Underwriting Agreements in the Semiconductors & Semiconductor Equipment Industry
225 Contracts & Agreements
- ACM Research, Inc. (3 contracts)
- ADESTO TECHNOLOGIES Corp (3)
- Advanced Energy (1)
- Advanced Micro Devices Inc (3)
- AEHR TEST SYSTEMS (1)
- ALLEGRO MICROSYSTEMS INC (3)
- AMBARELLA INC (2)
- AMKOR TECHNOLOGY, INC. (3)
- AMTECH SYSTEMS INC (3)
- Analog Devices, Inc. (8)
- Applied Materials Inc. (4)
- Ascent Solar Technologies, Inc. (4)
- Atomera Inc (4)
- AXT INC (1)
- Broadcom Inc. (1)
- CMI Acquisition, LLC (2)
- Cohu, Inc. (1)
- Credo Technology Group Holding Ltd (3)
- CVD EQUIPMENT CORP (1)
- Diodes Incorporated (1)
- EMAGIN CORP (2)
- Enphase Energy, Inc. (5)
- ENTEGRIS INC (1)
- EVERSPIN TECHNOLOGIES INC (2)
- First Solar (4)
- GSI TECHNOLOGY INC (1)
- ICHOR HOLDINGS, LTD. (4)
- IMPINJ INC (2)
- INPHI Corp (3)
- Intel (14)
- KLA Corporation (5)
- Kopin Corporation (2)
- Lam Research (4)
- Live Oak Acquisition Corp II (3)
- MACOM Technology Solutions Holdings, Inc. (2)
- MAGNACHIP SEMICONDUCTOR Corp (5)
- MARVELL TECHNOLOGY GROUP LTD (1)
- Marvell Technology, Inc. (1)
- Maxim Integrated Products Inc (3)
- MaxLinear, Inc. (1)
- Microchip Technology (1)
- Micron Technology (7)
- MKS Instruments (1)
- MoSys, Inc. (5)
- NEOPHOTONICS CORP (2)
- Nvidia Corporation (3)
- NXP Semiconductors N.V. (1)
- ON SEMICONDUCTOR CORP (3)
- Photronics, Inc. (2)
- PIXELWORKS, INC (4)
- QUALCOMM Inc. (5)
- QUICKLOGIC CORPORATION (7)
- Rubicon Technology, Inc. (4)
- SemiLEDs Corp (2)
- SITIME Corp (4)
- Skyworks Solutions (1)
- SMART Global Holdings, Inc. (4)
- SolarEdge Technologies, Inc. (2)
- STR HOLDINGS, INC. (2)
- Summit Wireless Technologies, Inc. (6)
- SUNPOWER CORP (8)
- Texas Instruments (20)
- TORCHLIGHT ENERGY RESOURCES INC (5)
- Ultra Clean Holdings, Inc. (2)
- UNIVERSAL DISPLAY CORP (2)
- Veeco Instruments Inc. (2)
- Xilinx (3)
- Underwriting Agreement, dated March 13, 2024, among Ichor Holdings, Ltd. and Cowen and Company, LLC and Stifel, Nicolaus & Company, Incorporated, as the representatives for the... (ICHOR HOLDINGS, LTD., Filed With SEC on March 18, 2024)
- Underwriting Agreement, dated March 5, 2024, among Microchip Technology Incorporated, the subsidiary guarantors named therein and J.P. Morgan Securities LLC, BNP Paribas... (Microchip Technology, Filed With SEC on March 7, 2024)
- Underwriting Agreement, dated as of February 15, 2024, among Intel Corporation and BofA Securities, Inc., Citigroup Global Markets Inc., Goldman Sachs & Co. LLC, J.P. Morgan... (Intel, Filed With SEC on February 21, 2024)
- Underwriting Agreement, dated February 6, 2024, by and between the Company and Ladenburg Thalmann & Co. Inc (MoSys, Inc., Filed With SEC on February 9, 2024)
- Underwriting Agreement dated February 5, 2024 among Texas Instruments Incorporated and BofA Securities, Inc., Citigroup Global Markets Inc. and Mizuho Securities USA LLC (Texas Instruments, Filed With SEC on February 8, 2024)
- Form of Underwriting Agreement (MoSys, Inc., Filed With SEC on February 5, 2024)
- Underwriting Agreement, dated as of January 30, 2024, among the Company and Citigroup Global Markets Inc., BofA Securities, Inc. and J.P. Morgan Securities LLC, as representatives... (KLA Corporation, Filed With SEC on February 1, 2024)
- Form of Underwriting Agreement (MoSys, Inc., Filed With SEC on January 23, 2024)
