Applied Materials Inc. Loan Agreements

3 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Term Loan Credit Agreement, dated as of August 19, 2019, among Applied Materials, Inc., JPMorgan Chase Bank, N.A., as administrative agent, and other lenders named therein
Loan Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2019
Amendment No. 1 to Term Loan Credit Agreement, dated as of December 30, 2020, by and among Applied Materials, Inc., as borrower, JPMorgan Chase Bank, N.A., as administrative...
Loan Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2021
U.S. $2,000,000,000 BRIDGE LOAN AGREEMENT Dated as of May 25, 2011 Among APPLIED MATERIALS, INC. as Borrower THE INITIAL LENDERS NAMED HEREIN as Initial Lenders and JPMORGANCHASE...
Loan Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2011