QUALCOMM Inc. Financing Agreements

3 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Continuing Agreement for Standby Letters of Credit between The Bank of Tokyo-Mitsubishi UFJ, Ltd. and Applicant (November 22, 2016)
Financing Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2016
Interim Funding Agreement among Pegaso Comunicaciones y Sistemas, S.A. de C.V., Other Borrower Group Members, and Qualcomm Incorporated, Consented to by Telefonaktiebolaget L.M....
Financing Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2002
Restructuring Agreement among Vesper Entities, Velocom, Qualcomm, Bell Canada International, Nortel, Lucent, Ericsson, and Harris (November 9, 2001)
Financing Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2001