QUALCOMM Inc. Business Finance Contracts & Agreements

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Form of 2053 Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Form of 2033 Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Officers Certificate, dated November 9, 2022, for the 2033 Notes and the 2053 Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Underwriting Agreement, dated November 7, 2022, among QUALCOMM Incorporated, Barclays Capital Inc., BofA Securities, Inc., Goldman Sachs & Co. LLC and J.P. Morgan Securities LLC
Underwriting Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Form of 2052 Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Form of 2032 Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Officers Certificate, dated May 9, 2022, for the 2032 Notes and the 2052 Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2022
Underwriting Agreement, dated May 5, 2022, among QUALCOMM Incorporated, BofA Securities, Inc., Citigroup Global Markets Inc., Goldman Sachs & Co. LLC and J.P. Morgan Securities LLC
Underwriting Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2022
LIBOR Transition Amendment to Credit Agreement, dated as of December 21, 2021, by and between QUALCOMM Incorporated and Bank of America, N.A., as administrative agent
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
2022
Form of 1.650% Notes due 2032
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2021
Form of 1.300% Notes due 2028
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2021
Officers Certificate, dated January 6, 2021, for the 1.300% Notes due 2028 and the 1.650% Notes due 2032
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2021
Credit Agreement among QUALCOMM Incorporated, the lenders party thereto, the letter of credit issuers party thereto and Bank of America, N.A., as administrative agent, swing line...
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
DE
2020
Form of 2032 Exchange Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Form of 2028 Exchange Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Form of Officers' Certificate for the 2028 Exchange Notes and the 2032 Exchange Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Registration Rights Agreement, dated as of August 14, 2020
Registration Rights Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Form of 1.650% Regulation S Global Note due 2032
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Form of 1.650% Rule 144A Global Note due 2032
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Form of 1.300% Regulation S Global Note due 2028
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Form of 1.300% Rule 144A Global Note due 2028
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Officers Certificate, dated August 14, 2020, for the New 2028 Notes and the New 2032 Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Form of 2050 Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Form of 2030 Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Officers Certificate, dated May 8, 2020, for the 2030 Notes and the 2050 Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Underwriting Agreement, dated May 6, 2020, among QUALCOMM Incorporated, BofA Securities, Inc., Goldman Sachs & Co. LLC and J.P. Morgan Securities LLC
Underwriting Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2020
Master Confirmation Accelerated Stock Buyback, dated as of September 12, 2018, between QUALCOMM Incorporated and Morgan Stanley & Co. LLC
Stock Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2018
Master Confirmation Accelerated Stock Buyback, dated as of September 12, 2018, between QUALCOMM Incorporated and Citibank, N.A
Stock Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2018
Master Confirmation Accelerated Stock Buyback, dated as of September 12, 2018, between QUALCOMM Incorporated and Bank of America, N.A
Stock Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2018
Amendment No. 2, dated as of June 11, 2018, among QUALCOMM Incorporated, the lenders party thereto and Goldman Sachs Bank USA, as administrative agent, to the Credit Agreement...
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
2018
Registration Rights Agreement, dated as of May 31, 2018
Registration Rights Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2018
Form of 1.850% Regulation S Global Note due 2019
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2018
Form of 1.850% Rule 144A Global Note due 2019
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2018
Form of Floating Rate Regulation S Global Note due 2020
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2018
Form of Floating Rate Rule 144A Global Note due 2020
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2018
Form of Floating Rate Regulation S Global Note due 2019
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2018
Form of Floating Rate Rule 144A Global Note due 2019
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
NY
2018
Officers Certificate, dated May 31, 2018, for the New 2019 Floating Rate Notes, the New 2020 Floating Rate Notes and the New 2019 Fixed Rate Notes
Note Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
2018
Amended and Restated QUALCOMM Incorporated 2001 Employee Stock Purchase Plan, as amended
Stock Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
2018
Amendment No. 1, dated as of April 20, 2018, among QUALCOMM Incorporated, the lenders party thereto and Goldman Sachs Bank USA, as administrative agent, to the Credit Agreement...
Credit Agreements
QUALCOMM Inc.
Semiconductors & Semiconductor Equipment
2018