EVERSPIN TECHNOLOGIES INC Loan Agreements

8 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Second Amendment to Loan and Security Agreement, dated as of January 29, 2019 by and between the registrant and Silicon Valley Bank
Loan Agreements
EVERSPIN TECHNOLOGIES INC
Semiconductors & Semiconductor Equipment
2019
Third Amendment to Amended and Restated Loan and Security Agreement, dated as of July 22, 2022, between the Company and Silicon Valley Bank
Loan Agreements
EVERSPIN TECHNOLOGIES INC
Semiconductors & Semiconductor Equipment
2022
Second Amendment to Amended and Restated Loan and Security Agreement, dated as of July 28, 2021, between the Company and Silicon Valley Bank
Loan Agreements
EVERSPIN TECHNOLOGIES INC
Semiconductors & Semiconductor Equipment
2021
Amended and Restated Loan and Security Agreement, dated as of July 15, 2020, between the Company and Silicon Valley Bank
Loan Agreements
EVERSPIN TECHNOLOGIES INC
Semiconductors & Semiconductor Equipment
2020
Amended and Restated Loan and Security Agreement, dated as of August 5, 2019, between the Company and Silicon Valley Bank
Loan Agreements
EVERSPIN TECHNOLOGIES INC
Semiconductors & Semiconductor Equipment
CA
2019
Third Amendment to Loan and Security Agreement, dated June 19, 2019 by and between the registrant and Silicon Valley Bank
Loan Agreements
EVERSPIN TECHNOLOGIES INC
Semiconductors & Semiconductor Equipment
2019
First Amendment to Loan and Security Agreement, dated as of July 6, 2018, between the Company and Silicon Valley Bank
Loan Agreements
EVERSPIN TECHNOLOGIES INC
Semiconductors & Semiconductor Equipment
2018
LOAN AND SECURITY AGREEMENT
Loan Agreements
EVERSPIN TECHNOLOGIES INC
Semiconductors & Semiconductor Equipment
CA
2017