- Underwriting Agreement, dated as of December 5, 2023, by and among Credo Technology Group Holding Ltd, Goldman Sachs & Co. LLC, as representative of the several underwriters named... (Credo Technology Group Holding Ltd, Filed With SEC on December 6, 2023)
- Underwriting Agreement, dated September 11, 2023, among Marvell Technology, Inc. and J.P. Morgan Securities LLC, BofA Securities, Inc. and Wells Fargo Securities, LLC, as... (Marvell Technology, Inc., Filed With SEC on September 18, 2023)
- Underwriting Agreement, dated as of September 6, 2023, by and among Amkor Technology, Inc., 915 Investments, LP, and J.P. Morgan Securities LLC and Morgan Stanley & Co. LLC, as... (AMKOR TECHNOLOGY, INC., Filed With SEC on September 7, 2023)
- Underwriting Agreement, dated June 1, 2023, by and among MKS Instruments, Inc., J.P. Morgan Securities LLC, as underwriter, and the selling stockholders named therein (MKS Instruments, Filed With SEC on June 5, 2023)
- Underwriting Agreement, dated as of May 23, 2023, by and among Navitas Semiconductor Corporation, Morgan Stanley & Co. LLC and Jefferies LLC (Live Oak Acquisition Corp II, Filed With SEC on May 26, 2023)
- Underwriting Agreement dated May 11, 2023 among Texas Instruments Incorporated and J.P. Morgan Securities LLC, Morgan Stanley & Co. LLC and U.S. Bancorp Investments, Inc (Texas Instruments, Filed With SEC on May 18, 2023)
- Underwriting Agreement, dated as of April 14, 2023, by and among the Company, Ladenburg Thalmann & Co. Inc. and A.G.P./Alliance Global Partners (TORCHLIGHT ENERGY RESOURCES INC, Filed With SEC on April 14, 2023)
- Underwriting Agreement dated March 7, 2023 among Texas Instruments Incorporated and Barclays Capital Inc., BofA Securities, Inc. and MUFG Securities Americas Inc (Texas Instruments, Filed With SEC on March 14, 2023)
- Underwriting Agreement, dated as of February 7, 2023, among Intel Corporation and BofA Securities, Inc., Citigroup Global Markets Inc., J.P. Morgan Securities LLC and Morgan... (Intel, Filed With SEC on February 10, 2023)
- Underwriting Agreement, dated January 24, 2023, by and between Kopin Corporation and Stifel, Nicolaus & Company, Incorporated, as representative of the underwriters named therein (Kopin Corporation, Filed With SEC on January 26, 2023)
- Underwriting Agreement dated November 15, 2022 among Texas Instruments Incorporated and J.P. Morgan Securities LLC, Mizuho Securities USA LLC and Morgan Stanley & Co. LLC (Texas Instruments, Filed With SEC on November 18, 2022)
- Underwriting Agreement, dated November 14, 2022, by and between the Company and Needham & Company, LLC (CMI Acquisition, LLC, Filed With SEC on November 15, 2022)
- Underwriting Agreement, dated November 7, 2022, among QUALCOMM Incorporated, Barclays Capital Inc., BofA Securities, Inc., Goldman Sachs & Co. LLC and J.P. Morgan Securities LLC (QUALCOMM Inc., Filed With SEC on November 9, 2022)
- Underwriting Agreement, dated September 8, 2022, between Analog Devices and SMBC Nikko Securities America, Inc., as the representative of the several underwriters named therein (Analog Devices, Inc., Filed With SEC on September 15, 2022)
- Underwriting Agreement dated August 10, 2022 among Texas Instruments Incorporated and BofA Securities, Inc., Citigroup Global Markets Inc. and U.S. Bancorp Investments, Inc (Texas Instruments, Filed With SEC on August 16, 2022)
