Guarantee Agreements in the Electronic Equipment, Instruments & Components Industry

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Form of Subsidiary Guarantee, dated August 5, 2019, made by certain of the Companys subsidiaries in favor of the Investors
Guarantee Agreements
DIGITAL ALLY INC
Electronic Equipment, Instruments & Components
NY
2019
Form of Guarantee
Guarantee Agreements
DIGITAL ALLY INC
2024
Guarantee Agreement dated as of September 15, 2023 made by Agri-Fintech Holdings, Inc. and Dozy Mmbuosi and Darren Mercer
Guarantee Agreements
MICT, Inc.
2023
Standard Merchant Cash Advance Agreement dated as of September 10, 2021 by and between LG Funding LLC, as the merchant, and each of MCA Naples, LLC, Memory Care America LLC, MCA...
Guarantee Agreements
SUPERCONDUCTOR TECHNOLOGIES INC
Electronic Equipment, Instruments & Components
2021
Company Guarantee Agreement with Golden Sunrise Investment LLC dated March 15, 2021
Guarantee Agreements
FOCUS UNIVERSAL INC.
Electronic Equipment, Instruments & Components
2021
Form of Subsidiary Guarantee, dated April 17, 2020, made by the Companys subsidiary in favor of the Investors
Guarantee Agreements
DIGITAL ALLY INC
Electronic Equipment, Instruments & Components
NY
2020
GUARANTEE AND SECURITY AGREEMENT
Guarantee Agreements
Alpine 4 Technologies Ltd.
Electronic Equipment, Instruments & Components
ID
2020
Payment Guarantee, dated January 21, 2020, issued by Bank of China (Hong Kong) Limited on behalf of the Seller
Guarantee Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2020
Payment Guarantee, dated January 21, 2020, issued by DBS Bank Ltd, Hong Kong Branch on behalf of the Seller
Guarantee Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2020
Affirmation of Guarantee of Geltech, Inc. dated October 30, 2018
Guarantee Agreements
LIGHTPATH TECHNOLOGIES INC
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract dated May 15, 2018, between Dang Yu Pan and Ping An Bank Co., Ltd. Shenzhen Branch (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract dated May 15, 2018, between Huizhou Highpower Technology Co., Ltd and Ping An Bank Co., Ltd. Shenzhen Branch (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract dated May 15, 2018, between Springpower Technology (Shenzhen) Co., Ltd. and Ping An Bank Co., Ltd. Shenzhen Branch (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Affirmation of Guarantee of Geltech, Inc
Guarantee Agreements
LIGHTPATH TECHNOLOGIES INC
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between Huaxia Bank Co., Ltd. Shenzhen Great China Sub-branch and Shenzhen Highpower Technology Co., Ltd. (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between Huaxia Bank Co., Ltd. Shenzhen Great China Sub-branch and Icon Energy System (Shenzhen) Co., Ltd. (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between Huaxia Bank Co., Ltd. Shenzhen Great China Sub-branch and Huizhou Highpower Technology Co., Ltd. (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Personal Maximum Guarantee Contract between Huaxia Bank Co., Ltd. Shenzhen Great China Sub-branch and Yin Zhoutao (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Personal Maximum Guarantee Contract between Huaxia Bank Co., Ltd. Shenzhen Great China Sub-branch and Dang Yu Pan (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between China Minsheng Banking Corp., Ltd and Springpower Technology (Shenzhen) Co., Ltd. (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between China Minsheng Banking Corp., Ltd and Huizhou Highpower Technology Co., Ltd. (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Maximum Guarantee Contract between China Minsheng Banking Corp., Ltd and Dang Yu Pan (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2018
Affirmation of Guarantee of Geltech, Inc
Guarantee Agreements
LIGHTPATH TECHNOLOGIES INC
Electronic Equipment, Instruments & Components
2018
Maximum Amount Personal Joint Responsibility Guarantee between Zhou Tao Yin and Bank of Jiangsu, Shenzhen Sub-branch (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Amount Personal Joint Responsibility Guarantee between Dang Yu Pan and Bank of Jiangsu, Shenzhen Sub-branch (translated to English)
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Guarantee of the Registrant to Deutsche Bank AG dated July 31, 2017
Guarantee Agreements
IPG Photonics Corp.
Electronic Equipment, Instruments & Components
2017
Annex 1 to Corporate Guarantee to Deutsche Bank AG dated July 31, 2017
Guarantee Agreements
IPG Photonics Corp.
Electronic Equipment, Instruments & Components
2017
Maximum Guarantee Contract
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Guarantee Contract
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Guarantee Contract
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Guarantee Contract (Applicable where the guarantor is a unit) No.: GGBZ 2016 SHJZBZEZ No. 011-1 Shupeng Technology (Shenzhen) Co.,wd Ltd.(Seal) CHINA MINSHENG BANKING...
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Guarantee Contract (Applicable where the guarantor is a unit) No.: GGBZ 2016 SHJZBZEZ No. 011-2 SHENZHEN HIGHPOWER TECHNOLOGY CO., LTD. (Seal) CHINA MINSHENG BANKING...
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Maximum Guarantee Contract No.: 2016 SHJZBZEZNo. 011-3 CHINA MINSHENG BANKING CORP., LTD.
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2017
Affirmation of Guarantee of Geltech, Inc
Guarantee Agreements
LIGHTPATH TECHNOLOGIES INC
Electronic Equipment, Instruments & Components
2016
BANK OF GANZHOU Maximum Guarantee Contract
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
BANK OF GANZHOU Maximum Guarantee Contract
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
BANK OF GANZHOU Maximum Guarantee Contract
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
BANK OF GANZHOU Maximum Guarantee Contract
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
BANK OF GANZHOU Maximum Guarantee Contract
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016
Maximum Guarantee Contract Huaxia Bank Co., Ltd.
Guarantee Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2016