Credit Agreements in the Semiconductors & Semiconductor Equipment Industry

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AMENDED AND RESTATED CREDIT AGREEMENT dated as of September 26,2013 among M/A-COMTECHNOLOGY SOLUTIONS HOLDINGS, INC. The Lenders Party Hereto JPMORGAN CHASE BANK, N.A....
Credit Agreements
MACOM Technology Solutions Holdings, Inc.
Semiconductors & Semiconductor Equipment
IL
2013
Tax Credit Transfer Agreement (Variable), dated as of December 6, 2024, between First Solar, Inc. and Visa Inc
Credit Agreements
First Solar
2024
Tax Credit Transfer Agreement (Fixed), dated as of December 6, 2024, between First Solar, Inc. and Visa Inc
Credit Agreements
First Solar
2024
Amendment of Line of Credit Agreement between Bitmine Immersion Technologies, Inc. and Innovative Digital Investors Emerging Technology, L.P
Credit Agreements
Sandy Springs Holdings, Inc.
2024
Third Amendment to Credit Agreement dated November 7, 2023 among Teradyne, Inc., Truist Bank, as the administrative agent, issuing bank and swingline lender, and other lenders...
Credit Agreements
Teradyne
2024
Standard Credit Agreement, dated as of March 26, 2024, by and between Magnachip Semiconductor, Ltd. and Korea Development Bank. (English Translation)
Credit Agreements
MAGNACHIP SEMICONDUCTOR Corp
Semiconductors & Semiconductor Equipment
2024
Credit Agreement, dated as of April 23, 2024, by and among Qorvo, Inc., as the Borrower, Bank of America, N.A., as Administrative Agent, Swing Line Lender and L/C Issuer, and the...
Credit Agreements
Qorvo
Semiconductors & Semiconductor Equipment
DE
2024
First Amendment to Credit Agreement, dated as of December 1, 2023, amending the Credit Agreement, dated as of August 15, 2023, among Broadcom, the lenders and other parties
Credit Agreements
Broadcom Inc.
Semiconductors & Semiconductor Equipment
NY
2024
Credit and Security Agreement, dated as of March 1, 2024, among Transphorm, Inc., Transphorm Technology, Inc. and Renesas Electronics America Inc
Credit Agreements
Peninsula Acquisition Corp
Semiconductors & Semiconductor Equipment
CA
2024
Third Amendment to the Credit Agreement, dated January 31, 2024
Credit Agreements
SUNPOWER CORP
Semiconductors & Semiconductor Equipment
2024
Tax Credit Transfer Agreement (Variable), dated as of December 22, 2023, between First Solar, Inc. and Fiserv, Inc
Credit Agreements
First Solar
Semiconductors & Semiconductor Equipment
WI
2023
Tax Credit Transfer Agreement (Fixed), dated as of December 22, 2023, between First Solar, Inc. and Fiserv, Inc
Credit Agreements
First Solar
Semiconductors & Semiconductor Equipment
WI
2023
Amended and Restated Line of Credit Agreement between the Company and Innovative Digital Investors Emerging Technology, L.P. dated May 13, 2023
Credit Agreements
Sandy Springs Holdings, Inc.
Semiconductors & Semiconductor Equipment
2023
First Amendment To Credit Agreement dated as of October 23, 2023, is made between, among others, Marvell Technology, Inc., a Delaware corporation (The Borrower), the lenders party...
Credit Agreements
Marvell Technology, Inc.
Semiconductors & Semiconductor Equipment
NY
2023
Second Amendment To Credit Agreement dated as of October 23, 2023, between, among others, Marvell Technology, Inc., a Delaware corporation, the Lenders party hereto and JPMorgan...
Credit Agreements
Marvell Technology, Inc.
Semiconductors & Semiconductor Equipment
NY
2023
First Amendment to Credit Agreement
Credit Agreements
Advanced Micro Devices Inc
Semiconductors & Semiconductor Equipment
DE
2023
Amendment No. 2 to Third Amended and Restated Credit Agreement, dated as of July 24, 2023, among the Company, each lender party thereto, and Bank of America, N.A., as...
Credit Agreements
Analog Devices, Inc.
Semiconductors & Semiconductor Equipment
NY
2023
Credit Agreement, dated as of August 15, 2023, among Broadcom, the lenders and other parties party thereto, and Bank of America, N.A., as Administrative Agent
Credit Agreements
Broadcom Inc.
Semiconductors & Semiconductor Equipment
NY
2023
Third Amendment to Credit Agreement, dated June 28, 2023 between Power Integrations, Inc. and Wells Fargo Bank, National Association
Credit Agreements
Power Integrations, Inc.
Semiconductors & Semiconductor Equipment
CA
2023
Amendment No. 2 to Credit Agreement, dated as of June 7, 2023, by HSBC Bank USA, National Association, as administrative agent
Credit Agreements
Micron Technology
Semiconductors & Semiconductor Equipment
NY
2023
Second Amendment to Amended and Restated Credit Agreement, dated as of June 23, 2023, by and among Qorvo, Inc., as the Borrower, certain subsidiaries of the Borrower identified...
