Micron Technology Credit Agreements

11 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
Amendment No. 2 to Credit Agreement, dated as of June 7, 2023, by HSBC Bank USA, National Association, as administrative agent
Credit Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2023
Credit Agreement, dated as of May 14, 2021, by and among Micron Technology, Inc., as borrower, HSBC Bank USA, National Association, as administrative agent, the other agents party...
Credit Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2021
Incremental Amendment No. 1 to Credit Agreement dated July 3, 2018, by and among Micron Technology, Inc., as borrower, JPMorgan Chase Bank, N.A., as administrative agent and...
Credit Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2018
Credit Agreement, dated as of July 3, 2018, by and among Micron Technology, Inc., as borrower, JPMorgan Chase Bank, N.A., as administrative agent and collateral agent, and the...
Credit Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2018
Fourth Amendment to the Credit Agreement, dated April 26, 2016, by and among Micron Technology, Inc., as borrower, Morgan Stanley Senior Funding, Inc., as administrative agent and...
Credit Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2018
Third Amendment to the Credit Agreement, dated April 26, 2016, by and among Micron Technology, Inc., as borrower, Morgan Stanley Senior Funding, Inc., as administrative agent and...
Credit Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2017
SECOND AMENDMENT TO THE CREDIT AGREEMENT among MICRON TECHNOLOGY, INC., as Borrower and THE LENDERS PARTY HERETO, and MORGAN STANLEY SENIOR FUNDING, INC., as Administrative Agent...
Credit Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2017
CREDIT AGREEMENT among MICRON TECHNOLOGY, INC., as Borrower and THE LENDERS PARTY HERETO, and MORGAN STANLEY SENIOR FUNDING, INC., as Administrative Agent and as Collateral Agent...
Credit Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2016
REGISTRATION RIGHTS AGREEMENT Dated February 3, 2015 among MICRON TECHNOLOGY, INC. GOLDMAN, SACHS & CO. MORGAN STANLEY & CO. LLC and CREDIT SUISSE SECURITIES (USA) LLC
Credit Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2015
REGISTRATION RIGHTS AGREEMENT Dated July 28, 2014 among MICRON TECHNOLOGY, INC. MORGAN STANLEY & CO. LLC GOLDMAN, SACHS & CO. and CREDIT SUISSE SECURITIES (USA) LLC
Credit Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2014
REGISTRATION RIGHTS AGREEMENT Dated February 10, 2014 among MICRON TECHNOLOGY, INC. MORGAN STANLEY & CO. LLC GOLDMAN, SACHS & CO. and CREDIT SUISSE SECURITIES (USA) LLC
Credit Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2014