Teradyne Credit Agreements

4 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Third Amendment to Credit Agreement dated November 7, 2023 among Teradyne, Inc., Truist Bank, as the administrative agent, issuing bank and swingline lender, and other lenders...
Credit Agreements
Teradyne
Semiconductors & Semiconductor Equipment
NY
2024
Credit Agreement, dated May 1, 2020, by and among Teradyne, Inc., as the Borrower, Truist Bank, as the administrative agent, issuing bank and swingline lender, and the several...
Credit Agreements
Teradyne
Semiconductors & Semiconductor Equipment
NY
2020
Amendment No.2 to Credit Agreement, dated as of March 21, 2018, among Teradyne, Inc., Barclays Bank PLC, as the administrative agent and collateral agent, and the lenders party...
Credit Agreements
Teradyne
Semiconductors & Semiconductor Equipment
NY
2018
GOLDMAN SACHS CREDIT PARTNERS L.P. 85 Broad Street
Credit Agreements
Teradyne
Semiconductors & Semiconductor Equipment
NY
2008