Credit Agreements
Qorvo
Semiconductors & Semiconductor Equipment
NY
2023
Credit Agreement, dated as of June 22, 2023, by and among ON Semiconductor Corporation, as borrower, the several lenders party thereto, JPMorgan Chase Bank, N.A., as...
Credit Agreements
ON SEMICONDUCTOR CORP
Semiconductors & Semiconductor Equipment
NY
2023
First Amendment to Credit Agreement, dated as of April 14, 2023, among Marvell Technology, Inc., the lenders party thereto, and JPMorgan Chase Bank, N.A., as the Administrative...
Credit Agreements
Marvell Technology, Inc.
Semiconductors & Semiconductor Equipment
NY
2023
Amended and Restated Revolving Credit Agreement, dated as of April 14, 2023, among Marvell Technology, Inc., the lenders party thereto, and Bank of America, N.A., as the...
Credit Agreements
Marvell Technology, Inc.
Semiconductors & Semiconductor Equipment
DE
2023
Extension Agreement, dated as of February 21, 2023, to Credit Agreement, dated as of February 21, 2020 (as amended by that certain Amendment No. 1 to Credit Agreement, dated as of...
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2023
First Amendment to Credit Agreement, dated as of January 26, 2023, among SunPower Corporation, certain of its subsidiaries as guarantors, the Lenders (as defined therein)
Credit Agreements
SUNPOWER CORP
Semiconductors & Semiconductor Equipment
2023
Line of Credit Agreement
Credit Agreements
Sandy Springs Holdings, Inc.
Semiconductors & Semiconductor Equipment
2022
Amended and Restated Credit Agreement, dated as of September 1, 2022, by and among Lattice Semiconductor Corporation., as borrower, the lenders from time to time party thereto,...
Credit Agreements
LATTICE SEMICONDUCTOR CORP
Semiconductors & Semiconductor Equipment
NY
2022
Amended and Restated Revolving Credit Agreement, dated as of August 26, 2022, among NXP B.V., NXP Funding LLC, the several lenders from time to time parties thereto, and Barclays...
Credit Agreements
NXP Semiconductors N.V.
Semiconductors & Semiconductor Equipment
NY
2022
Amendment No. 1, dated as of July 27, 2022, to the Credit Agreement, dated as of February 21, 2020, among Applied Materials, Inc., JPMorgan Chase Bank, N.A., as administrative...
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Credit Line Agreement, dated July 29, 2022, by and between NeoPhotonics Dongguan Co., Ltd. and Shanghai Pudong Development Bank Shenzhen Branch (Translation to English of Chinese...
Credit Agreements
NEOPHOTONICS CORP
Semiconductors & Semiconductor Equipment
2022
Credit Line Agreement dated July 29, 2022, by and between NeoPhotonics (China) Co., Ltd. and Shanghai Pudong Development Bank Shenzhen Branch (Translation to English of Chinese...
Credit Agreements
NEOPHOTONICS CORP
Semiconductors & Semiconductor Equipment
2022
Amended and Restated Line of Credit Agreement between Bitmine Immersion Technologies, Inc. and Innovative Digital Investors Emerging Technology LP dated June 24, 2022
Credit Agreements
Sandy Springs Holdings, Inc.
Semiconductors & Semiconductor Equipment
2022
Equal Priority Intercreditor Agreement, dated as of July 6, 2022, among Entegris, certain subsidiaries of Entegris, Morgan Stanley Senior Funding, Inc., as senior credit...
Credit Agreements
ENTEGRIS INC
Semiconductors & Semiconductor Equipment
NY
2022
Credit Agreement, dated as of June 8, 2022, by and among KLA Corporation, the several banks and other financial institutions party thereto as lenders, and JPMorgan Chase Bank,...
Credit Agreements
KLA Corporation
Semiconductors & Semiconductor Equipment
NY
2022
LIBOR Transition Amendment, dated April 6, 2022, to Amended and Restated Credit Agreement, by and among Qorvo, Inc., as the Borrower, and Bank of America, N.A., as Administrative...
Credit Agreements
Qorvo
Semiconductors & Semiconductor Equipment
DE
2022
LIBOR Transition Amendment to Credit Agreement, dated as of December 21, 2021, by and between QUALCOMM Incorporated and Bank of America, N.A., as administrative agent
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
2022
Sixth Amendment to the Credit Agreement, dated as of October 26, 2021, by and among Wolfspeed, Inc., Wells Fargo Bank, National Association, as administrative agent, and the other...
Credit Agreements
Cree Inc
Semiconductors & Semiconductor Equipment
NC
2022
Seventh Amendment to the Credit Agreement, dated as of January 25, 2022, by and among Wolfspeed, Inc., Wells Fargo Bank, National Association, as administrative agent, and the...
Credit Agreements
Cree Inc
Semiconductors & Semiconductor Equipment
NC
2022
Credit Agreement, dated as of January 14, 2022, between Lumentum Holdings Inc. and NeoPhotonics Corporation
Credit Agreements
NEOPHOTONICS CORP
Semiconductors & Semiconductor Equipment
CA
2022
Amended and Restated Credit Agreement, dated as of December 16, 2021, by and among Microchip Technology Incorporated, the lenders from time to time party thereto and JPMorgan...
Credit Agreements
Microchip Technology
Semiconductors & Semiconductor Equipment
DE
2021