TTM Technologies, Inc. Business Finance Contracts & Agreements
34 Contracts & Agreements
- Credit Agreements (4 contracts)
- Guarantee Agreements (2)
- Indenture Agreements (4)
- Loan Agreements (5)
- Purchase Agreements (1)
- Registration Rights Agreements (5)
- Security Agreements (2)
- Share Agreements (1)
- Shareholders Agreements (3)
- Stock Agreements (2)
- Underwriting Agreements (2)
- Waiver Agreements (2)
- Warrant Agreements (1)
- Amended & Restated ABL Credit Agreement, dated as of May 30, 2023, by and among TTM Technologies, Inc., as Borrower, the several Lenders from time to time parties thereto,... (Filed With SEC on May 30, 2023)
- Amended & Restated Term Loan Credit Agreement, dated as of May 30, 2023, by and among TTM Technologies, Inc., as Borrower, the several Lenders from time to time parties thereto,... (Filed With SEC on May 30, 2023)
- Share Purchase Agreement, dated as of April 18, 2022, by and among TTM Technologies, Inc., Exphonics, Inc. and Griffon Corporation (Filed With SEC on April 18, 2022)
- Second Supplemental Indenture dated as of March 9, 2021 by and among the Company, the Guarantors named therein, and Wilmington Trust, National Association, as Trustee (Filed With SEC on March 10, 2021)
- Indenture dated as of March 10, 2021, by and among the Company, the Guarantors named therein, and Wilmington Trust, National Association, as Trustee (Filed With SEC on March 10, 2021)
- Equity Interests Purchase Agreement, dated as of January 20, 2020, by and among TTM Technologies, Inc., TTM Technologies China Limited and AKMMeadville Electronics (Xiamen) Co.,... (Filed With SEC on January 22, 2020)
- Payment Guarantee, dated January 21, 2020, issued by Bank of China (Hong Kong) Limited on behalf of the Seller (Filed With SEC on January 22, 2020)
- Payment Guarantee, dated January 21, 2020, issued by DBS Bank Ltd, Hong Kong Branch on behalf of the Seller (Filed With SEC on January 22, 2020)
- Fourth Amendment to Term Loan Credit Agreement, by and among TTM Technologies, Inc., as Borrower, the several Lenders from time to time parties thereto, JPMorgan Chase Bank, N.A.,... (Filed With SEC on April 18, 2018)
- Third Amendment to Term Loan Credit Agreement, by and among TTM Technologies, Inc., as Borrower, the several Lenders from time to time parties thereto, JPMorgan Chase Bank, N.A.,... (Filed With SEC on December 14, 2017)
- Stock Purchase Agreement, dated as of December 1, 2017, by and among Anaren Holdings LLC, Anaren Holding Corp., and TTM Technologies, Inc (Filed With SEC on December 4, 2017)
- Second Amendment to Term Loan Credit Agreement, by and among TTM Technologies, Inc., as Borrower, the several Lenders from time to time parties thereto, JPMorgan Chase Bank, N.A.,... (Filed With SEC on September 29, 2017)
- Indenture dated as of September 28, 2017, by and among the Company, the Guarantors named therein, and Wilmington Trust, National Association, as Indenture Trustee (Filed With SEC on September 29, 2017)
- TTM TECHNOLOGIES, INC. 12,000,000 Shares of Common Stock Underwriting Agreement (Filed With SEC on November 18, 2016)
- SECOND AMENDMENT TO SHAREHOLDERS AGREEMENT (Filed With SEC on January 4, 2016)
- ABL CREDIT AGREEMENT among TTM TECHNOLOGIES, INC. asBorrower, The Several Lenders from Time to Time Parties Hereto, JPMORGAN CHASE BANK, N.A., asAdministrative Agent, BARCLAYS... (Filed With SEC on June 2, 2015)
- TERM LOAN CREDIT AGREEMENT among TTM TECHNOLOGIES, INC. asBorrower, The Several Lenders from Time to Time Parties Hereto, JPMORGAN CHASE BANK, N.A., asAdministrative Agent,... (Filed With SEC on June 2, 2015)
- REGISTRATION RIGHTS AGREEMENT dated as of May 31, 2015 byand among TTM TECHNOLOGIES, INC., HICKS, MUSE, TATE & FURST EQUITY FUND III, L.P. HM3 COINVESTORS, L.P. HMTF EQUITY FUND... (Filed With SEC on June 2, 2015)
- FACILITYAGREEMENT DATED 22 May 2015 US$150,000,000 ASSET BACKED LOANFACILITY FOR TTMTECHNOLOGIES ENTERPRISES (HK) LIMITED as Borrower arranged by THE HONGKONG ANDSHANGHAI BANKING... (Filed With SEC on May 29, 2015)
- ADDENDUM TO Registration Rights Agreement dated as of April 9, 2010 (Filed With SEC on September 22, 2014)
- Registration Rights Agreement Memorandum of Understanding (Filed With SEC on September 22, 2014)
- TTM TECHNOLOGIES, INC. AND AMERICAN STOCKTRANSFER & TRUST COMPANY, LLC, as Trustee INDENTURE Dated as of December20, 2013 1.75% Convertible Senior Notes due 2020 TABLE OF CONTENTS (Filed With SEC on December 20, 2013)
- $220,000,000 TTMTechnologies, Inc. 1.75% Convertible Senior Notes due 2020 Underwriting Agreement (Filed With SEC on December 20, 2013)
- FIRST AMENDMENT TO SHAREHOLDERS AGREEMENT (Filed With SEC on September 19, 2012)
- SPECIAL SECURITY AGREEMENT (Filed With SEC on October 22, 2010)
- WAIVER AND AMENDMENT LETTER To: TTM Hong Kong Limited (the Company) for itself and as agent for each of the other Obligors party tothe Agreement (as defined below) For the... (Filed With SEC on August 5, 2010)
- CREDIT AGREEMENT (Filed With SEC on April 13, 2010)
- SHAREHOLDERS AGREEMENT between TTM TECHNOLOGIES, INC., MEADVILLE HOLDINGS LIMITED, SU SIH (BVI) LIMITED, TANG HSIANG CHIEN, TANG CHUNG YEN, TOM (solely for the purposes of... (Filed With SEC on April 13, 2010)
- REGISTRATION RIGHTS AGREEMENT (Filed With SEC on April 13, 2010)
- SELL-DOWN REGISTRATION RIGHTS AGREEMENT (Filed With SEC on December 23, 2009)
- STOCK PURCHASE AGREEMENT (Filed With SEC on November 16, 2009)
- Trade Date: May 16, 2008 Effective Date: May 20, 2008; provided that the Effective Dateshall not occur and this Confirmation and theAgreement shall become null and void if UBS has... (Filed With SEC on May 22, 2008)
- $25,000,000 SECOND AMENDED AND RESTATED CREDIT AGREEMENT among TTM TECHNOLOGIES, INC., as Borrower, THE DOMESTIC SUBSIDIARIES OF THE BORROWER FROM TIME TO TIME PARTIES HERETO, as... (Filed With SEC on July 21, 2005)
- CONSENT AND WAIVER March 27, 2003 (Filed With SEC on May 15, 2003)
