Hanryu Holdings, Inc. Business Finance Contracts & Agreements
24 Contracts & Agreements
- Share Agreements (2 contracts)
- Stock Agreements (5)
- Subscription Agreements (2)
- Underwriting Agreements (6)
- Warrant Agreements (9)
- Hanryu Holdings, Inc. Subscription Agreement (Filed With SEC on July 16, 2024)
- Form of Common Stock Certificate (Filed With SEC on July 16, 2024)
- Underwriting Agreement, dated July 31, 2023, by and among Hanryu Holdings, Inc. and Aegis Capital Corp (Filed With SEC on August 7, 2023)
- Underwriting Agreement, dated July 31, 2023, by and among Hanryu Holdings, Inc. and Aegis Capital Corp (Filed With SEC on August 4, 2023)
- Hanryu Bank Co., Ltd. The12th Bearer Separate Privately Placed Bond with Warrant Underwriting Agreement (Filed With SEC on July 10, 2023)
- Issuing Company: Hanryu Bank Co., Ltd. Underwriter: Midas AI Co., Ltd. Underwriting Agreement concluded on July 2, 2021 Date of Payment and Issuance: July 2, 2021 (Filed With SEC on July 10, 2023)
- Contract of acquisitionof bond with warrant (Filed With SEC on July 10, 2023)
- Bond, Stock, and Management Right TransferContract (Filed With SEC on July 10, 2023)
- Hanryu Holdings, Inc. Subscription Agreement (Filed With SEC on June 8, 2023)
- Bond with Warrant Purchase Agreement, by and between Changhyuk Kang and Donghoono Park, and Hanryu Bank Co., Ltd, dated July 2, 2021 (Filed With SEC on June 8, 2023)
- Bond with Warrant Purchase Agreement, by and between Midas AI Co., Ltd. and Hanryu Bank Co., Ltd, dated July 2, 2021 (Filed With SEC on June 8, 2023)
- Bond with Warrant Purchase Agreement, by and between La Primera Capital Investments, LLC and Hanryu Bank Co., Ltd, dated May 18, 2021 (Filed With SEC on June 8, 2023)
- Bond, Stock and Management Right Transfer Contract by and between Sewang Co., Ltd. and Hanryu Bank Co., Ltd., dated March 30, 2021 (Filed With SEC on June 8, 2023)
- Form of Underwriting Agreement (Filed With SEC on April 6, 2023)
- Bond with Warrant Purchase Agreement, by and between Changhyuk Kang and Donghoono Park, and Hanryu Bank Co., Ltd, dated July2, 2021 (Filed With SEC on January 26, 2023)
- Bond with Warrant Purchase Agreement, by and between Midas AI Co., Ltd. and Hanryu Bank Co., Ltd, dated July2, 2021 (Filed With SEC on January 26, 2023)
- Bond with Warrant Purchase Agreement, by and between La Primera Capital Investments, LLC and Hanryu Bank Co., Ltd, dated May18, 2021 (Filed With SEC on January 26, 2023)
- Form of Bond with Warrant Purchase Agreement (Filed With SEC on January 26, 2023)
- Form of Underwriter Warrant (Filed With SEC on January 26, 2023)
- Form of Common Stock Certificate (Filed With SEC on January 26, 2023)
- Bond, Stock and Management Right Transfer Contract by and between Sewang Co., Ltd. and Hanryu Bank Co., Ltd., dated June30, 2021 (Filed With SEC on January 26, 2023)
- Share Assignment Agreement, dated October3, 2021, by and between Sewang Co., Ltd., and Hanryu Bank Co., Ltd (Filed With SEC on January 26, 2023)
- Share Assignment and Management Right Transfer Agreement, dated October3, 2021, by and between Hanryu Bank Co., Ltd., and K-Commerce Co., Ltd (Filed With SEC on January 26, 2023)
- Form of Underwriting Agreement (Filed With SEC on January 26, 2023)