- Underwriting Agreement, dated as of August 2, 2022, among Intel Corporation and J.P. Morgan Securities LLC, BNP Paribas Securities Corp., BofA Securities, Inc. and Goldman Sachs &... (Intel, Filed With SEC on August 5, 2022)
- Underwriting Agreement, dated June 21, 2022, among the Company and BofA Securities, Inc., Citigroup Global Markets Inc. and J.P. Morgan Securities LLC, as representatives of the... (KLA Corporation, Filed With SEC on June 22, 2022)
- Underwriting Agreement, dated as of June 7, 2022, by and among Advanced Micro Devices, Inc. and Barclays Capital Inc., BofA Securities, Inc., Credit Suisse Securities (USA) LLC,... (Advanced Micro Devices Inc, Filed With SEC on June 8, 2022)
- Underwriting Agreement, dated as of May 12, 2022, among the Issuers, the Company and Citigroup Global Markets Inc., Deutsche Bank Securities Inc. and Goldman Sachs & Co. LLC, as... (NXP Semiconductors N.V., Filed With SEC on May 16, 2022)
- Underwriting Agreement, dated May 5, 2022, among QUALCOMM Incorporated, BofA Securities, Inc., Citigroup Global Markets Inc., Goldman Sachs & Co. LLC and J.P. Morgan Securities LLC (QUALCOMM Inc., Filed With SEC on May 9, 2022)
- Underwriting Agreement dated March 17, 2022 between SolarEdge Technologies, Inc., Goldman Sachs & Co. LLC, J.P. Morgan Securities LLC and Morgan Stanley & Co. LLC (SolarEdge Technologies, Inc., Filed With SEC on March 22, 2022)
- Form of Underwriting Agreement (Ascent Solar Technologies, Inc., Filed With SEC on March 15, 2022)
- Form of Underwriting Agreement (Credo Technology Group Holding Ltd, Filed With SEC on January 18, 2022)
- Form of Underwriting Agreement (Credo Technology Group Holding Ltd, Filed With SEC on January 3, 2022)
- Underwriting Agreement, dated November 9, 2021, by and among the Company, MegaChips Corporation, as the selling stockholder, Barclays Capital Inc., Credit Suisse Securities (USA)... (SITIME Corp, Filed With SEC on November 10, 2021)
- Underwriting Agreement, dated as of November 1, 2021, by and among the Company, the Underwriter and the Selling Stockholder (ALLEGRO MICROSYSTEMS INC, Filed With SEC on November 3, 2021)
- Underwriting Agreement, dated October 18, 2021, by and among Micron Technology, Inc., Barclays Capital Inc., Credit Agricole Securities (USA) Inc., Mizuho Securities USA LLC,... (Micron Technology, Filed With SEC on October 19, 2021)
- Underwriting Agreement, dated September 28, 2021 (Analog Devices, Inc., Filed With SEC on September 29, 2021)
- Underwriting Agreement dated September 7, 2021 among Barclays Capital Inc., J.P. Morgan Securities LLC and MUFG Securities Americas Inc., as representatives of the several... (Texas Instruments, Filed With SEC on September 15, 2021)
- Underwriting Agreement, dated as of August 10, 2021, among Intel Corporation and BofA Securities, Inc., Citigroup Global Markets Inc., Goldman Sachs & Co. LLC and J.P. Morgan... (Intel, Filed With SEC on August 12, 2021)
- Underwriting Agreement, dated as of July 8, 2021, by and among SMART Global Holdings, Inc., the Selling Stockholders and Morgan Stanley & Co. LLC, as the underwriter named therein (SMART Global Holdings, Inc., Filed With SEC on July 13, 2021)
- Underwriting Agreement, dated as of June 14, 2021, by and among the Company and Morgan Stanley & Co. LLC , as representative of the several underwriters (Nvidia Corporation, Filed With SEC on June 16, 2021)
