Xilinx Indenture Agreements

8 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Second Supplemental Indenture and Guarantee Agreement among Xilinx, Inc., Advanced Micro Devices, Inc., and U.S. Bank Trust Company, N.A.
Indenture Agreements
Xilinx
Semiconductors & Semiconductor Equipment
NY
2022
Fourth Supplemental Indenture to Indenture Dated June 14, 2007 among Xilinx, Inc., Advanced Micro Devices, Inc., and U.S. Bank Trust Company, N.A.
Indenture Agreements
Xilinx
Semiconductors & Semiconductor Equipment
NY
2022
First Supplemental Indenture for Xilinx, Inc. 2.375% Senior Notes Due 2030 with U.S. Bank National Association as Trustee
Indenture Agreements
Xilinx
Semiconductors & Semiconductor Equipment
NY
2020
Indenture Agreement between Xilinx, Inc. and U.S. Bank National Association dated May 19, 2020
Indenture Agreements
Xilinx
Semiconductors & Semiconductor Equipment
NY
2020
Second Supplemental Indenture between Xilinx, Inc. and U.S. Bank National Association (May 30, 2017)
Indenture Agreements
Xilinx
Semiconductors & Semiconductor Equipment
NY
2017
Supplemental Indenture between Xilinx, Inc. and The Bank of New York Mellon Trust Company, N.A. (March 12, 2014)
Indenture Agreements
Xilinx
Semiconductors & Semiconductor Equipment
NY
2014
Indenture for 2.625% Convertible Senior Notes due 2017 between Xilinx, Inc. and The Bank of New York Mellon Trust Company, N.A.
Indenture Agreements
Xilinx
Semiconductors & Semiconductor Equipment
NY
2010
Indenture for 3.125% Junior Subordinated Convertible Debentures due 2037 between Xilinx, Inc. and The Bank of New York Trust Company, N.A.
Indenture Agreements
Xilinx
Semiconductors & Semiconductor Equipment
NY
2007