QUALCOMM Inc. Credit Agreements

11 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Credit Agreement among QUALCOMM Incorporated, the lenders party thereto, the letter of credit issuers party thereto and Bank of America, N.A., as administrative agent, swing line...
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
DE
2020
LIBOR Transition Amendment to Credit Agreement, dated as of December 21, 2021, by and between QUALCOMM Incorporated and Bank of America, N.A., as administrative agent
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
2022
Amendment No. 2, dated as of June 11, 2018, among QUALCOMM Incorporated, the lenders party thereto and Goldman Sachs Bank USA, as administrative agent, to the Credit Agreement...
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
2018
Amendment No. 1, dated as of April 20, 2018, among QUALCOMM Incorporated, the lenders party thereto and Goldman Sachs Bank USA, as administrative agent, to the Credit Agreement...
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
2018
Amendment No. 1, dated as of April 20, 2018, among QUALCOMM Incorporated, the lenders party thereto and Goldman Sachs Bank USA, as administrative agent, to the Credit Agreement...
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
2018
Credit Agreement among QUALCOMM Incorporated, the lenders party thereto and Goldman Sachs Bank USA, as Administrative Agent, dated as of March 6, 2018
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
DE
2018
CONTINUING AGREEMENT FOR STANDBY LETTERS OF CREDIT
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2016
FIRST AMENDMENT TO LETTER OF CREDIT AND REIMBURSEMENT AGREEMENT
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
2016
LETTER OF CREDIT AND REIMBURSEMENT AGREEMENT between MIZUHO BANK, LTD. and QUALCOMM RIVER HOLDINGS, B.V. Dated as of November 22, 2016
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2016
AMENDED AND RESTATED CREDIT AGREEMENT Dated as of November 8, 2016 among QUALCOMM INCORPORATED, as Borrower, BANK OF AMERICA, N.A., as Administrative Agent, Swing Line Lender and...
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
DE
2016
CREDIT AGREEMENT Dated as of November 8, 2016 among QUALCOMM INCORPORATED, as Borrower, GOLDMAN SACHS BANK USA, as Administrative Agent, and The Other Lenders Party Hereto GOLDMAN...
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
DE
2016