Applied Materials Inc. Credit Agreements

19 Contracts & Agreements
Recent Contracts
Category
Company
Industry
Jur. Jurisdiction
Filed
$2,000,000,000 Credit Agreement among Applied Materials, Inc., Initial Lenders, and Bank of America, N.A. (Administrative Agent)
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2025
Extension Agreement to Credit Agreement among Applied Materials, Inc., JPMorgan Chase Bank, N.A., and Lenders (2023)
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2023
Extension Agreement to $1,500,000,000 Credit Agreement among Applied Materials, Inc. and Lenders (2017)
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2017
$1,500,000,000 Credit Agreement among Applied Materials, Inc., Initial Lenders, and JPMorgan Chase Bank, N.A. (2015)
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2015
Amendment No. 2 and Waiver to Credit Agreement among Applied Materials, Inc., Lenders, and JPMorgan Chase Bank, N.A.
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2014
Extension Agreement to Credit Agreement among Applied Materials, Inc. and Lenders, dated May 25, 2013
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2013
$1,500,000,000 Credit Agreement among Applied Materials, Inc., Initial Lenders, and JPMorgan Chase Bank, N.A. (May 25, 2011)
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2011
Amendment No. 1 to Credit Agreement among Applied Materials, Inc., Lenders, and Citicorp USA, Inc.
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2009
$1,000,000,000 Credit Agreement among Applied Materials, Inc. and Initial Lenders, dated January 26, 2007
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2007
364-Day Credit Agreement between Applied Materials, Inc. and Citicorp USA, Inc. dated September 14, 2006
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2006
Amendment No. 1 to Three Year Credit Agreement among Applied Materials, Inc., Lenders, and Citicorp USA, Inc.
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2004
Amendment No. 1 to 364-Day Credit Agreement among Applied Materials, Inc., Lenders, and Citicorp USA, Inc.
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2004
Three-Year $250,000,000 Credit Agreement among Applied Materials, Inc. and Lenders (September 19, 2003)
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2004
$250,000,000 364-Day Credit Agreement among Applied Materials, Inc. and Lenders (September 19, 2003)
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2004
$250,000,000 364-Day Credit Agreement among Applied Materials, Inc., Initial Lenders, Citicorp USA, Inc., and Bank of America, N.A.
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2000
Amendment No. 1 to Credit Agreement among Applied Materials, Inc., JPMorgan Chase Bank, N.A., and Lenders
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2022
$1,500,000,000 Credit Agreement among Applied Materials, Inc. and Lenders, with JPMorgan Chase as Administrative Agent (February 21, 2020)
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2020
Amendment No. 2 to Credit Agreement among Applied Materials, Inc., Lenders, and JPMorgan Chase Bank, N.A.
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
NY
2019
$2,000,000,000 Term Loan Credit Agreement among Applied Materials, Inc. and Lenders, August 19, 2019
Credit Agreements
Applied Materials Inc.
Semiconductors & Semiconductor Equipment
DE
2019