Semiconductors & Semiconductor Equipment Industry Security Agreements

Security Agreement, dated as of June 22, 2023, among ON Semiconductor Corporation and the other signatories thereto in favor of JPMorgan Chase Bank, N.A., as administrative agent (ON SEMICONDUCTOR CORP, Filed With SEC on June 26, 2023)

SECURITY AGREEMENT (Sandy Springs Holdings, Inc., Filed With SEC on October 19, 2022)

Form of Security Agreement by and between the Company and the Investor (Summit Wireless Technologies, Inc., Filed With SEC on August 19, 2022)

Form of Security Agreement by and between WiSA and the Investor (Summit Wireless Technologies, Inc., Filed With SEC on August 19, 2022)

Form of Trademark Security Agreement by and between the Company and the Investor (Summit Wireless Technologies, Inc., Filed With SEC on August 19, 2022)

Form of Trademark Security Agreement by and between WiSA and the Investor (Summit Wireless Technologies, Inc., Filed With SEC on August 19, 2022)

Form of Patent Security Agreement between the Company and the Investor (Summit Wireless Technologies, Inc., Filed With SEC on August 19, 2022)

Exhibit 10.4 Security Agreement dated May 5, 2022 between NovAccess Global Inc. and AJB Capital Investments, LLC (XSUNX INC, Filed With SEC on May 10, 2022)

Security Agreement dated February 15, 2022 between NovAccess Global Inc. and AJB Capital Investments, LLC (XSUNX INC, Filed With SEC on February 18, 2022)

General Security Agreement, dated December 30, 2021, among inTEST Corporation, Acculogic Inc. and M&T Bank (INTEST CORP, Filed With SEC on January 6, 2022)

Second Amended and Restated Patents, Trademarks, Copyrights and Licenses Security Agreement, dated December 30, 2021, among inTEST Corporation, Ambrell Corporation, inTEST Silicon... (INTEST CORP, Filed With SEC on January 6, 2022)

Amended and Restated Patents, Trademarks, Copyrights and Licenses Security Agreement, dated October 28, 2021, among inTEST Corporation, Ambrell Corporation, inTEST Silicon Valley... (INTEST CORP, Filed With SEC on November 2, 2021)

Exhibit 10.4 Security Agreement dated August 20, 2021 between NovAccess Global Inc. and AJB Capital Investments, LLC (XSUNX INC, Filed With SEC on August 25, 2021)

Pledge and Security Agreement, dated as of May 28, 2021, by and among Microchip Technology Incorporated, the subsidiary guarantors named therein and Wells Fargo Bank, National... (Microchip Technology, Filed With SEC on May 28, 2021)

Pledge and Security Agreement, dated as of December 17, 2020, by and among Microchip Technology Incorporated, the subsidiary guarantors named therein and Wells Fargo Bank,... (Microchip Technology, Filed With SEC on December 18, 2020)

Pledge and Security Agreement, dated as of May 29, 2020, by and among Microchip Technology Incorporated, the subsidiary guarantors named therein and Wells Fargo Bank, National... (Microchip Technology, Filed With SEC on June 3, 2020)

Security Agreement, dated as of June 1, 2020, among Xperi Holding, the other pledgors party thereto and Bank of America, N.A., as collateral agent (Xperi Corporation, Filed With SEC on June 1, 2020)

Patents, Trademarks, Copyrights and Licenses Security Agreement, dated April 10, 2020, by inTEST Corporation, Ambrell Corporation, inTEST Silicon Valley Corporation, inTEST EMS,... (INTEST CORP, Filed With SEC on April 15, 2020)

Pledge and Security Agreement, dated as of March 27, 2020, by and among Microchip Technology Incorporated, the other grantors from time to time party thereto and JPMorgan Chase... (Microchip Technology, Filed With SEC on March 27, 2020)

Form of Patent Security Agreement between the Company and the Investor (Summit Wireless Technologies, Inc., Filed With SEC on March 26, 2020)

Form of Trademark Security Agreement by and between WiSA and the Investor (Summit Wireless Technologies, Inc., Filed With SEC on March 26, 2020)

Form of Trademark Security Agreement by and between the Company and the Investor (Summit Wireless Technologies, Inc., Filed With SEC on March 26, 2020)

Form of Security Agreement by and between WiSA and the Investor (Summit Wireless Technologies, Inc., Filed With SEC on March 26, 2020)

Form of Security Agreement by and between the Company and the Investor (Summit Wireless Technologies, Inc., Filed With SEC on March 26, 2020)

Third Amended and Restated Security Agreement entered into as of September 27, 2018 by and among Photronics, Inc., the subsidiaries of the Company and JPMorgan Chase Bank N.A (Photronics, Inc., Filed With SEC on December 21, 2018)

Form of Security Agreement Joinder between Summit Semiconductor, LLC and MARCorp Signal, LLC (Summit Wireless Technologies, Inc., Filed With SEC on July 2, 2018)

Security Agreement, dated as of May 29, 2018, by and among Microchip Technology Incorporated, the subsidiary guarantors name therein and Wells Fargo Bank, N.A., as collateral agent (Microchip Technology, Filed With SEC on May 30, 2018)

Security Agreement dated November 30, 2017 (Ascent Solar Technologies, Inc., Filed With SEC on March 29, 2018)

FIRST AMENDMENT TO SECURITY AGREEMENTS (Enphase Energy, Inc., Filed With SEC on August 9, 2017)

FORM OF SECURITY AND PLEDGE AGREEMENT (Advanced Energy, Filed With SEC on July 31, 2017)

SECURITY AGREEMENT by MAXLINEAR, INC. as Borrower and THE GUARANTORS PARTY HERETO in favor of JPMORGAN CHASEBANK, N.A., as Collateral Agent Dated as ofMay 12, 2017 TABLE OF... (MaxLinear, Inc., Filed With SEC on May 12, 2017)

SECURITY AGREEMENT (Enphase Energy, Inc., Filed With SEC on March 16, 2017)

PLEDGE AND SECURITY AGREEMENT (Microchip Technology, Filed With SEC on February 8, 2017)

SECURITY AGREEMENT by TESSERA HOLDING CORPORATION asBorrower and THE GUARANTORSPARTY HERETO in favor of ROYAL BANK OF CANADA, asCollateral Agent Dated as of December 1, 2016 TABLE... (Xperi Corporation, Filed With SEC on December 1, 2016)

SECURITY AGREEMENT (Ascent Solar Technologies, Inc., Filed With SEC on August 15, 2016)

SECURITY AGREEMENT (Atomera Inc, Filed With SEC on June 30, 2016)

FIRST AMENDMENTTO SECURITY AGREEMENT (SUNPOWER CORP, Filed With SEC on May 6, 2016)

SECURITY AGREEMENT made by MICRON TECHNOLOGY, INC. and certain of its Subsidiaries in favor of U.S. BANK NATIONAL ASSOCIATION, as Collateral Agent Dated as of April 26, 2016 (Micron Technology, Filed With SEC on April 26, 2016)

MOSYS, INC. SECURITY AGREEMENT (MoSys, Inc., Filed With SEC on March 15, 2016)

SECURITY AGREEMENT (Ascent Solar Technologies, Inc., Filed With SEC on September 8, 2015)

Security Agreements in the Semiconductors & Semiconductor Equipment Industry