Borqs Technologies, Inc. Loan Agreements
9 Contracts & Agreements
- Waiver and Modification No. 1 to Loan and Security Agreement, dated as of December 17, 2018, by and among Partners for Growth V, L.P., Borqs Hong Kong Limited, BORQS International... (Filed With SEC on December 20, 2018)
- Loan Agreement, effective November 29, 2018, by and among BORQS Beijing Ltd., HHMC Microelectronics Co., Ltd., Borqs Technologies, Inc. and Pat Chan (Filed With SEC on December 6, 2018)
- Loan Agreement, dated July 31, 2018, by and between BORQS Software Solutions Private Limited and Bluecap Mobile Private Limited (Filed With SEC on November 19, 2018)
- Facility Agreement For Working Capital Loan, effective as of July 20, 2016, by and between Borqs Beijing Ltd. and SPD Silicon Valley Bank Co., Ltd (Filed With SEC on September 14, 2018)
- Loan and Security Agreement, effective as of August 26, 2016, by and between Borqs Hong Kong Limited and Partners For Growth IV, L.P (Filed With SEC on September 14, 2018)
- Loan Contract, effective October 18, 2016, by and between Borqs Beijing Ltd. and Wang Tun (Filed With SEC on August 6, 2018)
- Loan Contract, effective October 18, 2016, by and between Borqs Beijing Ltd. and Wang Lei (Filed With SEC on August 6, 2018)
- Waiver and Modification No. 2 to Loan and Security Agreement, effective as of April 30, 2018, by and between Borqs Hong Kong Limited and Partners for Growth IV, L.P (Filed With SEC on July 2, 2018)
- Loan and Security Agreement, effective as of April 30, 2018, by and between Borqs Hong Kong Limited and Partners For Growth V, L.P (Filed With SEC on July 2, 2018)
