Pledge Agreements in the Electronic Equipment, Instruments & Components Industry

62 Contracts & Agreements
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Digital Asset Account Control Agreement among Soluna MC Borrowing 2021-1 LLC, NYDIG ABL LLC, and NYDIG Trust Company LLC
Pledge Agreements
MECHANICAL TECHNOLOGY INC
Electronic Equipment, Instruments & Components
NY
2022
Securities Pledge Agreement between James Walesa and Allied Integral United, Inc. dated January 19, 2021
Pledge Agreements
SUPERCONDUCTOR TECHNOLOGIES INC
Electronic Equipment, Instruments & Components
TX
2021
Pledge and Security Agreement between Clancy Systems International Inc. and ARKE TECH S.A.P.I DE C.V. dated March 12, 2020
Pledge Agreements
CLANCY SYSTEMS INTERNATIONAL INC
Electronic Equipment, Instruments & Components
DE
2020
Pledge and Security Agreement between Clancy Systems International Inc. and ARKE TECH S.A.P.I DE C.V. dated March 12, 2020
Pledge Agreements
CLANCY SYSTEMS INTERNATIONAL INC
Electronic Equipment, Instruments & Components
DE
2020
Collateral Contract Between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Maximum Pledge Guaranty Contract between Guangdong Huaxing Bank Co., Ltd. Huizhou Branch and Huizhou Highpower Technology Co. Ltd.
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Pledge and Security Agreement among Akoustis Technologies, Inc., Subsidiaries, and The Bank of New York Mellon Trust Company, N.A.
Pledge Agreements
Akoustis Technologies, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Pledge Guaranty Contract between Guangdong Huaxing Bank Co., Ltd. Huizhou Branch and Huizhou Highpower Technology Co. Ltd.
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Collateral Pledge Agreement between Ganzhou Highpower Technology Co., Ltd and Bank of China, Buji Sub-branch
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Collateral Agreement between Shenzhen Highpower Technology Co., Ltd and Bank of China, Buji Sub-branch
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Collateral Agreement between Shenzhen Highpower Technology and Bank of China (2015)
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Collateral Pledge Agreement between Shenzhen Highpower Technology and Bank of China (2015)
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Collateral Pledge Agreement between Ganzhou Highpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Pledge and Security Agreement between Acorn Energy, Inc. and Square 1 Bank dated April 23, 2015
Pledge Agreements
ACORN ENERGY, INC.
Electronic Equipment, Instruments & Components
2015
Pledge Agreement between Industrial Bank Shenzhen Longgang Branch and Shupeng Technology (Shenzhen) Co., Ltd.
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Pledge and Security Agreement between PAR Technology Corporation and Affiliates and JPMorgan Chase Bank, N.A. (September 9, 2014)
Pledge Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
NY
2014
Cash Collateral Agreement between M-Tron Industries, Inc. and City National Bank of Florida (2014)
Pledge Agreements
LGL GROUP INC
Electronic Equipment, Instruments & Components
FL
2014
Amended and Restated Pledge and Security Agreement among Digital Ally, Inc., Subsidiaries, and Hudson Bay Master Fund Ltd.
Pledge Agreements
DIGITAL ALLY INC
Electronic Equipment, Instruments & Components
2014
Pledge and Security Agreement between Digital Ally, Inc., Digital Ally International, Inc., and Hudson Bay Master Fund Ltd.
Pledge Agreements
DIGITAL ALLY INC
Electronic Equipment, Instruments & Components
2014
Continuing Pledge Agreement between Frequency Electronics, Inc. and JPMorgan Chase Bank, N.A. dated June 6, 2013
Pledge Agreements
FREQUENCY ELECTRONICS INC
Electronic Equipment, Instruments & Components
2013
Commercial Pledge Agreement between Wayside Technology Group, Inc. and Citibank, N.A. dated January 4, 2013
Pledge Agreements
Wayside Technology Group, Inc.
Electronic Equipment, Instruments & Components
NY
2013
Reaffirmation of Negative Pledge Agreement among Napco Group Entities and HSBC Bank USA
Pledge Agreements
NAPCO SECURITY TECHNOLOGIES, INC
Electronic Equipment, Instruments & Components
2012
Company Pledge and Security Agreement between Lapis Technologies Inc. and UTA Capital LLC (September 1, 2011)
Pledge Agreements
MICT, Inc.
