Applied Materials Inc. Indenture Agreements

6 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Fourth Supplemental Indenture dated May 29, 2020, by and between Applied Materials, Inc. and U.S. Bank National Association
Indenture Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Supplemental Indenture, dated as of June 11, 2024, by and between Applied Materials, Inc. and The Bank of New York Mellon Trust Company, N.A
Indenture Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2024
Indenture, dated as of June 11, 2024, by and between Applied Materials, Inc. and The Bank of New York Mellon Trust Company, N.A
Indenture Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2024
APPLIED MATERIALS, INC. as Issuer AND U.S. Bank NationalAssociation, as Trustee SECOND SUPPLEMENTAL INDENTURE Dated as of September 24, 2015 $600,000,000 of 2.625% Senior Notes...
Indenture Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2015
APPLIED MATERIALS, INC. as Issuer AND U.S. BankNational Association, as Trustee FIRST SUPPLEMENTAL INDENTURE Dated as of June 8, 2011 $400,000,000 of 2.650% Senior Notes due 2016,...
Indenture Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2011
APPLIED MATERIALS, INC. as Issuer AND U.S. BANK NATIONAL ASSOCIATION as Trustee INDENTURE Dated as of June 8, 2011 UNSUBORDINATED DEBT SECURITIES TABLE OF CONTENTS
Indenture Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2011