AMKOR TECHNOLOGY, INC. Credit Agreements

7 Contracts & Agreements
Recent Contracts
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Company
Industry
Jur. Jurisdiction
Filed
Amendment No. 2 to Credit Agreement, dated as of May 24, 2005 among Amkor Technology, Inc., the Lenders party thereto and Citicorp North America, Inc., as Administrative Agent
Credit Agreements
AMKOR TECHNOLOGY, INC.
Semiconductors & Semiconductor Equipment
NY
2005
REGISTRATION RIGHTS AGREEMENT Dated May 20, 2013 among AMKORTECHNOLOGY, INC. and DEUTSCHE BANK SECURITIES INC. and CREDIT SUISSE SECURITIES (USA) LLC REGISTRATION RIGHTS AGREEMENT
Credit Agreements
AMKOR TECHNOLOGY, INC.
Semiconductors & Semiconductor Equipment
NY
2013
General Terms and Conditions for Bank Credit Transactions (Corporate Borrower)
Credit Agreements
AMKOR TECHNOLOGY, INC.
Semiconductors & Semiconductor Equipment
2010
Credit Facility Agreement (For Corporate Borrower) To: Woori Bank Date: May 24, 2010
Credit Agreements
AMKOR TECHNOLOGY, INC.
Semiconductors & Semiconductor Equipment
2010
AMENDMENT NO. 1 TO CREDIT AGREEMENT, DATED AS OF OCTOBER 27, 2004
Credit Agreements
AMKOR TECHNOLOGY, INC.
Semiconductors & Semiconductor Equipment
NY
2004
SECOND LIEN CREDIT AGREEMENT, DATED AS OF OCTOBER 27, 2004
Credit Agreements
AMKOR TECHNOLOGY, INC.
Semiconductors & Semiconductor Equipment
NY
2004
$30,000,000 CREDIT AGREEMENT Dated as of June 29, 2004 among AMKOR TECHNOLOGY, INC. as Borrower and THE LENDERS AND ISSUERS PARTY HERETO and CITICORP NORTH AMERICA, INC. as...
Credit Agreements
AMKOR TECHNOLOGY, INC.
Semiconductors & Semiconductor Equipment
NY
2004