Electronic Equipment, Instruments & Components
NY
2011
Amendment No. 1 to Pledge and Security Agreement among Par Technology Corporation, Affiliates, and JPMorgan Chase Bank, N.A.
Pledge Agreements
PAR TECHNOLOGY CORP
Electronic Equipment, Instruments & Components
2011
Pledge and Security Agreement between Rogers Corporation, Subsidiaries, and JPMorgan Chase Bank, N.A.
Pledge Agreements
Rogers Corporation
Electronic Equipment, Instruments & Components
NY
2011
Amended and Restated Pledge Agreement among NAPCO Security Technologies, Inc., Subsidiaries, and HSBC Bank USA as Collateral Agent
Pledge Agreements
NAPCO SECURITY TECHNOLOGIES, INC
Electronic Equipment, Instruments & Components
NY
2010
Negative Pledge Agreement among Napco Security Technologies, Inc. Subsidiaries and Affiliates (October 28, 2010)
Pledge Agreements
NAPCO SECURITY TECHNOLOGIES, INC
Electronic Equipment, Instruments & Components
2010
Stock Pledge Agreement among Visualant, Inc., James M. Gingo, and Brownstein, Rask, Sweeney, Kerr, Grim, DeSylvia & Hay, LLP dated June 8, 2010
Pledge Agreements
KNOW LABS, INC.
Electronic Equipment, Instruments & Components
OR
2010
First Lien Pledge and Security Agreement between Global Monitoring Systems, Inc. and American Capital Financial Services, Inc. (January 1, 2006)
Pledge Agreements
GS Acquisition Holdings Corp II
Electronic Equipment, Instruments & Components
MD
2009
Amended and Restated Securities Pledge Agreement between Rogers Corporation and RBS Citizens, National Association
Pledge Agreements
Rogers Corporation
Electronic Equipment, Instruments & Components
MA
2009
Pledge and Security Agreement between KEMET Electronics Corporation and Vishay Intertechnology, Inc. dated September 15, 2008
Pledge Agreements
KEMET Corporation
Electronic Equipment, Instruments & Components
NY
2008
Second Ranking Share Pledge Agreement between Induflex Holding and Rogers Corporation regarding Rogers Induflex NV Shares
Pledge Agreements
Rogers Corporation
Electronic Equipment, Instruments & Components
2008
Pledge and Security Agreement between KEMET Electronics Corporation and Vishay Intertechnology, Inc. dated September 15, 2008
Pledge Agreements
Vishay Intertechnology Inc
Electronic Equipment, Instruments & Components
NY
2008
Securities Pledge Agreement between Rogers Corporation and RBS Citizens, National Association (June 17, 2008)
Pledge Agreements
Rogers Corporation
Electronic Equipment, Instruments & Components
2008
Amendment No. 4 to Stockholder Pledge and Security Agreement by Wirelesstoys Sweden AB and AIGH Investment Partners, LLC
Pledge Agreements
Neonode Inc.
Electronic Equipment, Instruments & Components
2008
Amendment No. 2 to Stockholder Pledge and Security Agreement among [Pledgor], AIGH Investment Partners, LLC, and Investors
Pledge Agreements
Neonode Inc.
Electronic Equipment, Instruments & Components
2008
Amendment No. 1 to Stockholder Pledge and Security Agreement among Rector AB, AIGH Investment Partners, LLC, and Investors
Pledge Agreements
Neonode Inc.
Electronic Equipment, Instruments & Components
2008
Stockholder Pledge and Security Agreement between Pledgor and Investors for Neonode, Inc. Shares
Pledge Agreements
Neonode Inc.
Electronic Equipment, Instruments & Components
NY
2008
Pledge Agreement between IPG Photonics Corporation and Vincent Au-Yeung dated January 22, 2001
Pledge Agreements
IPG Photonics Corp.
Electronic Equipment, Instruments & Components
MA
2006
Pledge Agreement between IPG Photonics Corporation and Dr. Valentin P. Gapontsev dated March 5, 2001
Pledge Agreements
IPG Photonics Corp.
Electronic Equipment, Instruments & Components
DE
2006