supply Agreement, dated September 22, 2013, between Seiko Epson Corporation and Power Integrations International Ltd (Filed With SEC on February 5, 2021)
- Amendment Number Three to Wafer Supply Agreement, effective as of February 1, 2012, by Power Integrations International Ltd. and Seiko Epson Corporation (Filed With SEC on February 5, 2021)
- Amendment Number Ten to Wafer Supply Agreement, effective as of August 26, 2020 by Power Integrations International Ltd. and Seiko Epson Corporation (Filed With SEC on October 29, 2020)
- Amendment Number Nine to Wafer Supply Agreement, effective as of November 1, 2017 by Power Integrations International Ltd. and Seiko Epson Corporation (Filed With SEC on May 7, 2020)
- Amendment Number Eleven to the Amended and Restated Wafer Supply Agreement, between Power Integrations International, Ltd. and Lapis Semiconductor Co., Ltd. (formerly OKI... (Filed With SEC on May 7, 2020)
- Amendment Number Ten to the Amended and Restated Wafer Supply Agreement, between Power Integrations International, Ltd. and Lapis Semiconductor Co., Ltd. (formerly OKI... (Filed With SEC on May 7, 2020)
- ON Semiconductor Corporation Settlement Agreement (Filed With SEC on February 7, 2020)
- Amendment Number Nine to the Amended and Restated Wafer Supply Agreement, between Power Integrations International, Ltd. and Lapis Semiconductor Co., Ltd. (formerly OKI... (Filed With SEC on April 25, 2019)
- Amendment Number Two to the Wafer Supply Agreement, effective as of December 1, 2018, between Power Integrations International, Ltd., and X-FAB Semiconductor Foundries GmbH... (Filed With SEC on February 13, 2019)
- Amendment Number Eight to the Amended and Restated Wafer Supply Agreement between Power Integrations International, Ltd. and OKI Semiconductor Co., Ltd., effective as of July 26,... (Filed With SEC on October 26, 2017)
- AMENDMENT NUMBER EIGHT TO AMENDED AND RESTATED WAFER SUPPLY AGREEMENT (Filed With SEC on February 8, 2017)
- AMENDMENT NUMBER SEVEN TO AMENDED AND RESTATED WAFER SUPPLY AGREEMENT (Filed With SEC on November 1, 2016)
- AMENDMENT NUMBER FIVE TO WAFER SUPPLY AGREEMENT (Filed With SEC on February 11, 2016)
- AMENDMENT NUMBER FOUR TO WAFER SUPPLY AGREEMENT (Filed With SEC on February 11, 2016)
- WAFER SUPPLY AGREEMENT (Filed With SEC on February 10, 2015)
- EXHIBIT 10.2 AMENDMENT NUMBER ONE TO WAFER SUPPLY AGREEMENT (Filed With SEC on May 5, 2014)
- Exhibit 10.2 WAFER SUPPLY AGREEMENT (Filed With SEC on May 8, 2012)
- AMENDMENT NUMBER THREE TO WAFER SUPPLY AGREEMENT (Filed With SEC on May 8, 2012)
- AMENDMENT NUMBER ONE TO WAFER SUPPLY AGREEMENT (Filed With SEC on August 8, 2011)
- WAFER SUPPLY AGREEMENT (Filed With SEC on August 8, 2011)
- AMENDMENT NUMBER TWO TO WAFER SUPPLY AGREEMENT (Filed With SEC on February 25, 2011)
- AMENDMENT NUMBER FIVE TO WAFER SUPPLY AGREEMENT (Filed With SEC on February 26, 2010)
- POWER INTEGRATIONS, INC. 2007 EQUITYINCENTIVE PLAN ADOPTED BY THE BOARD:SEPTEMBER 10, 2007 APPROVED BY THE STOCKHOLDERS:NOVEMBER 7, 2007 AMENDED BY THE BOARD:JANUARY 29, 2008... (Filed With SEC on August 6, 2009)
- AMENDMENT NUMBER ONE TO WAFER SUPPLY AGREEMENT (Filed With SEC on May 6, 2009)
- POWER INTEGRATIONS, INC. 2007 EQUITYINCENTIVE PLAN ADOPTED BY THE BOARD:SEPTEMBER 10, 2007 APPROVED BY THE STOCKHOLDERS:NOVEMBER 7, 2007 AMENDED BY THE BOARD:JANUARY 29, 2008... (Filed With SEC on February 4, 2008)
- AMENDMENT NUMBER ONE TO AMENDED AND RESTATED WAFER SUPPLY AGREEMENT (Filed With SEC on April 18, 2006)
- WAFER SUPPLY AGREEMENT (Filed With SEC on July 26, 2005)
