Highpower International, Inc. Pledge Agreements

9 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Maximum Pledge Guaranty Contract between Guangdong Huaxing Bank Co., Ltd. Huizhou Branch and Huizhou Highpower Technology Co. Ltd.
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Pledge Guaranty Contract between Guangdong Huaxing Bank Co., Ltd. Huizhou Branch and Huizhou Highpower Technology Co. Ltd.
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Collateral Contract Between Shenzhen Highpower Technology Co., Ltd. and Bank of China, Buji Sub-branch
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2019
Collateral Pledge Agreement between Ganzhou Highpower Technology Co., Ltd and Bank of China, Buji Sub-branch
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Collateral Agreement between Shenzhen Highpower Technology Co., Ltd and Bank of China, Buji Sub-branch
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Collateral Agreement between Shenzhen Highpower Technology and Bank of China (2015)
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Collateral Pledge Agreement between Shenzhen Highpower Technology and Bank of China (2015)
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Collateral Pledge Agreement between Ganzhou Highpower Technology (Shenzhen) Co., Ltd and Bank of China, Buji Sub-branch
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015
Pledge Agreement between Industrial Bank Shenzhen Longgang Branch and Shupeng Technology (Shenzhen) Co., Ltd.
Pledge Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2015