Facility Agreements in the Electronic Equipment, Instruments & Components Industry

41 Contracts & Agreements
Browse by Company
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Credit Facility Agreement between FirstRand Bank Limited and Mix Telematics Limited dated March 14, 2024
Facility Agreements
PowerFleet, Inc.
Electronic Equipment, Instruments & Components
2024
Fifth Amendment to Facility Agreement between Conrent Invest S.A. and Track Group, Inc. (April 26, 2023)
Facility Agreements
Track Group, Inc.
Electronic Equipment, Instruments & Components
IL
2023
Operations Transfer Agreement between Memory Care at Good Shepherd, LLC, MCA New Braunfels Operating Company, LLC, MCA Westover Hills Operating Company, LLC, and Chapters Little...
Facility Agreements
SUPERCONDUCTOR TECHNOLOGIES INC
Electronic Equipment, Instruments & Components
2023
Trimble Inc. – 364-Day Bridge Facility Commitment Letter with Bank of America and BofA Securities (Project Trout)
Facility Agreements
Trimble Inc
Electronic Equipment, Instruments & Components
NY
2022
Credit Facility Agreement between Fabrinet Co., Ltd. and Bank of Ayudhya Public Company Limited
Facility Agreements
Fabrinet
Electronic Equipment, Instruments & Components
2019
Amendment to Facility Agreement between Track Group, Inc. and Conrent Invest S.A. (Safety 2) dated February 24, 2019
Facility Agreements
Track Group, Inc.
Electronic Equipment, Instruments & Components
IL
2019
Amendment to Facility Agreement between Track Group, Inc. and Conrent Invest S.A. (Safety 2) dated July 19, 2018
Facility Agreements
Track Group, Inc.
Electronic Equipment, Instruments & Components
IL
2018
Credit Facility Agreement between IPG Laser GmbH and Deutsche Bank AG for EUR 50 Million Umbrella Facility (July 27, 2017)
Facility Agreements
IPG Photonics Corp.
Electronic Equipment, Instruments & Components
2017
Fourth Amendment to Credit Facility Agreement between IPG Laser GmbH and Deutsche Bank AG (December 16, 2016)
Facility Agreements
IPG Photonics Corp.
Electronic Equipment, Instruments & Components
2017
Third Amendment to Credit Facility Agreement between IPG Laser GmbH and Deutsche Bank AG (EUR 30,000,000 Umbrella Facility)
Facility Agreements
IPG Photonics Corp.
Electronic Equipment, Instruments & Components
2016
Amended and Restated Facility Agreement between Track Group, Inc. and Conrent Invest S.A. (Safety 2) dated June 30, 2015
Facility Agreements
Track Group, Inc.
Electronic Equipment, Instruments & Components
2015
US$150,000,000 Asset Backed Loan Facility Agreement between TTM Technologies Enterprises (HK) Limited and The Hongkong and Shanghai Banking Corporation Limited, dated May 22, 2015
Facility Agreements
TTM Technologies, Inc.
Electronic Equipment, Instruments & Components
2015
Facility Agreement among Fabrinet Company Limited, Fabrinet, and TMB Bank Public Company Limited dated April 25, 2014
Facility Agreements
Fabrinet
Electronic Equipment, Instruments & Components
2014
Annex 1 to Corporate Guarantee for EUR 30 Million Umbrella Facility Agreement between Deutsche Bank AG and IPG Laser Group
Facility Agreements
IPG Photonics Corp.
Electronic Equipment, Instruments & Components
2014
Credit Facility Agreement between IPG Laser GmbH and Deutsche Bank AG for EUR 30 Million Umbrella Facility
Facility Agreements
IPG Photonics Corp.
Electronic Equipment, Instruments & Components
2014
Commitment Letter for 364-Day Credit Facility between Citigroup Global Markets Inc. and TE Connectivity Ltd./Tyco Electronics Group S.A.
Facility Agreements
TE Connectivity Ltd.
Electronic Equipment, Instruments & Components
2014
Banking Facility Agreement between The Shanghai Commercial & Savings Bank, Ltd., Hong Kong Branch and Hong Kong Highpower Technology Company Limited
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2014
Amendment to JPY14,000,000,000 Facility Agreement Among SYNNEX Infotec Corporation, SYNNEX Corporation, and The Royal Bank of Scotland PLC (December 12, 2013)
Facility Agreements
SYNNEX Corporation
Electronic Equipment, Instruments & Components
2014
Facility Agreement between Tetra House Pte. Ltd. and SecureAlert, Inc. dated December 30, 2013
Facility Agreements
Track Group, Inc.
