Vishay Intertechnology Inc Indenture Agreements

7 Contracts & Agreements
Recent Contracts
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Filed
Form of Global Note, representing Vishay Intertechnology, Inc.'s 2.25% Senior Convertible Notes due 2025 (included as Exhibit A to the Indenture filed as Exhibit 4.1)
Indenture Agreements
Vishay Intertechnology Inc
Electronic Equipment, Instruments & Components
NY
2018
First Supplemental Indenture, dated as of October 29, 2024, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A. as Trustee
Indenture Agreements
Vishay Intertechnology Inc
2024
Second Supplemental Indenture, dated as of October 29, 2024, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A., as Trustee
Indenture Agreements
Vishay Intertechnology Inc
2024
Indenture, dated as of September 12, 2023, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, National Association, as Trustee
Indenture Agreements
Vishay Intertechnology Inc
2023
First Supplemental Indenture, dated as of December 23, 2020, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A., as trustee
Indenture Agreements
Vishay Intertechnology Inc
Electronic Equipment, Instruments & Components
2021
Indenture, dated as of June 12, 2018, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A., as Trustee
Indenture Agreements
Vishay Intertechnology Inc
Electronic Equipment, Instruments & Components
NY
2018
VISHAY INTERTECHNOLOGY, INC. AND UNION BANK, N.A., as Trustee INDENTURE Dated as of May 31, 2012 2.25% Convertible Senior Debentures due 2042 TABLE OF CONTENTS
Indenture Agreements
Vishay Intertechnology Inc
Electronic Equipment, Instruments & Components
DE
2012