Vishay Intertechnology Inc Indenture Agreements
7 Contracts & Agreements
- First Supplemental Indenture, dated as of October 29, 2024, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A. as Trustee (Filed With SEC on November 6, 2024)
- Second Supplemental Indenture, dated as of October 29, 2024, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A., as Trustee (Filed With SEC on November 6, 2024)
- Indenture, dated as of September 12, 2023, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, National Association, as Trustee (Filed With SEC on September 12, 2023)
- First Supplemental Indenture, dated as of December 23, 2020, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A., as trustee (Filed With SEC on January 5, 2021)
- Form of Global Note, representing Vishay Intertechnology, Inc.'s 2.25% Senior Convertible Notes due 2025 (included as Exhibit A to the Indenture filed as Exhibit 4.1) (Filed With SEC on June 13, 2018)
- Indenture, dated as of June 12, 2018, by and between Vishay Intertechnology, Inc. and HSBC Bank USA, N.A., as Trustee (Filed With SEC on June 13, 2018)
- VISHAY INTERTECHNOLOGY, INC. AND UNION BANK, N.A., as Trustee INDENTURE Dated as of May 31, 2012 2.25% Convertible Senior Debentures due 2042 TABLE OF CONTENTS (Filed With SEC on May 31, 2012)