Electronic Equipment, Instruments & Components
2014
Revolving Short-Term Secured Loan Facility Agreement between The Shanghai Commercial & Savings Bank, Ltd. (Hong Kong Branch) and Hong Kong Highpower Technology Company Limited
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Additional Term Loan Facility Agreement between Industrial and Commercial Bank of China (Macau) Limited and Hong Kong Highpower Technology Company Limited
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Term Loan Facility Agreement between Industrial and Commercial Bank of China (Macau) Limited and Hong Kong Highpower Technology Company Limited
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Revolving Short-Term Secured Loan Facility Agreement between The Shanghai Commercial & Savings Bank, Ltd. (Hong Kong Branch) and Hong Kong Highpower Technology Company Limited
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2013
Revolving Short-Term Secured Loan Facility Agreement between The Shanghai Commercial & Savings Bank, Ltd., Hong Kong Branch and Hong Kong Highpower Technology Company Limited
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Wing Lung Bank Facility Offer Letter to Hong Kong Highpower Technology Company Limited (April 2012)
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2012
Credit Facility Agreement between Deutsche Bank AG and IPG Laser GmbH (EUR 20,000,000 Umbrella Facility, 2012)
Facility Agreements
IPG Photonics Corp.
Electronic Equipment, Instruments & Components
2012
Amendment No. 3 and Incremental Facility Agreement to Credit Agreement among Vishay Intertechnology, Inc., Incremental Revolving Lenders, and JPMorgan Chase Bank, N.A.
Facility Agreements
Vishay Intertechnology Inc
Electronic Equipment, Instruments & Components
NY
2012
Revolving Credit Facility Agreement between Vishay Advanced Technologies Ltd. and HSBC Bank PLC, Tel Aviv Branch (November 30, 2011)
Facility Agreements
Vishay Precision Group, Inc.
Electronic Equipment, Instruments & Components
2011
General Terms and Conditions of Facility Agreement between TMB Bank and Fabrinet Company Limited
Facility Agreements
Fabrinet
Electronic Equipment, Instruments & Components
NY
2011
Facility Agreement between Fabrinet Company Limited, Fabrinet, and TMB Bank Public Company Limited dated May 12, 2011
Facility Agreements
Fabrinet
Electronic Equipment, Instruments & Components
2011
Uncommitted Short Term Revolving Facility Agreement between Citibank (China) Co., Ltd. Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd. and Springpower Technology...
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Uncommitted Short Term Revolving Facility Agreement between Citibank (China) Co., Ltd. Shenzhen Branch and Shenzhen Highpower Technology Co., Ltd.
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Standard Chartered Bank Facility Letter with Hong Kong Highpower Technology Company Limited (January 21, 2011)
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Banking Facility Agreement between Standard Chartered Bank (China) Limited and Shenzhen Highpower Technology Co., Ltd.
Facility Agreements
Highpower International, Inc.
Electronic Equipment, Instruments & Components
2011
Credit Facility Agreement Between Deutsche Bank AG and IPG Laser GmbH Dated June 23, 2010
Facility Agreements
IPG Photonics Corp.
Electronic Equipment, Instruments & Components
2011
Credit Facility Agreement between Deutsche Bank AG and IPG Laser GmbH (October 10, 2007)
Facility Agreements
IPG Photonics Corp.
Electronic Equipment, Instruments & Components
2007
US$35,000,000 Credit Facility Agreement between Fabrinet, Fabrinet Co., Ltd., and ABN AMRO Bank N.V. (December 15, 2006)
Facility Agreements
Fabrinet
Electronic Equipment, Instruments & Components
NY
2007
Second Amendment and Incremental Facility Agreement among Anixter Inc., Subsidiaries, Lenders, and Wells Fargo Bank
Facility Agreements
Anixter International Inc.
Electronic Equipment, Instruments & Components
NY
2014
Multi-Currency Revolving Advance Facility Agreement between National Westminster Bank Plc (via RBS) and Anixter International Limited, Anixter Limited
Facility Agreements
Anixter International Inc.
Electronic Equipment, Instruments & Components
2009
Credit Facility Agreement between IEC Electronics Corp. and Manufacturers and Traders Trust Company dated May 30, 2008
Facility Agreements
IEC ELECTRONICS CORP
Electronic Equipment, Instruments & Components
NY
2008