Teradyne Credit Agreements

8 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Third Amendment to Credit Agreement among Teradyne, Inc., Lenders, and Truist Bank (November 7, 2023)
Credit Agreements
Teradyne
Semiconductors & Semiconductor Equipment
NY
2024
First Amendment to Credit Agreement among Teradyne, Inc., Consenting and Replacement Lenders, and Truist Bank
Credit Agreements
Teradyne
Semiconductors & Semiconductor Equipment
NY
2022
Amendment No. 1 to Credit Agreement among Teradyne, Inc., Barclays Bank PLC, and Lenders (May 19, 2015)
Credit Agreements
Teradyne
Semiconductors & Semiconductor Equipment
NY
2015
Credit Agreement among Teradyne, Inc., Barclays Bank PLC, and Other Lenders (April 27, 2015)
Credit Agreements
Teradyne
Semiconductors & Semiconductor Equipment
MA
2015
Credit Agreement among Teradyne, Inc., Subsidiary Guarantors, and Bank of America, N.A. (November 14, 2008)
Credit Agreements
Teradyne
Semiconductors & Semiconductor Equipment
DC
2008
Commitment Letter between Goldman Sachs Credit Partners L.P. and Teradyne, Inc. for Acquisition Financing Facility
Credit Agreements
Teradyne
Semiconductors & Semiconductor Equipment
NY
2008
Credit Agreement dated May 1, 2020 among Teradyne, Inc., Lenders, and Truist Bank as Administrative Agent
Credit Agreements
Teradyne
Semiconductors & Semiconductor Equipment
NY
2020
Amendment No. 2 to Credit Agreement among Teradyne, Inc., Barclays Bank PLC, and Lenders (March 21, 2018)
Credit Agreements
Teradyne
Semiconductors & Semiconductor Equipment
NY
2018