TTM Technologies, Inc. Business Finance Contracts & Agreements

75 Contracts & Agreements
Browse by Subcategory
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Description of TTM Technologies, Inc. Common Stock Registered Under Section 12 of the Exchange Act
Equity Distribution Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2025
Amended and Restated ABL Credit Agreement among TTM Technologies, Inc. and Lenders, dated May 30, 2023
Credit Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2023
Amended and Restated Term Loan Credit Agreement among TTM Technologies, Inc., Lenders, and JPMorgan Chase Bank, N.A. (May 30, 2023)
Credit Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2023
Second Supplemental Indenture to 5.625% Senior Notes Due 2025 – TTM Technologies, Inc., Subsidiary Guarantors, and Wilmington Trust
Indenture Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2021
Indenture for 4.000% Senior Notes Due 2029 among TTM Technologies, Inc., Guarantors, and Wilmington Trust
Indenture Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
DE
2021
Description of TTM Technologies, Inc. Common Stock Registered Under Section 12 of the Exchange Act
Equity Distribution Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2021
Description of TTM Technologies, Inc. Common Stock Registered Under Section 12 of the Exchange Act
Equity Distribution Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2020
Bank of China (Hong Kong) Payment Guarantee for GME Purchase Price in Favor of TTM Technologies China Limited
Guaranty Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2020
Shanghai Subsidiaries Payment Guarantee by DBS Bank Ltd. (Hong Kong) for TTM Technologies China Limited
Guaranty Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2020
Revolving Credit Facility Agreement for RMB 200 Million between Bank and Meadville Group (Shanghai Meadville Electronics Co., Ltd. and Shanghai Kaiser Electronics Co., Ltd.)
Credit Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2019
Fourth Amendment and Increased Facility Activation Notice to Term Loan Credit Agreement among TTM Technologies, Inc., JPMorgan Chase Bank, N.A., and Lenders
Loan Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2018
Second Amendment to Term Loan Credit Agreement among TTM Technologies, Inc., Lenders, and JPMorgan Chase Bank, N.A.
Credit Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2017
Indenture for 5.625% Senior Notes Due 2025 among TTM Technologies, Inc., Guarantors, and Wilmington Trust
Indenture Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
DE
2017
TTM Technologies, Inc. Underwriting Agreement with J.P. Morgan Securities LLC for 12,000,000 Shares of Common Stock
Underwriting Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2016
First Amendment to Term Loan Credit Agreement among TTM Technologies, Inc., Lenders, and JPMorgan Chase Bank, N.A.
Credit Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2016
Second Amendment to Shareholders Agreement among TTM Technologies, Inc., Tang Hsiang Chien, Su Sih (BVI) Limited, and Tang Family Members
Shareholders Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
DE
2016
ABL Credit Agreement among TTM Technologies, Inc. and Lenders (May 31, 2015)
Credit Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
DE
2015
Term Loan Credit Agreement among TTM Technologies, Inc. and Lenders, with JPMorgan Chase Bank as Administrative Agent (May 31, 2015)
Credit Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
DE
2015
Registration Rights Agreement among TTM Technologies, Inc. and Certain Equity Funds (May 31, 2015)
Registration Rights Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
DE
2015
US$150,000,000 Asset Backed Loan Facility Agreement between TTM Technologies Enterprises (HK) Limited and The Hongkong and Shanghai Banking Corporation Limited, dated May 22, 2015
Facility Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2015
Warrant Confirmation Agreement between TTM Technologies, Inc. and Deutsche Bank AG, London Branch (January 9, 2014)
Warrant Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2014
Warrant Confirmation Agreement between TTM Technologies, Inc. and Royal Bank of Canada (January 9, 2014)
Warrant Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2014
Warrant Confirmation Agreement between TTM Technologies, Inc. and JPMorgan Chase Bank, N.A., London Branch (January 9, 2014)
Warrant Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2014
Warrant Confirmation Agreement between TTM Technologies, Inc. and Deutsche Bank AG, London Branch (December 16, 2013)
Warrant Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2013
Warrant Confirmation Agreement between TTM Technologies, Inc. and Royal Bank of Canada (December 16, 2013)
Warrant Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2013
Warrant Confirmation Agreement between TTM Technologies, Inc. and JPMorgan Chase Bank, N.A., London Branch (December 16, 2013)
Warrant Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2013
Indenture Agreement for 1.75% Convertible Senior Notes due 2020 between TTM Technologies, Inc. and American Stock Transfer & Trust Company, LLC
Indenture Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2013
TTM Technologies, Inc. $220,000,000 1.75% Convertible Senior Notes Due 2020 Underwriting Agreement with J.P. Morgan Securities LLC and RBS Securities Inc.
Underwriting Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2013
First Amendment to Shareholders Agreement among TTM Technologies, Inc. and Tang Family Parties
Shareholders Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
DE
2012
Special Security Agreement among TTM Technologies, Inc., Su Sih (BVI) Limited, Mr. Tang Hsiang Chien, and the U.S. Department of Defense
Security Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
DE
2010
Share Purchase Agreement by and among TTM Technologies, Inc., Exphonics, Inc., and Griffon Corporation (April 18, 2022)
Purchase Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
DE
2022
Equity Interests Purchase Agreement among TTM Technologies, Inc., TTM Technologies China Limited, and AKMMeadville Electronics (Xiamen) Co., Ltd.
Purchase Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2020
Third Amendment to Term Loan Credit Agreement among TTM Technologies, Inc., Lenders, and JPMorgan Chase Bank, N.A.
Modification Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2017
Stock Purchase Agreement among Anaren Holdings LLC, Anaren Holding Corp., and TTM Technologies, Inc. dated December 1, 2017
Purchase Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
NY
2017
First Amendment to Registration Rights Agreement by and among TTM Technologies, Inc., Su Sih (BVI) Limited, and Tang Hsiang Chien
Registration Rights Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
DE
2016
Addendum to Registration Rights Agreement among TTM Technologies, Su Sih (BVI) Limited, and Tang Hsiang Chien
Registration Rights Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
DE
2014
Registration Rights Agreement Memorandum of Understanding among TTM Technologies, Inc., HM Funds, and BD Funds
Registration Rights Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
DE
2014
Equity Awards Amendment Agreement between TTM Technologies, Inc. and Kenton K. Alder
Modification Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2013
Equity Interest Transfer Agreement between TTM Technologies China Limited and Shengyi Technology Co., Ltd. regarding Dongguan Shengyi Electronics Ltd.
Purchase Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2013
Equity Interest Transfer Agreement between Shengyi Technology Co., Ltd. and TTM Technologies China Limited regarding Dongguan Meadville Circuits Limited
Purchase Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2013