Underwriting Agreements in the Semiconductors & Semiconductor Equipment Industry

227 Contracts & Agreements
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Ex-1.1 - Underwriting Agreement, dated June 25, 2009
Underwriting Agreements
Analog Devices, Inc.
Semiconductors & Semiconductor Equipment
NY
2009
Underwriting Agreement, dated June 6, 2024, by and among Applied Materials, Inc. and BofA Securities, Inc. and J.P. Morgan Securities LLC, as representatives of the several...
Underwriting Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2024
Underwriting Agreement, dated April 1, 2024, between Analog Devices and BofA Securities, Inc., as representative of the several underwriters named therein
Underwriting Agreements
Analog Devices, Inc.
Semiconductors & Semiconductor Equipment
NY
2024
Underwriting Agreement, dated March 13, 2024, among Ichor Holdings, Ltd. and Cowen and Company, LLC and Stifel, Nicolaus & Company, Incorporated, as the representatives for the...
Underwriting Agreements
ICHOR HOLDINGS, LTD.
Semiconductors & Semiconductor Equipment
NY
2024
Underwriting Agreement, dated March 5, 2024, among Microchip Technology Incorporated, the subsidiary guarantors named therein and J.P. Morgan Securities LLC, BNP Paribas...
Underwriting Agreements
Microchip Technology
Semiconductors & Semiconductor Equipment
NY
2024
Underwriting Agreement, dated as of February 15, 2024, among Intel Corporation and BofA Securities, Inc., Citigroup Global Markets Inc., Goldman Sachs & Co. LLC, J.P. Morgan...
Underwriting Agreements
Intel
Semiconductors & Semiconductor Equipment
NY
2024
Underwriting Agreement, dated February 6, 2024, by and between the Company and Ladenburg Thalmann & Co. Inc
Underwriting Agreements
MoSys, Inc.
Semiconductors & Semiconductor Equipment
NY
2024
Underwriting Agreement dated February 5, 2024 among Texas Instruments Incorporated and BofA Securities, Inc., Citigroup Global Markets Inc. and Mizuho Securities USA LLC
Underwriting Agreements
Texas Instruments
Semiconductors & Semiconductor Equipment
NY
2024
Form of Underwriting Agreement
Underwriting Agreements
MoSys, Inc.
Semiconductors & Semiconductor Equipment
NY
2024
Underwriting Agreement, dated as of January 30, 2024, among the Company and Citigroup Global Markets Inc., BofA Securities, Inc. and J.P. Morgan Securities LLC, as representatives...
Underwriting Agreements
KLA Corporation
Semiconductors & Semiconductor Equipment
NY
2024
Form of Underwriting Agreement
Underwriting Agreements
MoSys, Inc.
Semiconductors & Semiconductor Equipment
NY
2024
Underwriting Agreement, dated as of December 5, 2023, by and among Credo Technology Group Holding Ltd, Goldman Sachs & Co. LLC, as representative of the several underwriters named...
Underwriting Agreements
Credo Technology Group Holding Ltd
Semiconductors & Semiconductor Equipment
NY
2023
Underwriting Agreement, dated September 11, 2023, among Marvell Technology, Inc. and J.P. Morgan Securities LLC, BofA Securities, Inc. and Wells Fargo Securities, LLC, as...
Underwriting Agreements
Marvell Technology, Inc.
Semiconductors & Semiconductor Equipment
NY
2023
Underwriting Agreement, dated as of September 6, 2023, by and among Amkor Technology, Inc., 915 Investments, LP, and J.P. Morgan Securities LLC and Morgan Stanley & Co. LLC, as...
Underwriting Agreements
AMKOR TECHNOLOGY, INC.
Semiconductors & Semiconductor Equipment
NY
2023
Underwriting Agreement, dated June 1, 2023, by and among MKS Instruments, Inc., J.P. Morgan Securities LLC, as underwriter, and the selling stockholders named therein
Underwriting Agreements
MKS Instruments
Semiconductors & Semiconductor Equipment
WA
2023
Underwriting Agreement, dated as of May 23, 2023, by and among Navitas Semiconductor Corporation, Morgan Stanley & Co. LLC and Jefferies LLC
Underwriting Agreements
Live Oak Acquisition Corp II
Semiconductors & Semiconductor Equipment
CA
2023
Underwriting Agreement dated May 11, 2023 among Texas Instruments Incorporated and J.P. Morgan Securities LLC, Morgan Stanley & Co. LLC and U.S. Bancorp Investments, Inc
Underwriting Agreements
Texas Instruments
Semiconductors & Semiconductor Equipment
NY
2023
Underwriting Agreement, dated as of April 14, 2023, by and among the Company, Ladenburg Thalmann & Co. Inc. and A.G.P./Alliance Global Partners
Underwriting Agreements
TORCHLIGHT ENERGY RESOURCES INC
Semiconductors & Semiconductor Equipment
2023
Underwriting Agreement dated March 7, 2023 among Texas Instruments Incorporated and Barclays Capital Inc., BofA Securities, Inc. and MUFG Securities Americas Inc
Underwriting Agreements
Texas Instruments
Semiconductors & Semiconductor Equipment
NY
2023
Underwriting Agreement, dated as of February 7, 2023, among Intel Corporation and BofA Securities, Inc., Citigroup Global Markets Inc., J.P. Morgan Securities LLC and Morgan...
Underwriting Agreements
Intel
Semiconductors & Semiconductor Equipment
NY
2023
Underwriting Agreement, dated January 24, 2023, by and between Kopin Corporation and Stifel, Nicolaus & Company, Incorporated, as representative of the underwriters named therein
Underwriting Agreements
Kopin Corporation
Semiconductors & Semiconductor Equipment
NY
2023
Underwriting Agreement dated November 15, 2022 among Texas Instruments Incorporated and J.P. Morgan Securities LLC, Mizuho Securities USA LLC and Morgan Stanley & Co. LLC
Underwriting Agreements
Texas Instruments
Semiconductors & Semiconductor Equipment
NY
2022
Underwriting Agreement, dated November 14, 2022, by and between the Company and Needham & Company, LLC
Underwriting Agreements
CMI Acquisition, LLC
Semiconductors & Semiconductor Equipment
2022
Underwriting Agreement, dated November 7, 2022, among QUALCOMM Incorporated, Barclays Capital Inc., BofA Securities, Inc., Goldman Sachs & Co. LLC and J.P. Morgan Securities LLC
Underwriting Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Underwriting Agreement, dated September 8, 2022, between Analog Devices and SMBC Nikko Securities America, Inc., as the representative of the several underwriters named therein
Underwriting Agreements
Analog Devices, Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Underwriting Agreement dated August 10, 2022 among Texas Instruments Incorporated and BofA Securities, Inc., Citigroup Global Markets Inc. and U.S. Bancorp Investments, Inc
Underwriting Agreements
Texas Instruments
Semiconductors & Semiconductor Equipment
NY
2022
Underwriting Agreement, dated as of August 2, 2022, among Intel Corporation and J.P. Morgan Securities LLC, BNP Paribas Securities Corp., BofA Securities, Inc. and Goldman Sachs &...
Underwriting Agreements
Intel
Semiconductors & Semiconductor Equipment
NY
2022
Underwriting Agreement, dated June 21, 2022, among the Company and BofA Securities, Inc., Citigroup Global Markets Inc. and J.P. Morgan Securities LLC, as representatives of the...
Underwriting Agreements
KLA Corporation
Semiconductors & Semiconductor Equipment
NY
2022
Underwriting Agreement, dated as of June 7, 2022, by and among Advanced Micro Devices, Inc. and Barclays Capital Inc., BofA Securities, Inc., Credit Suisse Securities (USA) LLC,...
Underwriting Agreements
Advanced Micro Devices Inc
Semiconductors & Semiconductor Equipment
NY
2022
Underwriting Agreement, dated as of May 12, 2022, among the Issuers, the Company and Citigroup Global Markets Inc., Deutsche Bank Securities Inc. and Goldman Sachs & Co. LLC, as...
Underwriting Agreements
NXP Semiconductors N.V.
Semiconductors & Semiconductor Equipment
NY
2022
Underwriting Agreement, dated May 5, 2022, among QUALCOMM Incorporated, BofA Securities, Inc., Citigroup Global Markets Inc., Goldman Sachs & Co. LLC and J.P. Morgan Securities LLC
Underwriting Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Underwriting Agreement dated March 17, 2022 between SolarEdge Technologies, Inc., Goldman Sachs & Co. LLC, J.P. Morgan Securities LLC and Morgan Stanley & Co. LLC
Underwriting Agreements
SolarEdge Technologies, Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Form of Underwriting Agreement
Underwriting Agreements
Ascent Solar Technologies, Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Form of Underwriting Agreement
Underwriting Agreements
Credo Technology Group Holding Ltd
Semiconductors & Semiconductor Equipment
NY
2022
Form of Underwriting Agreement
Underwriting Agreements
Credo Technology Group Holding Ltd
Semiconductors & Semiconductor Equipment
NY
2022
Underwriting Agreement, dated November 9, 2021, by and among the Company, MegaChips Corporation, as the selling stockholder, Barclays Capital Inc., Credit Suisse Securities (USA)...
Underwriting Agreements
SITIME Corp
Semiconductors & Semiconductor Equipment
NY
2021
Underwriting Agreement, dated as of November 1, 2021, by and among the Company, the Underwriter and the Selling Stockholder
Underwriting Agreements
ALLEGRO MICROSYSTEMS INC
Semiconductors & Semiconductor Equipment
NY
2021
Underwriting Agreement, dated October 18, 2021, by and among Micron Technology, Inc., Barclays Capital Inc., Credit Agricole Securities (USA) Inc., Mizuho Securities USA LLC,...
Underwriting Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2021
Underwriting Agreement, dated September 28, 2021
Underwriting Agreements
Analog Devices, Inc.
Semiconductors & Semiconductor Equipment
NY
2021
Underwriting Agreement dated September 7, 2021 among Barclays Capital Inc., J.P. Morgan Securities LLC and MUFG Securities Americas Inc., as representatives of the several...
Underwriting Agreements
Texas Instruments
Semiconductors & Semiconductor Equipment
NY
2021
Underwriting Agreement, dated as of August 10, 2021, among Intel Corporation and BofA Securities, Inc., Citigroup Global Markets Inc., Goldman Sachs & Co. LLC and J.P. Morgan...
Underwriting Agreements
Intel
Semiconductors & Semiconductor Equipment
NY
2021